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公开(公告)号：EP2778120A1
公开(公告)日：2014-09-17
申请号：EP12847351.9
申请日：2012-11-09
发明人： HAN, Yong Hee , KIM, Hyung Won , AHN, Mi Sook
CPC分类号： B81B7/0038 , B81B7/007 , B81B2201/0207 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00269 , B81C1/00285 , B81C2203/0118 , G01P15/0802 , H01L31/02016 , H01L2224/291 , H01L2924/014
摘要： The present invention relates to a MEMS sensor packing and a method thereof. The MEMS sensor packaging includes: a first wafer on which on an ROIC circuit is disposed; a second wafer disposed to correspond to the first wafer and having a concave portion in one surface thereof to provide a MEMS sensor; a bonding solder disposed around the MEMS sensor to bond the first and second wafers to each other, thereby sealing the MEMS sensor; and a solder pad electrically connecting the ROIC circuit of the first wafer to the MEMS sensor of the second wafer. According to the present invention, when the wafer on which the ROIC circuit is disposed and the wafer on which the MEMS sensor is disposed are bonded to package the bonded wafers, the solder pad for electrically connecting the ROIC sensor to the MEMS sensor may be provided within the package to reduce the size of the package and stably supply an electrical signal.
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2.发明公开
公开(公告)号：EP3926311A1
公开(公告)日：2021-12-22
申请号：EP20755598.8
申请日：2020-02-11
发明人： LEE, Joon Sub , EOM, Tae Hwan , LEE, Min Kyu , KIM, Hyung Won , AHN, Mi Sook
摘要： A temperature measuring device using a thermal imaging camera according to an embodiment of the present invention may comprise: a first operation module for obtaining, for the thermal imaging camera, a curve of temperature difference versus output code difference where the X axis represents the output code difference and the Y axis represents the temperature difference indicated by a plurality of measured values; a second operation module for obtaining a function of temperature difference versus output code difference, the function curve-fitted by using the curve of temperature difference versus output code difference; and a third operation module for measuring the temperature of an object by applying the curve-fitted function of temperature difference versus output code difference.
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公开(公告)号：EP2778120B1
公开(公告)日：2016-12-28
申请号：EP12847351.9
申请日：2012-11-09
发明人： HAN, Yong Hee , KIM, Hyung Won , AHN, Mi Sook
CPC分类号： B81B7/0038 , B81B7/007 , B81B2201/0207 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00269 , B81C1/00285 , B81C2203/0118 , G01P15/0802 , H01L31/02016 , H01L2224/291 , H01L2924/014
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