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公开(公告)号:EP2622265A4
公开(公告)日:2017-07-12
申请号:EP11829734
申请日:2011-08-26
发明人: HARMS MICHAEL R , BEHYMER LANCE E , WILHELM JUSTIN W , SMEENK LARS A , SMITH MARK H , AGUIRRE LUIS A , BIERBAUM FELIX B , STENSVAD KARL K
CPC分类号: G02B1/043 , F21V3/026 , F21V5/002 , F21V5/005 , G02B5/0231 , G02B5/0273 , G02B5/0294 , G02B5/3025
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公开(公告)号:EP3162172A4
公开(公告)日:2018-02-28
申请号:EP15814407
申请日:2015-06-26
发明人: STAY MATTHEW S , SMITH MATTHEW R , PEKUROVSKY MIKHAIL L , STRAND JOHN T , DAVID MOSES M , JERRY GLEN A , STARKEY JAMES R , KAWAKAMI ELLISON , STENSVAD KARL K
CPC分类号: H05K3/048 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0274 , H05K1/028 , H05K3/06 , H05K3/22 , H05K2201/0108 , H05K2201/09681 , H05K2203/0108 , H05K2203/095 , H05K2203/11
摘要: Electrically conductive patterns formed on a substrate are provided with a reduced visibility. A region of a major surface of the substrate is selectively roughened to form a roughened pattern on the major surface of the substrate. Electrically conductive traces are directly formed on the roughened region and are conformal with the roughened pattern on the major surface of the substrate.
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3.INJECTION MOLDING APPARATUS AND METHOD COMPRISING A MOLD CAVITY SURFACE COMPRISING A THERMALLY CONTROLLABLE ARRAY 审中-公开
标题翻译: 注塑和工艺与热可控阵列的表单腔面公开(公告)号:EP2879855A4
公开(公告)日:2016-01-27
申请号:EP13826245
申请日:2013-06-26
发明人: STENSVAD KARL K , RENDON STANLEY , KIDANE SAMUEL
CPC分类号: B29C45/7306 , B29C45/73 , B29C45/76 , B29C2033/023 , B29C2045/7343 , B29C2045/7368 , B29K2995/0013 , B29L2031/00
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4.METHOD AND APPARATUS FOR APPLYING A STAMP FOR MICRO-CONTACT PRINTING TO A STAMPING ROLL 有权
标题翻译: 方法和设备,可申请MICRO接触压力的STAMP一滚PUNCHING公开(公告)号:EP2755821A4
公开(公告)日:2015-07-15
申请号:EP12831626
申请日:2012-09-14
发明人: STENSVAD KARL K , O'HARE JONATHAN J
CPC分类号: B41F7/20 , B41F17/00 , B41F27/005 , B41F27/1275 , B41F33/00 , Y10T156/10 , Y10T156/17
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