Abstract:
A micromachined, monolithic silicon vane-type flow meter (20) includes a vane (28) from which inwardly projects a hinge. The hinge is provided with torsion bars (24). The hinge supports a vane (28) for rotation about the torsion bars (24). A deflection sensing means, consisting of a torsion sensor (42) incorporated into at least one of the torsion bars (24), senses deflection of the vane (28) responsive to fluid impinging thereupon. The frame (22), the torsion bars (24) and the torsion sensor (42) are all monolithically fabricated in a semiconductor single-crystal silicon layer of a substrate.
Abstract:
The present invention provides methods, apparatus and systems for protecting connections between optical cross-connect switches and client equipment. A connection failure is detected, signaled, and a switch made by the client equipment and the optical cross-connect switch to a protection connection between them so as to minimize service interruption. An out-of-band channel or an in-band channel can be used to signal the connection failure.
Abstract:
An improved micromachined structure used for beam scanners, gyroscopes, etc. includes a reference member (154, 54) from which project a first pair of axially aligned torsion bars (156, 56). A first dynamic member (54 or 52), coupled to and supported from the reference member (154, 54) by the torsion bars (156, 56), oscillates in one-dimension about the torsion bar's axis. A second dynamic member (52) may be supported from the first dynamic member (54) by a second pair of axially aligned torsion bars (56) for two-dimensional oscillation. The dynamic members (54, 52) respectively exhibit a plurality of vibrational modes each having a frequency and a Q. The improvement includes means for altering a characteristic of the dynamic member's frequency and Q. Coupling between dynamic members (54, 52) permits altering the second dynamic member's frequency and Q by techniques applied to the first dynamic member (54). Some techniques disclosed also increase oscillation amplitude or reduce driving voltage, and also increase mechanical ruggedness of the structure.
Abstract:
A topographic head (100) for profilometry and AFM supports a central paddle (108) by coaxial torsion bars (104) projecting inward from an outer frame (102). A tip (118) projects from the paddle distal from the bars. The torsion bars include an integrated paddle rotation sensor (142). An XYZ stage (200) may carry the topographic head for X, Y and Z axis translation. The XYZ stage's fixed outer base (202) is coupled to an X-axis stage (204) via a plurality of flexures (206). The X-axis stage is coupled to a Y-axis stage (212) also via a plurality of flexures (214). One of each set of flexures includes a shear stress sensor (222). A Z-axis stage (238) may also be included to provide an integrated XYZ scanning stage. The topographic head's frame, bars and paddle, and the XYZ stage's stage-base, X-axis, Y-axis and Z-axis stages, and flexures are respectively monolithically fabricated by micromachining from a semiconductor wafer (252a, 252b, 262).
Abstract:
A compact medium scanner (100) scans a surface (132) of a medium (134) with a beam of light (106). A medium transport mechanism (202, 206) advances the surface along a medium transport path through a scanning station. A light source (104) produces a collimated beam of light (106) that impinges upon a mirror plate (112) of a micromachined torsional scanner (108). A pair of coaxially aligned torsion bars (304) support the mirror plate (112) within the torsional scanner (108). A mirror-surface drive means (306, 312) rotates the mirror plate (112) about the torsion bars (304). A single reciprocation of the mirror plate (112) by the drive means (306, 312) deflects the beam of light (106) over a fan-shaped region having a virtually fixed vertex (128) on the mirror plate (112). Scanner optics (116, 122) direct the fan-shaped region beam of light (106) onto the surface (132) of the medium (134) then present in the scanning station to thereby scan across the medium (134) with the beam of light (106).
Abstract:
In one embodiment, a scalable cross-connect switching system and its corresponding method perform a bridging operation by splitting the incoming light signal into at least a first bridged light signal and a second bridged light signal. The first bridged light signal has a power level equal to or substantially greater than a power level of the second bridged light signal. The disproportionate power levels provide low-loss bridging. Light signals based on these bridged light signals are routed through multiple switch fabrics which provide redundancy in case of failure by switching within the switch fabric. To detect failures, a test access port is configured for monitoring multiple optical paths.
Abstract:
An improved micromachined structure used for beam scanners, gyroscopes, etc. includes a reference member (154, 54) from which project a first pair of axially aligned torsion bars (156, 56). A first dynamic member (54 or 52), coupled to and supported from the reference member (154, 54) by the torsion bars (156, 56), oscillates in one-dimension about the torsion bar's axis. A second dynamic member (52) may be supported from the first dynamic member (54) by a second pair of axially aligned torsion bars (56) for two-dimensional oscillation. The dynamic members (54, 52) respectively exhibit a plurality of vibrational modes each having a frequency and a Q. The improvement includes means for altering a characteristic of the dynamic member's frequency and Q. Coupling between dynamic members (54, 52) permits altering the second dynamic member's frequency and Q by techniques applied to the first dynamic member (54). Some techniques disclosed also increase oscillation amplitude or reduce driving voltage, and also increase mechanical ruggedness of the structure.
Abstract:
A micromachined, monolithic silicon vane-type flow meter (20) includes a vane (28) from which inwardly projects a hinge. The hinge is provided with torsion bars (24). The hinge supports a vane (28) for rotation about the torsion bars (24). A deflection sensing means, consisting of a torsion sensor (42) incorporated into at least one of the torsion bars (24), senses deflection of the vane (28) responsive to fluid impinging thereupon. The frame (22), the torsion bars (24) and the torsion sensor (42) are all monolithically fabricated in a semiconductor single-crystal silicon layer of a substrate.
Abstract:
A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. Torsion sensors (244) are provided along the axes of rotation to control deflection of the quadrant deflection electrodes. The shielded sensor structure (240) includes a silicon layer (241), an insulating layer (242) and a metal layer (243). The structure further includes a sensor implant resistor (244) in the silicon layer (241) and a shield (245) that is applied over the sensor implant resistor (244) to stabilise sensor output and eliminate light sensitivity.
Abstract:
A topographic head (100) for profilometry and AFM supports a central paddle (108) by coaxial torsion bars (104) projecting inward from an outer frame (102). A tip (118) projects from the paddle distal from the bars. The torsion bars include an integrated paddle rotation sensor (142). An XYZ stage (200) may carry the topographic head for X, Y and Z axis translation. The XYZ stage's fixed outer base (202) is coupled to an X-axis stage (204) via a plurality of flexures (206). The X-axis stage is coupled to a Y-axis stage (212) also via a plurality of flexures (214). One of each set of flexures includes a shear stress sensor (222). A Z-axis stage (238) may also be included to provide an integrated XYZ scanning stage. The topographic head's frame, bars and paddle, and the XYZ stage's stage-base, X-axis, Y-axis and Z-axis stages, and flexures are respectively monolithically fabricated by micromachining from a semiconductor wafer (252a, 252b, 262).