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1.发明公开
公开(公告)号：EP3926311A1
公开(公告)日：2021-12-22
申请号：EP20755598.8
申请日：2020-02-11
发明人： LEE, Joon Sub , EOM, Tae Hwan , LEE, Min Kyu , KIM, Hyung Won , AHN, Mi Sook
摘要： A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.
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公开(公告)号：EP2778120B1
公开(公告)日：2016-12-28
申请号：EP12847351.9
申请日：2012-11-09
发明人： HAN, Yong Hee , KIM, Hyung Won , AHN, Mi Sook
CPC分类号： B81B7/0038 , B81B7/007 , B81B2201/0207 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00269 , B81C1/00285 , B81C2203/0118 , G01P15/0802 , H01L31/02016 , H01L2224/291 , H01L2924/014
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3.发明公开
公开(公告)号：EP4261507A1
公开(公告)日：2023-10-18
申请号：EP20965197.5
申请日：2020-12-09
发明人： LEE, Joon-Sub , EOM, Tae-Hwan , LEE, Min-Kyu
摘要： An apparatus for correcting a temperature of an object using a shutter according to one embodiment of the present disclosure may comprise a temperature measurement module for measuring the temperature of the object and a temperature of the shutter, a noise temperature calculation module for calculating the temperature due to noise using the measured temperature of the shutter, and a temperature correction module for correcting the temperature of the object by subtracting the calculated temperature due to noise from the measured temperature of the object.
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公开(公告)号：EP2778120A1
公开(公告)日：2014-09-17
申请号：EP12847351.9
申请日：2012-11-09
发明人： HAN, Yong Hee , KIM, Hyung Won , AHN, Mi Sook
CPC分类号： B81B7/0038 , B81B7/007 , B81B2201/0207 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00269 , B81C1/00285 , B81C2203/0118 , G01P15/0802 , H01L31/02016 , H01L2224/291 , H01L2924/014
摘要： The present invention relates to a MEMS sensor packing and a method thereof. The MEMS sensor packaging includes: a first wafer on which on an ROIC circuit is disposed; a second wafer disposed to correspond to the first wafer and having a concave portion in one surface thereof to provide a MEMS sensor; a bonding solder disposed around the MEMS sensor to bond the first and second wafers to each other, thereby sealing the MEMS sensor; and a solder pad electrically connecting the ROIC circuit of the first wafer to the MEMS sensor of the second wafer. According to the present invention, when the wafer on which the ROIC circuit is disposed and the wafer on which the MEMS sensor is disposed are bonded to package the bonded wafers, the solder pad for electrically connecting the ROIC sensor to the MEMS sensor may be provided within the package to reduce the size of the package and stably supply an electrical signal.
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公开(公告)号：EP4261509A1
公开(公告)日：2023-10-18
申请号：EP20965198.3
申请日：2020-12-09
发明人： LEE, Joon-Sub , EOM, Tae-Hwan , LEE, Min-Kyu
摘要： An apparatus for measuring temperature of an object using compensation of board temperature according to one embodiment of the present invention may comprise: an infrared light sensor module for providing output voltage due to the infrared light emitted by an object; a board temperature compensation module for compensating the provided output voltage to the output voltage at the reference configuration temperature of the board using a first function of output voltage to board temperature obtained at a reference configuration temperature of a blackbody; and a calculation module for obtaining the temperature of the object from the compensated output voltage using a second function of temperature of the blackbody to the output voltage obtained at a reference configuration temperature of the board.
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