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公开(公告)号：EP3511444B1
公开(公告)日：2020-07-22
申请号：EP18151803.6
申请日：2018-01-16
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公开(公告)号：EP3511444A1
公开(公告)日：2019-07-17
申请号：EP18151803.6
申请日：2018-01-16
发明人： Llavona-Serrano, Angela , Bangerter, Timo , Mann, Dr. Olivier , Cebulla, Pamela , Brunner, Dr. Heiko , Ackermann, Dr. Stefanie , Haubner, Kinga , Froese, Bernd
IPC分类号： C25D3/38 , C25D3/58 , C08G59/50 , C08G65/26 , C08G65/333 , C25D3/12 , C25D3/22 , C25D3/32 , C25D3/46 , C25D3/48 , C25D3/52 , C25D3/56 , C25D3/60 , C25D3/62 , C25D3/64
摘要： The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
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公开(公告)号：EP4056285A1
公开(公告)日：2022-09-14
申请号：EP21162411.9
申请日：2021-03-12
发明人： Belova-Magri, Valentina , Ackermann, Stefanie , Froese, Bernd , Haarmann, Philipp , Thoms, Martin , Lützow, Norbert , Knaup, Jan , Königsmann, Tatjana
摘要： The present invention relates to a specific triazine silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific triazine silane compound, and the use of said working solution as a surface treatment solution.
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4.发明公开Silane compositions comprising novel crosslinking agents 审中-公开Silan-Zusammensetzungen mit neuen Vernetzungsmitteln
公开(公告)号：EP1978024A1
公开(公告)日：2008-10-08
申请号：EP07105660.0
申请日：2007-04-04
CPC分类号： B32B7/04 , B32B15/14 , B32B15/20 , B32B27/04 , B32B27/26 , C08G77/04 , C09J4/00 , H05K3/244 , H05K3/389
摘要： The invention provides silane compositions which are useful as adhesives, in particular in the preparation of multi-layer laminates such as printed circuit boards. The silane compositions comprise at least one coupling agent selected from the group consisting of (A-1) a silane coupling agent of the formula A (4-x) SiB x (wherein A is a hydrolyzable group, x is 1 to 3, and B is as defined in the description); (A-2) a silane coupling agent of the formula X-{B-[R-Si(A) 3 ] z } x (wherein X is a linear or branched hydrocarbon chain containing from 5 to 10 carbon atoms, B is a divalent or trivalent hetero atom, A is a hydrolyzable group and R, z and x are as defined in the description); (A-3) a tetraorgano silane coupling agent of the formula Si(OR) 4 (wherein R is hydrogen, alkyl, aryl, aralkyl, allyl or alkenyl); and (A-4) a water soluble silicate coupling agent characterized by the formula SiO 2 • x M 2 O (wherein x is 1 to 4, and M is an alkali metal or ammonium ion); and (B) a colloidal silica; with the proviso that (a) said colloidal silica (B) is optional if at least one of compounds (A-3) or (A-4) is present; and (b) said colloidal silica (B) is mandatory if none of compounds (A-3) or (A-4) is present. The invention further provides the use of such silane compositions for the production of multilayer circuit boards and the multilayer circuit boards thus obtained.
摘要翻译： 本发明提供了可用作粘合剂的硅烷组合物，特别是制备多层层压材料如印刷电路板的硅烷组合物。 硅烷组合物包含至少一种选自（A-1）式（A-1）硅烷偶联剂（4-x）SiB x（其中A为可水解基团，x为1至3）和 B如说明书中所定义）; （A-2）式X- {B- [R-Si（A）3] z} x的硅烷偶联剂（其中X为含有5至10个碳原子的直链或支链烃链，B为 二价或三价杂原子，A是可水解基团，R，Z和x如说明书中所定义）; （A-3）式Si（OR）4（其中R是氢，烷基，芳基，芳烷基，烯丙基或烯基）的四有机硅烷偶联剂; 和（A-4）水溶性硅酸盐偶联剂，其特征在于式SiO 2€¢x M 2 O（其中x为1至4，M为碱金属或铵离子）; 和（B）胶体二氧化硅; 条件是（a）如果存在化合物（A-3）或（A-4）中的至少一种，则所述胶体二氧化硅（B）是任选的; 和（b）如果不存在化合物（A-3）或（A-4），则所述胶体二氧化硅（B）是强制性的。 本发明还提供了这样的硅烷组合物用于制造如此获得的多层电路板和多层电路板的用途。
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