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公开(公告)号：EP2787530B1
公开(公告)日：2018-08-08
申请号：EP13195139.4
申请日：2013-11-29
IPC分类号： H01L23/045 , H01L23/10 , H01L23/20 , H01L23/48 , H01L23/552 , H01L23/66
CPC分类号： H01L23/10 , H01L23/045 , H01L23/20 , H01L23/552 , H01L23/66 , H01L24/73 , H01L2224/04042 , H01L2224/05553 , H01L2224/06135 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/1515 , H01L2924/15153 , H01L2924/16152 , H01L2924/16172 , H01L2924/16176 , H01L2924/16195 , H01L2924/16251 , H01L2924/00012 , H01L2924/00
摘要： Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.
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公开(公告)号：EP2889902A4
公开(公告)日：2016-05-04
申请号：EP13832786
申请日：2013-08-09
IPC分类号： H01L23/49 , H01L23/13 , H01L23/373 , H01L23/492 , H01L25/07 , H01L25/18 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076
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公开(公告)号：EP2889902A1
公开(公告)日：2015-07-01
申请号：EP13832786.1
申请日：2013-08-09
CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076
摘要： An electric power semiconductor device includes a heat transfer plate (4) to which a heat radiation material (9) is adhered through an insulating layer (8), a printed wire board (3) that is disposed in such a way as to be spaced a predetermined gap apart from the heat transfer plate (4) and in the vicinity of an electrode strip (32) formed on the outer side of which, an opening portion (3a) is provided, a n electric power semiconductor element (2) that is disposed between the heat transfer plate (4) and the printed wire board (3) and whose rear side is adhered to the heat transfer plate (4), and a wiring member (5), one end of which is bonded to a first bonding portion of a main power electrode (21C) formed on the front side of the electric power semiconductor element (2) and the other end of which is bonded to a second bonding portion (32p); at least part of the second bonding portion (32p) is included in a space that extends from the main power electrode (21C) to the printed wire board (3) in the vertical direction, and the first bonding portion is included in a space that extends from the opening portion (3a) in the vertical direction.
摘要翻译： 本发明提供一种电力用半导体装置，其特征在于，具有：通过绝缘层（8）粘接有散热材料（9）的传热板（4）;以隔开间隔配置的印刷电路板（3） 与传热板（4）隔开预定的间隙并在形成于其外侧的电极条（32）附近设置开口部分（3a）;电功率半导体元件（2），该电功率半导体元件 （4）和印刷线路板（3）之间并且其后侧粘附到传热板（4）的布线构件（5），布线构件（5）的一端接合到第一接合件 形成于所述电力用半导体元件（2）的表面侧且另一端与第二接合部（32p）接合的主电极（21C）的一部分; 所述第二接合部（32p）的至少一部分包含在从所述主电极（21C）向所述印刷电路板（3）的铅直方向延伸的空间内，所述第一接合部包含在 从开口部分（3a）沿垂直方向延伸。
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公开(公告)号：EP2737527A2
公开(公告)日：2014-06-04
申请号：EP12817024.8
申请日：2012-07-24
发明人： SCHNEIDER, Richard , EYMARD, Eric
CPC分类号： H01L23/481 , H01L21/50 , H01L23/047 , H01L23/10 , H01L23/13 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/04042 , H01L2224/06135 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/1531 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/1659 , H01L2924/167 , H01L2924/1679 , H01L2224/45099 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： A open cavity semiconductor chip package that is leadless and does not have a metal lead frame as in conventional packages. The absence of a lead frame minimizes leakage paths and allows the novel package to be more readily fabricated as a hermetic package. A dual sided insulative or dielectric film is employed as the base interconnect between a semiconductor chip and outside contacts. Electrical connection from the top side of the film to the bottom side of the film is made through conductive micro-vias. The semiconductor chip is mounted on a paddle in a central opening in the film and wire bonded to pads on the film. After mounting of the chip, a cover or lid is attached to the film to encapsulate the assembly and maintain hermeticity of the package.
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公开(公告)号：EP2737527A4
公开(公告)日：2015-04-22
申请号：EP12817024
申请日：2012-07-24
申请人： INTERPLEX IND INC
发明人： SCHNEIDER RICHARD , EYMARD ERIC
CPC分类号： H01L23/481 , H01L21/50 , H01L23/047 , H01L23/10 , H01L23/13 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/04042 , H01L2224/06135 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/1531 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/1659 , H01L2924/167 , H01L2924/1679 , H01L2224/45099 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2924/00
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6.发明公开High-frequency semiconductor package and high-frequency semiconductor device 有权Hochfrequenzhalbleitergehäuseund Hochfrequenzhalbleitervorrichtung
公开(公告)号：EP2787530A1
公开(公告)日：2014-10-08
申请号：EP13195139.4
申请日：2013-11-29
IPC分类号： H01L23/66 , H01L23/043 , H01L23/552
CPC分类号： H01L23/10 , H01L23/045 , H01L23/20 , H01L23/552 , H01L23/66 , H01L24/73 , H01L2224/04042 , H01L2224/05553 , H01L2224/06135 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/1515 , H01L2924/15153 , H01L2924/16152 , H01L2924/16172 , H01L2924/16176 , H01L2924/16195 , H01L2924/16251 , H01L2924/00012 , H01L2924/00
摘要： Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.
摘要翻译： 某些实施例提供一种高频半导体封装，包括：由金属制成并且是接地部分的基座; 多层布线树脂基板; 第一内部导体膜; 和盖子。 多层布线树脂基板设置在基座的上表面上，并且具有框架形状，其中形成有暴露基部的顶表面的第一空腔。 第一内部导体膜覆盖形成多层布线树脂基板的顶表面的表面和第一腔的内壁表面，并与基底电连接。 将盖附接到多层布线树脂基板上，并密封并覆盖第一空腔。
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