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公开(公告)号：EP2332674A4
公开(公告)日：2017-03-08
申请号：EP09817522
申请日：2009-10-02
发明人： IWAYAMA ISAO , NAKAI YOSHIHIRO , NISHIKAWA TAICHIRO , TAKAKI YOSHIYUKI , KUSAKARI MISATO , IKEDA TOSHIYA
IPC分类号： B22D19/00 , B22D19/04 , B22D19/14 , B32B15/01 , C09K5/14 , C22C1/10 , C22C29/02 , C22C29/06 , C22C32/00 , H01L23/373
CPC分类号： C09K5/14 , B22D19/14 , B22F2998/00 , B32B15/01 , C22C1/1036 , C22C1/1068 , C22C29/02 , C22C29/065 , C22C32/00 , C22C32/0063 , H01L23/3733 , H01L23/3736 , H01L23/3738 , H01L2924/0002 , Y10T428/12049 , Y10T428/12576 , Y10T428/24355 , Y10T428/24479 , Y10T428/249969 , Y10T428/259 , B22F1/02 , H01L2924/00
摘要： A composite member suitable for a heat radiation member of a semiconductor element and a method of manufacturing the same are provided. This composite member is a composite of magnesium or a magnesium alloy and SiC, and it has porosity lower than 3 %. This composite member can be manufactured by forming an oxide film on a surface of raw material SiC, arranging coated SiC having the oxide film formed in a cast, and infiltrating this coated SiC aggregate with a molten metal (magnesium or the magnesium alloy). The porosity of the composite member can be lowered by improving wettability between SiC and the molten metal by forming the oxide film. According to this manufacturing method, a composite member having excellent thermal characteristics such as a coefficient of thermal expansion not lower than 4 ppm/K and not higher than 10 ppm/K and thermal conductivity not lower than 180 W/m—�K can be manufactured.
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公开(公告)号：EP2690186A4
公开(公告)日：2015-07-15
申请号：EP12760529
申请日：2012-02-20
CPC分类号： C22C29/065 , B22F2999/00 , C04B41/009 , C04B41/515 , C04B41/88 , C04B2111/00844 , C22C2001/1073 , C22C2204/00 , C25D7/12 , H01L23/15 , H01L23/34 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , Y10T428/24612 , Y10T428/2495 , Y10T428/263 , B22F3/02 , B22F3/10 , B22F3/26 , C25D7/00 , C23C18/00 , H01L2924/00 , C04B35/565 , C04B38/00 , C04B41/4523
摘要： A composite member (1a) has a substrate (2) made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10 -3 and not more than 10×10 -3 , the warpage degree being defined as 1max/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member 1a measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
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公开(公告)号：EP3190613A4
公开(公告)日：2018-05-02
申请号：EP15837587
申请日：2015-09-01
IPC分类号： H01L23/36 , B22F3/14 , C22C1/05 , H01L23/373 , H05K7/20
CPC分类号： H01L23/3735 , B22F3/14 , B22F3/16 , B22F2301/255 , B22F2304/10 , C22C1/05 , F28F21/00 , F28F21/089 , H01L21/4871 , H01L23/3732 , H01L2924/0002 , H05K7/20 , H01L2924/00
摘要： Provided are a heat radiating member allowing a semiconductor element to be bonded with high bondability to a surface of a composite portion composed of a composite material, and a method for producing the same. A heat radiating member includes: a composite portion composed of a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; and a metal layer formed on at least one surface of the composite portion and composed of a metal. A method for producing a heat radiating member includes: a preparation step to prepare a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; a powder arrangement step to dispose a metal powder composed of metal particles on at least one surface of the composite material; and a heating step to heat the composite material and the metal powder, with the metal powder disposed on the composite material, to form a metal layer composed of a metal of the metal powder on a composite portion composed of the composite material.
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公开(公告)号：EP2554689A4
公开(公告)日：2018-04-04
申请号：EP11765343
申请日：2011-03-16
IPC分类号： C22C1/10 , C22C23/00 , C22C23/02 , C22C23/04 , C22C29/02 , C22C29/06 , H01L23/373 , H01L23/40
CPC分类号： C22C1/1068 , B22F3/11 , C22C1/1015 , C22C23/00 , C22C23/02 , C22C29/065 , C22C29/067 , C22C47/06 , C22C49/04 , C22C49/14 , H01L23/3733 , H01L23/3736 , H01L23/4006 , H01L2924/0002 , Y10T428/12007 , Y10T428/12361 , H01L2924/00
摘要： A magnesium-based composite member (1A) is provided with a through hole (20A) through which a fastening member (100) for attachment to a fixing target is to be inserted. A substrate (10) is provided with a substrate hole (21) through which the fastening member (100) is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion (22) is attached to the substrate (10) and made of a metal material different from the matrix metal. The receiving portion (22) is provided with a receiving portion hole (22h) through which the fastening member (100) is to be inserted, and at least a part of an inner circumferential surface of the through hole (20A) is formed from an inner circumferential surface of the receiving portion hole (22h).
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