公开(公告)号：EP2244541A1

公开(公告)日：2010-10-27

申请号：EP10172558.8

申请日：2008-02-19

申请人： SIIX Corporation

发明人： Matsushima, Yoshihiko

IPC分类号： H05K3/34 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

摘要： A surface mount circuit board includes: an insulating substrate having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members each filing a different one of the though holes; lands each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members each disposed to cover an end surface ofa different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

摘要翻译： 表面安装电路板包括：绝缘基板，其具有从绝缘基板的前后表面延伸的通孔; 高导热构件，每个填充不同的通孔; 每个设置成覆盖不同的一个高导热构件的端表面并且还覆盖围绕相应通孔的周缘的前表面的一部分; 以及热接收构件，每个热接收构件设置成覆盖不同的一个高导热构件的端表面，并且还覆盖围绕相应通孔的周缘的后表面的一部分。 每个地面可以由填充并从通孔中闪出的焊膏制成。 作为高导热构件的替代方案，线棒可以装配到相应的通孔中。

公开(公告)号：EP1962566A2

公开(公告)日：2008-08-27

申请号：EP08250573.6

申请日：2008-02-19

申请人： SIIX Corporation

发明人： Matsushima, Yoshihiko

IPC分类号： H05K1/02

CPC分类号： H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

摘要： A surface mount circuit board includes: an insulating substrate (1) having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members (12) each filing a different one of the though holes; lands (13) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members (14) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

公开(公告)号：EP2244541B1

公开(公告)日：2011-11-16

申请号：EP10172558.8

申请日：2008-02-19

申请人： SIIX Corporation

发明人： Matsushima, Yoshihiko

IPC分类号： H05K3/34 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

公开(公告)号：EP1962566B1

公开(公告)日：2011-06-15

申请号：EP08250573.6

申请日：2008-02-19

申请人： SIIX Corporation

发明人： Matsushima, Yoshihiko

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

公开(公告)号：EP1962566A3

公开(公告)日：2010-01-20

申请号：EP08250573.6

申请日：2008-02-19

申请人： SIIX Corporation

发明人： Matsushima, Yoshihiko

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K1/112 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0206 ,  H05K1/0212 ,  H05K3/3484 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10416 ,  H05K2203/0455 ,  H05K2203/1581 ,  Y10T428/24273 ,  H01L2924/00014

摘要： A surface mount circuit board includes: an insulating substrate (1) having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members (12) each filing a different one of the though holes; lands (13) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members (14) each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.

摘要翻译： 一种表面安装电路板包括：绝缘性通孔（1）的基片，每从前方到所述绝缘基板的后表面延伸; 高导热构件（12），每个备案虽然孔的不同的一个; 焊盘（13），每个设置在所述高导热性构件的不同的一个的端部表面，以覆盖并因此覆盖围绕通孔的相应的周缘的前表面的一部分; 和热接收部件（14），每个设置成覆盖孔结束的高导热性构件的一个不同的表面，从而覆盖周围通过相应的周缘的后表面的一部分。 每个国家可以由填充到焊料膏并闪蒸出的通孔的。 可替代地，以高导热部件，线材可以是通孔安装到respectivement。