ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME
    2.
    发明公开
    ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME 审中-公开
    维多利亚ZU IHRER HERSTELLUNG的BELEUCHTUNGSANORDNUNGEN

    公开(公告)号:EP2069842A1

    公开(公告)日:2009-06-17

    申请号:EP07814735.2

    申请日:2007-09-07

    IPC分类号: G02B6/12 G02B6/42

    摘要: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

    摘要翻译: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层,第一绝缘体层,其设置在第一导体层上,并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层,设置在第一绝缘体层上并具有 至少一个第二孔,通过第二导体层限定在其中并被定位成与至少一个第一孔对准;以及光操纵层,其设置在第二导体层上并且具有通过光操纵层限定在其中的至少一对孔,包括 第三孔和第四孔,其中所述第三孔定位成与所述至少一个第二孔和第一孔对准。

    ILLUMINATION DEVICE AND METHODS FOR MAKING THE SAME
    3.
    发明公开
    ILLUMINATION DEVICE AND METHODS FOR MAKING THE SAME 审中-公开
    BELEUCHTUNGSVORRICHTUNG UND HERSTELCHUNGSVERFAHRENDAFÜR

    公开(公告)号:EP1877696A1

    公开(公告)日:2008-01-16

    申请号:EP06784324.3

    申请日:2006-03-10

    IPC分类号: F21K7/00 F21S4/00

    CPC分类号: F21K9/00

    摘要: The present disclosure is generally directed to illumination devices, and particularly directed to illumination devices utilizing light transmissive layers and methods for making the same. An illumination device and method for making the device are disclosed. The device, in particular, includes a substrate and conductive region disposed on the substrate. One or more light sources, such as LEDs, are disposed on a surface of the substrate and electrically coupled to the electrically conductive region for supply of electric current. The device also includes one or more light transmissive layers disposed on the substrate and the at least one light source to encapsulate light sources and also to control characteristics of light delivery from the light sources as light passes through the light transmissive layers.

    摘要翻译: 本公开一般涉及照明装置,并且特别涉及利用透光层的照明装置及其制造方法。 公开了一种用于制造该装置的照明装置和方法。 该装置特别地包括设置在基板上的基板和导电区域。 一个或多个光源(例如LED)设置在衬底的表面上并电耦合到导电区域以供应电流。 该装置还包括设置在基板上的一个或多个透光层和用于封装光源的至少一个光源,并且还用于当光通过透光层时控制来自光源的光的传输特性。

    THERMALLY CONDUCTIVE LED ASSEMBLY
    6.
    发明授权
    THERMALLY CONDUCTIVE LED ASSEMBLY 有权
    THERMISCHLEITFÄHIGELED-BAUGRUPPE

    公开(公告)号:EP2082440B1

    公开(公告)日:2014-04-16

    申请号:EP07842482.7

    申请日:2007-09-14

    摘要: A thermally conductive LED assembly is disclosed. The thermally conductive LED assembly includes an elongate conductor cable having a first conductor and a second conductor extending along a length of the elongate conductor cable and a thermally conducting and electrically insulating polymer layer disposed between first conductor and second conductor and a second electrically insulating polymer layer is disposed on the first conductor or second conductor. The electrically insulating polymer layer having a thermal impedance value in a range from 2.5 to 15 C.°-cm2/W and a plurality of light emitting diodes are disposed along the length of the elongate conductor cable. Each light emitting diode is in electrical communication with the first conductor and the second conductor.

    摘要翻译: 公开了导热LED组件。 导热LED组件包括细长的导体电缆,其具有沿细长导体电缆的长度延伸的第一导体和第二导体,以及设置在第一导体和第二导体之间的导热和电绝缘的聚合物层和第二电绝缘聚合物层 设置在第一导体或第二导体上。 沿着细长导体电缆的长度设置热阻抗值在2.5至15℃±cm 2 / W范围内的电绝缘聚合物层和多个发光二极管。 每个发光二极管与第一导体和第二导体电连通。