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190 条记录 (耗时 0.019 秒)

    A dual stage instrument for scanning a specimen
    4.
    发明公开
    A dual stage instrument for scanning a specimen 失效
    仪器mit Doppeltisch zum Abtasten einesProbenkörpers

    公开(公告)号：EP1574815A2

    公开(公告)日：2005-09-14

    申请号：EP05011576.5

    申请日：1997-02-07

    申请人： TENCOR INSTRUMENTS

    发明人： Samsavar, Amin ,  Wheeler, William R. ,  Eaton, Steven Glen ,  Zhuang, Jian-Ping

    IPC分类号： G01B7/34 ,  G01N27/00

    CPC分类号： G01Q10/04 ,  G01B3/008 ,  G01B7/34 ,  G01Q10/02 ,  G01Q30/02 ,  G01Q70/06 ,  Y10S977/834 ,  Y10S977/849 ,  Y10S977/852 ,  Y10S977/867 ,  Y10S977/868 ,  Y10S977/872 ,  Y10S977/874

    摘要： A dual stage scanning instrument includes a sensor (60) for sensing a parameter of a sample (90) and coarse and fine stages (80,70) for causing relative motion between the sensor (60) and the sample (90). The coarse stage (80) has a resolution of about 1 micrometer and the fine stage (70) has a resolution of 1 nanometer or better. The sensor (60) is used to sense the parameter when both stages cause relative motion between the sensor assembly (60) and the sample (90). The sensor (60) may be used to sense height variations of the sample surface as well as thermal variations, electrostatic, magnetic, light reflectivity or light transmission parameters at the same time when height variation is sensed. By performing a long scan at a coarser resolution and short scans at high resolution using the same probe tips at fixed relative positions, data obtained from the long and short scans can be correlated accurately.

    摘要翻译： 双级扫描仪器包括用于感测样品（90）的参数的传感器（60）和用于引起传感器（60）和样品（90）之间的相对运动的粗细级（80,70）。 粗级（80）具有约1微米的分辨率，细级（70）的分辨率为1纳米或更好。 当两个阶段在传感器组件（60）和样本（90）之间引起相对运动时，传感器（60）用于感测参数。 传感器（60）可以用于在感测到高度变化的同时感测样品表面的高度变化以及热变化，静电，磁性，光反射率或光透射参数。 通过使用相同的探针尖端在固定的相对位置以较粗分辨率和高分辨率的短扫描进行长扫描，可以准确地相关联从长扫描和短扫描获得的数据。

    Head, apparatus and method for the linear dimension checking of mechanical pieces
    8.
    发明公开
    Head, apparatus and method for the linear dimension checking of mechanical pieces 有权
    用于检查工件的线性尺寸头，装置和方法

    公开(公告)号：EP1336816A3

    公开(公告)日：2003-10-15

    申请号：EP03008236.6

    申请日：1999-02-26

    申请人： MARPOSS SOCIETA' PER AZIONI

    发明人： Dall'aglio, Carlo ,  Ventura, Luciano

    IPC分类号： G01B5/00 ,  G01B7/00 ,  G01B7/12 ,  G01B3/00 ,  G01B7/012 ,  G01B7/34 ,  H01R13/627 ,  H01R13/629 ,  H01R13/639

    CPC分类号： G01B5/0004 ,  B24B49/04 ,  G01B3/008 ,  G01B7/001 ,  G01B7/012 ,  G01B7/12 ,  G01B7/34 ,  G01D3/022

    摘要： A head for the linear dimension checking of mechanical pieces including a casing, an arm carrying a feeler for touching a surface of the mechanical piece to be checked, a fulcrum, coupled to the casing and the arm, for enabling displacements of the arm with respect to the casing and a transducer for providing signals depending on the position of the arm with respect to the casing. The head has specific flexibility and modularity features, thanks to the possibility of operating from the exterior for adjusting and replacing various components. The transducer is of the inductive, half-bridge type, with multiple windings. An integral element for the electric connection to a processing unit includes the windings of the transducer, a cable and a connector, and the latter comprises a rapid locking/unlocking device. The ends of the cable are connected between the windings of the transducer and the connector by means of an over-moulding process of a plastic material. A checking apparatus, including at least a gauging or measuring head, includes a stationary structure and at least a support structure for the head, coupled to the stationary structure in an adjustable and removable way.

    METHOD AND APPARATUS FOR OBTAINING IMPROVED VERTICAL METROLOGY MEASUREMENTS
    9.
    发明公开
    METHOD AND APPARATUS FOR OBTAINING IMPROVED VERTICAL METROLOGY MEASUREMENTS 审中-公开
    方法和设备得到改良垂直测

    公开(公告)号：EP1025416A1

    公开(公告)日：2000-08-09

    申请号：EP98951955.8

    申请日：1998-09-23

    申请人： VEECO INSTRUMENTS INC.

    发明人： BABCOCK, Kenneth, L. ,  ELINGS, Virgil, B. ,  GURLEY, John, A. ,  KJOLLER, Kevin

    IPC分类号： G01B5/28

    CPC分类号： G01Q10/06 ,  G01B7/34 ,  G01Q30/04 ,  Y10S977/852

    摘要： A probe-based surface characterization or metrology instrument accounts for errors in the vertical positioning of its probe and errors in detecting the vertical position of its probe. These errors are accounted for by subtracting reference scan data from measurement scan data. The measurement scan data is obtained from an area that includes the feature of interest as well as a portion of a reference area that includes the feature of interest, as well as a portion of the reference area which is featureless. The reference scan data is obtained from an area that includes the reference area and that, preferably, excludes the features of interest. This procedure is particularly well-suited for measuring pole tip recession in a magnetic head.

    INTEGRATED SILICON PROFILOMETER AND AFM HEAD
    10.
    发明公开
    INTEGRATED SILICON PROFILOMETER AND AFM HEAD 失效
    集成硅PROFILE刀和GRID PROBE

    公开(公告)号：EP0868648A4

    公开(公告)日：2000-03-01

    申请号：EP96943712

    申请日：1996-12-10

    申请人： XROS INC

    发明人： NEUKERMANS ARMAND P ,  SLATER THIMOTHY G

    IPC分类号： G01B21/30 ,  G01B7/34 ,  G01Q20/04 ,  G01Q60/38 ,  G01Q70/02 ,  G01N27/00

    CPC分类号： G01Q60/38 ,  G01B7/34 ,  G01Q20/04 ,  H01L41/0926 ,  H01L41/094 ,  H02N2/028

    摘要： A topographic head (100) for profilometry and AFM supports a central paddle (108) by coaxial torsion bars (104) projecting inward from an outer frame (102). A tip (118) projects from the paddle distal from the bars. The torsion bars include an integrated paddle rotation sensor (142). An XYZ stage (200) may carry the topographic head for X, Y and Z axis translation. The XYZ stage's fixed outer base (202) is coupled to an X-axis stage (204) via a plurality of flexures (206). The X-axis stage is coupled to a Y-axis stage (212) also via a plurality of flexures (214). One of each set of flexures includes a shear stress sensor (222). A Z-axis stage (238) may also be included to provide an integrated XYZ scanning stage. The topographic head's frame, bars and paddle, and the XYZ stage's stage-base, X-axis, Y-axis and Z-axis stages, and flexures are respectively monolithically fabricated by micromachining from a semiconductor wafer (252a, 252b, 262).