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公开(公告)号：EP3360169A1
公开(公告)日：2018-08-15
申请号：EP16767434.0
申请日：2016-09-02
发明人： DIANA, Frederic S. , FANCSALI, Erno , DE SMET, Thierry , GUTH, Gregory , MARTYNOV, Yourii , SHCHEKIN, Oleg B. , BHARDWAJ, Jyoti
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/486 , H01L33/58 , H01L2933/0058
摘要： A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.
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公开(公告)号：EP3326212A1
公开(公告)日：2018-05-30
申请号：EP16745251.5
申请日：2016-06-28
申请人： Lumileds Holding B.V. , Masui, Hisashi , Shchekin, Oleg , Shimizu, Ken , Bohmer, Marcel , Jin, Frank , Bhardwaj, Jyoti
发明人： MASUI, Hisashi , SHCHEKIN, Oleg , SHIMIZU, Ken , BOHMER, Marcel , JIN, Frank , BHARDWAJ, Jyoti
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21V9/40 , F21V14/003 , G02B27/0955 , H01L33/44 , H01L33/50 , H05B33/0857 , H05B37/0209
摘要： Systems for apparatuses formed of light emitting devices. Solutions for controlling the off-state appearance of lighting system designs is disclosed. Thermochromic materials are selected in accordance with a desired off-state of an LED device. The thermochromic materials are applied to a structure that is in a light path of light emitted by the LED device. In the off-state the LED device produces a desired off-state colored appearance. When the LED device is in the on-state, the thermochromic materials heat up and become more and more transparent. The light emitted from the device in its on-state does not suffer from color shifting due to the presence of the thermochromic materials. Furthermore, light emitted from the LED device in its on-state does not suffer from attenuation due to the presence of the thermochromic materials. Techniques to select and position thermochromic materials in or around LED apparatuses are presented.
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公开(公告)号：EP3195374A1
公开(公告)日：2017-07-26
申请号：EP15770764.7
申请日：2015-09-15
CPC分类号： H01L33/60 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/58 , H01L2933/0058
摘要： Embodiments of the invention include a semiconductor light emitting diode (LED) attached to a top surface of a mount. A multi-layer reflector is disposed on the top surface of the mount adjacent to the LED. The multi-layer reflector includes layer pairs of alternating layers of low index of refraction material and high index of refraction material. A portion of the top surface in direct contact with the multi-layer reflector is non-reflective.
摘要翻译： 本发明的实施例包括附接到安装件的顶表面的半导体发光二极管（LED）。 多层反射器设置在靠近LED的支架的顶表面上。 多层反射器包括低折射率材料和高折射率材料的交替层的层对。 与多层反射器直接接触的顶面的一部分是非反射的。
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公开(公告)号：EP3326212B1
公开(公告)日：2019-08-28
申请号：EP16745251.5
申请日：2016-06-28
申请人： Lumileds Holding B.V. , Masui, Hisashi , Shchekin, Oleg , Shimizu, Ken , Bohmer, Marcel , Jin, Frank , Bhardwaj, Jyoti
发明人： MASUI, Hisashi , SHCHEKIN, Oleg , SHIMIZU, Ken , BOHMER, Marcel , JIN, Frank , BHARDWAJ, Jyoti
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公开(公告)号：EP3195374B1
公开(公告)日：2019-03-13
申请号：EP15770764.7
申请日：2015-09-15
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公开(公告)号：EP3378106B1
公开(公告)日：2019-10-02
申请号：EP16788373.5
申请日：2016-10-19
申请人： Lumileds Holding B.V. , Yu, Wen , Shchekin, Oleg B. , Wall, Franklin , Tai, Kuochou , Mala, Mohiuddin , Zona, Robert , Kmetec, Jeffrey , Nickel, Alexander
发明人： YU, Wen , SHCHEKIN, Oleg B.
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公开(公告)号：EP3378106A1
公开(公告)日：2018-09-26
申请号：EP16788373.5
申请日：2016-10-19
申请人： Lumileds Holding B.V. , Yu, Wen , Shchekin, Oleg B. , Wall, Franklin , Tai, Kuochou , Mala, Mohiuddin , Zona, Robert , Kmetec, Jeffrey , Nickel, Alexander
发明人： YU, Wen , SHCHEKIN, Oleg B.
CPC分类号： H01L33/62 , H01L24/05 , H01L24/06 , H01L25/0753 , H01L27/153 , H01L33/38 , H01L2224/05013 , H01L2924/12041
摘要： Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.
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公开(公告)号：EP3332429A1
公开(公告)日：2018-06-13
申请号：EP16741776.5
申请日：2016-07-13
申请人： Lumileds Holding B.V. , Masui, Hisashi , Shchekin, Oleg Borisovich , Shimizu, Ken , Kosowsky, Les , Davis, Ken
发明人： MASUI, Hisashi , SHCHEKIN, Oleg B. , SHIMIZU, Ken , KOSOWSKY, Les , DAVIS, Ken
CPC分类号： H01L33/46 , H01L33/0095 , H01L33/20 , H01L33/486 , H01L33/505 , H01L33/56 , H01L2933/0025 , H01L2933/0058
摘要： A semiconductor light emitting device (100;200;300;400,400B,400C;500;600;700) may have a reflective side coating (120;220;320;420;520;620;720) disposed on a sidewall (118;215;315;415,435;515) of a semiconductor light emitting device structure. Such a device may be fabricated by dicing a semiconductor structure to separate a semiconductor light emitting device structure and then forming a reflective side coating (120;220;320;420;520;620;720) on a sidewall (118;215;315;415,435;515) of the separated semiconductor light emitting device structure.
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