公开(公告)号：EP2386791B1

公开(公告)日：2018-04-18

申请号：EP11166093.2

申请日：2011-05-13

Applicant: LG Innotek Co., Ltd.

Inventor： Jin, Hong Boem ,  Kim, Han Cheol

IPC: F21Y115/10 ,  F21K9/00 ,  H05K1/02 ,  H05K1/05 ,  H05B33/08 ,  F21K9/27 ,  F21Y103/10

CPC classification number: H05K1/0295 ,  F21K9/00 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0803 ,  H05K1/0209 ,  H05K1/05 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/173

Abstract: A light emitting device array is provided comprising a printed circuit board on which a plurality of electrode patterns having the same width is formed, a light emitting device package disposed on a predetermined number of electrode patterns and a power supply line disposed on at least one of the remaining electrode pattern except for the predetermined number of electrode patterns.

公开(公告)号：EP2699065A4

公开(公告)日：2014-08-13

申请号：EP12866412

申请日：2012-06-18

Applicant: SANYO ELECTRIC CO

Inventor： SAITO TAKAO

IPC: H05K1/02

CPC classification number: H05K1/0263 ,  H05K3/222 ,  H05K3/3447 ,  H05K2201/0305 ,  H05K2201/10363

公开(公告)号：EP2309521B1

公开(公告)日：2013-02-27

申请号：EP09171375.0

申请日：2009-09-25

Applicant: Arcus Elektrotechnik Alois Schiffmann GmbH

Inventor： Wild, Manuel ,  Lasinger, Fritz

IPC: H01C1/16 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K1/16 ,  H05K1/14

CPC classification number: H01C1/16 ,  H05K1/0286 ,  H05K1/141 ,  H05K1/142 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09263 ,  H05K2201/09963 ,  H05K2201/10303 ,  H05K2201/10363

公开(公告)号：EP2166824A1

公开(公告)日：2010-03-24

申请号：EP09170571.5

申请日：2009-09-17

Applicant: JTEKT CORPORATION

Inventor： Nakai, Motoo

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/22 ,  G01R19/00 ,  B62D5/00 ,  H05K3/46

CPC classification number: H05K3/222 ,  G01R19/0092 ,  H05K1/0224 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4611 ,  H05K2201/0792 ,  H05K2201/0969 ,  H05K2201/10022 ,  H05K2201/1028 ,  H05K2201/10363 ,  Y02P70/611

Abstract: A multilayer circuit board (100) serving as a motor driving circuit board is structured such that conductors of a first layer (110), a second layer (120), a third layer (130), and a fourth layer (140), which serve as conductor layers provided below an empty space to be occupied by a sealing material (170) when the sealing material (170) is charged onto a lower surface of a shunt resistor (12) serving as an electronic component having a large conductor surface, do not exist in a part facing the empty space. With this structure, it is possible to ensure that a capacitor is not formed between the circuit board (100) and the shunt resistor (12) without the need for an inflow prevention tool.
As a result, an accurate current detection signal can be obtained reliably.

Abstract translation: 用作电动机驱动电路板的多层电路板（100）被构造为使得第一层（110），第二层（120），第三层（130）和第四层（140）的导体 当将密封材料（170）充电到具有大的导体表面的电子部件的分流电阻器（12）的下表面上时，用作设置在空的空间下方以被密封材料（170）占据的导体层， 不存在于面向空白空间的部分。 利用这种结构，可以确保在电路板（100）和分流电阻（12）之间不形成电容器，而无需流入防止工具。 结果，可以可靠地获得准确的电流检测信号。

公开(公告)号：EP2109349A1

公开(公告)日：2009-10-14

申请号：EP08103866.3

申请日：2008-05-08

Applicant: Mediatek Inc.

Inventor： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC: H05K1/02 ,  H01L23/66 ,  H05K3/46

CPC classification number: H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board (500a-d) is disclosed. The printed circuit board comprises a substrate (200) having a top surface (202) and a bottom surface (203). A ground plane (228) is on the bottom surface. A first signal trace (212a) is on the top surface along a first direction. At least two isolated power planes (208, 210) are on the top surface adjacent to opposite sides of the first signal trace, respectively. A conductive connection (216) along a second direction couples to the two power planes, across the first signal trace (212a) without electrically connecting to the signal trace, wherein the first signal trace (212a) doesn't directly pass over any split of the ground plane (228).

Abstract translation: 公开了一种印刷电路板（500a-d）。 印刷电路板包括具有顶表面（202）和底表面（203）的基底（200）。 接地平面（228）位于底面。 第一信号迹线（212a）沿着第一方向在顶表面上。 至少两个隔离电源平面（208,210）分别位于与第一信号迹线的相对侧相邻的顶表面上。 沿着第二方向的导电连接（216）跨过第一信号迹线（212a）耦合到两个电源层，而不电连接到信号迹线，其中第一信号迹线（212a）不直接通过 地面（228）。

公开(公告)号：EP1487247B1

公开(公告)日：2006-10-11

申请号：EP04291459.8

申请日：2004-06-10

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Naitou, Tsutomu Sumitomo Wiring Systems, Ltd. ,  Oka, Tatsuya Sumitomo Wiring Systems, Ltd.

IPC: H05K5/00

CPC classification number: H05K7/026 ,  H01R12/52 ,  H01R12/523 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10363 ,  Y10S439/949

公开(公告)号：EP0800711B1

公开(公告)日：2001-02-14

申请号：EP96934287.2

申请日：1996-10-24

Applicant: Reichle + De-Massari AG Elektro-Ingenieure

Inventor： REICHLE, Hans

IPC: H01R12/08 ,  H01R12/24

CPC classification number: H05K1/118 ,  H01R12/777 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/029 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10189 ,  H05K2201/10363

Abstract: In a contact device with a plurality of mutually remote and interconnected contact points, the contact points are connected by means of strip-like, flexible conductive track foils in which at least partly electrically separable contact points are connected through via a plurality of at least partly parallel conductive tracks on the foil and in which conductive track sections form direct plug contacts in plug-in regions of modular plug and/or socket devices of the connection device.

公开(公告)号：EP0876691B1

公开(公告)日：2000-04-05

申请号：EP96933660.1

申请日：1996-10-21

Applicant: Koninklijke Philips Electronics N.V.

Inventor： GODIJN, Paul, Willem ,  OUD, Martinus, Adrianus ,  DEKKER, Jan ,  WELLING, Antonius, Johannes ,  DE KEIZER, Johannes, Cornelis

IPC: H01R12/04 ,  H01R12/32

CPC classification number: H01R12/526 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10363 ,  H05K2201/10984

Abstract: The invention relates to a solder element for making electrically conducting connections on either side of a printed circuit board, comprising an electrically conducting wire which is provided with at least one body composed of solder material and flux material, wherein the body is preferably composed of solder material and provided with a recess in which the flux material is received, or the flux material is preferably accommodated between two bodies of solder material arranged on the wire.

公开(公告)号：EP0774799B1

公开(公告)日：1999-11-24

申请号：EP96830484.0

申请日：1996-09-27

Applicant: CAVIS S.r.l.

Inventor： Colombo, Paolo, c/o Cavis S.r.l.

IPC: H01R9/07 ,  H05K1/00

CPC classification number: H01R12/62 ,  H01R12/52 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/096 ,  H05K2201/10295 ,  H05K2201/10363

公开(公告)号：EP0601900A1

公开(公告)日：1994-06-15

申请号：EP93402669.1

申请日：1993-10-29

Applicant: THOMSON-CSF

Inventor： Leilde, Jean-Yves, Thomson-CSF

IPC: H05K13/08 ,  G01R31/28

CPC classification number: G01R31/2801 ,  H05K3/222 ,  H05K3/4015 ,  H05K13/08 ,  H05K2201/10363

Abstract: Le dispositif est réalisé dans un matériau rigide et conducteur électrique dont la forme permet de fixer le dispositif sur au moins une plage métallisée (4 ; 5) à la surface d'une carte de circuit imprimé (3) comme un CMS (6) et d'accrocher une sonde de test standard dans plusieurs directions autour du dispositif, et dont les dimensions (h, I, L) sont compatibles à celles des CMS (6).
L'invention s'applique au test manuel des cartes de circuit imprimé équipées de CMS.

Abstract translation: 该器件由刚性和导电材料制成，其形状使得可以将器件固定在印刷电路卡（3）的表面上的至少一个金属化区域（4; 5），如SMC（ 6），并在设备周围的多个方向附加标准测试探针，其尺寸（h，I，L）与SMC（6）的尺寸相兼容。 本发明适用于配备有SMC的印刷电路板的手动测试。