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公开(公告)号：EP4273303A1
公开(公告)日：2023-11-08
申请号：EP22171849.7
申请日：2022-05-05
发明人： Kühne, Sebastian , Laudien, Ulrich , Kaczmarek, Michal , Dziurun, Marta , Richter, Richard , Brunner, Heiko , Leonhard, Steven , Freese, Thomas
摘要： The present invention relates to a method for depositing a zinc-nickel alloy on a substrate, particularly to a method for electrolytically depositing a zinc-nickel alloy on a substrate, wherein a zinc-nickel deposition bath is utilized as a catholyte comprising at least one brightening agent, wherein the at least one brightening agent has a source which is substantially free of, preferably does not comprise, halogen anions. The present invention furthermore relates to a respective aqueous zinc-nickel deposition bath, a respective brightening agent, and a respective use of said brightening agent for replenishing in an aqueous zinc-nickel deposition bath.
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公开(公告)号：EP3296428A1
公开(公告)日：2018-03-21
申请号：EP16189278.1
申请日：2016-09-16
发明人： Bernhard, Tobias , Peter, Anna , Merschky, Michael , Brüning, Frank , Bilkay, Taybet , Brunner, Heiko
CPC分类号： C23C18/1216 , C23C18/165 , C23C18/1893 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455
摘要： The present invention relates to a method for providing a multilayer coating on a surface of a substrate comprising the following method steps
(i) providing the substrate;
(ii) depositing at least one metal oxide compound onto the surface of the substrate;
(iii) heat-treating the surface of the substrate such that a metal oxide is formed thereon;
(iv) treating the surface of the substrate with a treatment solution comprising at least one nitrogen containing polymeric treatment additive;
(v) treating the surface of the substrate with an activation solution; and
(vi) treating the surface of the substrate with a metallising solution such that a metal or metal alloy is deposited thereon.
The invention further concerns the use of treatment additives as enhancer for the metal deposition.摘要翻译： 本发明涉及一种在基底表面上提供多层涂层的方法，包括以下方法步骤（i）提供基底; （ii）将至少一种金属氧化物化合物沉积到基底的表面上; （iii）热处理衬底的表面，使得在其上形成金属氧化物; （iv）用包含至少一种含氮聚合物处理添加剂的处理溶液处理基材表面; （v）用活化溶液处理基底的表面; 和（vi）用金属化溶液处理基底的表面，使得金属或金属合金沉积在其上。 本发明还涉及处理添加剂作为金属沉积的增强剂的用途。
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3.发明授权Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen 有权Pyrophosphathaltiges浴铜 - 锡合金的无氰沉积
公开(公告)号：EP2130948B1
公开(公告)日：2010-12-22
申请号：EP08010058.9
申请日：2008-06-02
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4.发明公开Metal plating composition for deposition of tin-zinc alloys onto a substrate 审中-公开Metallplattierungszusammensetzung zur Beschichtung von Blechzinklegierungen auf einem Substrat
公开(公告)号：EP2175048A1
公开(公告)日：2010-04-14
申请号：EP08166465.8
申请日：2008-10-13
发明人： Dambrowsky, Nina , Brunner, Heiko , Bedrnik, Lukas , Kriz, Vaclav
摘要： A tin-zinc alloy plating bath composition comprising a quaternary ammonium polymer additive. A process for deposition of tin-zinc alloys from a plating bath composition comprising a quaternary ammonium plating additive onto a substrate.
摘要翻译： 一种包含季铵聚合物添加剂的锡 - 锌合金电镀浴组合物。 一种从包含季铵电镀添加剂的电镀浴组合物沉积锡 - 锌合金到基底上的方法。
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5.发明公开Silane compositions comprising novel crosslinking agents 审中-公开Silan-Zusammensetzungen mit neuen Vernetzungsmitteln
公开(公告)号：EP1978024A1
公开(公告)日：2008-10-08
申请号：EP07105660.0
申请日：2007-04-04
CPC分类号： B32B7/04 , B32B15/14 , B32B15/20 , B32B27/04 , B32B27/26 , C08G77/04 , C09J4/00 , H05K3/244 , H05K3/389
摘要： The invention provides silane compositions which are useful as adhesives, in particular in the preparation of multi-layer laminates such as printed circuit boards. The silane compositions comprise at least one coupling agent selected from the group consisting of (A-1) a silane coupling agent of the formula A (4-x) SiB x (wherein A is a hydrolyzable group, x is 1 to 3, and B is as defined in the description); (A-2) a silane coupling agent of the formula X-{B-[R-Si(A) 3 ] z } x (wherein X is a linear or branched hydrocarbon chain containing from 5 to 10 carbon atoms, B is a divalent or trivalent hetero atom, A is a hydrolyzable group and R, z and x are as defined in the description); (A-3) a tetraorgano silane coupling agent of the formula Si(OR) 4 (wherein R is hydrogen, alkyl, aryl, aralkyl, allyl or alkenyl); and (A-4) a water soluble silicate coupling agent characterized by the formula SiO 2 • x M 2 O (wherein x is 1 to 4, and M is an alkali metal or ammonium ion); and (B) a colloidal silica; with the proviso that (a) said colloidal silica (B) is optional if at least one of compounds (A-3) or (A-4) is present; and (b) said colloidal silica (B) is mandatory if none of compounds (A-3) or (A-4) is present. The invention further provides the use of such silane compositions for the production of multilayer circuit boards and the multilayer circuit boards thus obtained.
摘要翻译： 本发明提供了可用作粘合剂的硅烷组合物，特别是制备多层层压材料如印刷电路板的硅烷组合物。 硅烷组合物包含至少一种选自（A-1）式（A-1）硅烷偶联剂（4-x）SiB x（其中A为可水解基团，x为1至3）和 B如说明书中所定义）; （A-2）式X- {B- [R-Si（A）3] z} x的硅烷偶联剂（其中X为含有5至10个碳原子的直链或支链烃链，B为 二价或三价杂原子，A是可水解基团，R，Z和x如说明书中所定义）; （A-3）式Si（OR）4（其中R是氢，烷基，芳基，芳烷基，烯丙基或烯基）的四有机硅烷偶联剂; 和（A-4）水溶性硅酸盐偶联剂，其特征在于式SiO 2€¢x M 2 O（其中x为1至4，M为碱金属或铵离子）; 和（B）胶体二氧化硅; 条件是（a）如果存在化合物（A-3）或（A-4）中的至少一种，则所述胶体二氧化硅（B）是任选的; 和（b）如果不存在化合物（A-3）或（A-4），则所述胶体二氧化硅（B）是强制性的。 本发明还提供了这样的硅烷组合物用于制造如此获得的多层电路板和多层电路板的用途。
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公开(公告)号：EP4032930A1
公开(公告)日：2022-07-27
申请号：EP21152882.3
申请日：2021-01-22
发明人： Brunner, Heiko , Heyde, Sandra , Rückbrod, Sven , Wenzel, Agnieszka , Haack, Peter , Llavona-Serrano, Angela , Hilbert, Frank , Luttmann, Sven
摘要： The present invention relates to a biuret-based quaternized polymer comprising a polymeric building block according to formula (I)
as well the corresponding biuret-based quaternized monomers and a method of synthesizing said biuret-based quaternized polymers from said biuret-based quaternized monomers, as well as metal or metal alloy plating baths comprising said polymers as additives and a method for deposition of a metal or metal alloy on a substrate.-
7.发明公开
公开(公告)号：EP3456870A1
公开(公告)日：2019-03-20
申请号：EP17190805.6
申请日：2017-09-13
发明人： Gaida, Josef , Sperling, Jan , Castellani, Mauro , Vazhenin, Grigory , Ackermann, Stefanie , Brunner, Heiko , Rohde, Dirk
摘要： An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising
- a source of nickel ions, and optionally a source of ions of at least one alloying metal,
- at least one buffering agent,
- at least one of a dimer of a compound of formula (I) or mixtures thereof
wherein
R 1 is a substituted or unsubstituted alkenyl group,
R 2 may be present or not, and if present R 2 is a -(CH 2 ) n -SO 3 - group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; and
a method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.-
公开(公告)号：EP3360988A1
公开(公告)日：2018-08-15
申请号：EP17155408.2
申请日：2017-02-09
摘要： The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths.
The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.-
9.发明公开IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATING BATH COMPOSITIONS 有权金属陶瓷中的金属氧化物微生物在金属冶金 - 金属矿物
公开(公告)号：EP3135709A1
公开(公告)日：2017-03-01
申请号：EP15183118.7
申请日：2015-08-31
摘要： The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.
摘要翻译： 本发明涉及咪唑基脲聚合物及其在用于金属或金属合金沉积的水性酸性电镀浴中的用途，例如在制造用于电子应用的印刷电路板，IC基板，半导体和玻璃器件中的铜的电解沉积或其合金。 根据本发明的电镀浴包含至少一种金属离子源和咪唑酰脲聚合物。 电镀槽特别适用于填充凹陷结构和堆积柱状凸起结构。
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公开(公告)号：EP2103717A1
公开(公告)日：2009-09-23
申请号：EP08003786.4
申请日：2008-02-29
IPC分类号： C25D3/60
CPC分类号： C25D3/60
摘要： Beschrieben wird ein wässriges cyanid-freies Elektrolytbad zur Abscheidung von Zinn-Legierungsschichten auf Substratoberflächen, umfassend (i) eine Zinn-Ionenquelle und eine Quelle für ein weiteres Legierungselement, dadurch gekennzeichnet, dass sie weiterhin (ii) N-Methylpyrrolidon enthält.
摘要翻译： 无氰水溶液电解液包含锡离子源和另一合金元素源; 和N-甲基吡咯烷酮。 包括用于电镀光泽均匀的锡合金涂层的方法的独立权利要求，其包括将要涂覆的基底引入无氰化物的电解液浴中，并将锡合金涂层电镀在基底上。
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