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1.发明授权
公开(公告)号：EP3394675B1
公开(公告)日：2020-01-29
申请号：EP16828724.1
申请日：2016-12-20
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2.发明公开METAL HARDMASK COMPOSITION AND PROCESSES FOR FORMING FINE PATTERNS ON SEMICONDUCTOR SUBSTRATES 审中-公开金属硬质合金组合物和在半导体衬底上形成微细图案的工艺
公开(公告)号：EP3257069A1
公开(公告)日：2017-12-20
申请号：EP16702558.4
申请日：2016-02-02
IPC分类号： H01L21/02
CPC分类号： C09D5/006 , G03F7/11 , H01L21/02142 , H01L21/02172 , H01L21/02175 , H01L21/02282 , H01L21/3081 , H01L21/3086 , H01L21/31133 , H01L21/31138
摘要： The present invention relates to a novel composition with improved stability containing soluble, multi-ligand-substituted metal compound, a polyol compound and a solvent useful for filling material on photoresist patterns with good trench or via filling properties of microlithographic features, where the filled patterns having good plasma etch resistance in oxygen based plasmas and are used as a hard mask in forming fine patterns on semiconductor substrates by pattern transfer of this hard mask. The present invention further relates to using the novel composition in methods for manufacturing electronic devices.
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3.发明公开
公开(公告)号：EP3394675A1
公开(公告)日：2018-10-31
申请号：EP16828724.1
申请日：2016-12-20
摘要： Compositions having a high metal content comprising a metal salt solution, a stabilizer and one or more optional additives, wherein the metal salt solution comprises a metal ion, a counter ion and a solvent. The compositions are useful for forming films on substrates in the manufacture of solid state and integrated circuit devices.
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4.发明授权
公开(公告)号：EP3039484B1
公开(公告)日：2018-07-18
申请号：EP14752886.3
申请日：2014-08-20
发明人： YAO, Huirong , MULLEN, Salem K. , WOLFER, Elizabeth , MCKENZIE, Douglas , CHO, JoonYeon , PADMANABAN, Munirathna
IPC分类号： G03F7/09 , H01L21/027 , C08G77/58 , C08G79/00
CPC分类号： C09D185/00 , C07F7/08 , C08G77/58 , G03F7/0752 , G03F7/091 , G03F7/094 , H01L21/0332 , H01L21/0337 , H01L21/0338
摘要： The present invention relates to novel, soluble, multi-ligand-substituted metal oxide compounds to form metal oxide films with improved stability as well as compositions made from them and methods of their use. Specifically, the invention pertains to compounds having the following structure (I) wherein M is a metal and n is 1 to 20, and wherein at least one of R1, R2, R3, and R4 is i) and at least at least one of R1, R2, R3, and R4 is ii), where i) is a silicon bearing organic moiety having at least 2 carbons, and ii) is an organic moiety. The invention also relates to spin-coatable compositions of compounds of structure (I) dissolved into a solvent. The present invention further relates to processes using this spin coatable composition to form a coating on a patterned substrate.
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5.发明公开POLYOXOMETALATE AND HETEROPOLYOXOMETALATE COMPOSITIONS AND METHODS FOR THEIR USE 审中-公开金属氧酸盐HETEROPOLYOXOMETALATZUSAMMENSETZUNGEN及使用方法
公开(公告)号：EP3095008A1
公开(公告)日：2016-11-23
申请号：EP14809018.6
申请日：2014-12-08
发明人： CHADA, Venkata Gopal Reddy , YAO, Huirong , PADMANABAN, Munirathna , CHO, JoonYeon , WOLFER, Elizabeth , DIOSES, Alberto D. , MULLEN, Salem K.
CPC分类号： H01L21/02172 , G03F7/0042 , G03F7/091 , G03F7/094 , H01L21/02142 , H01L21/02282 , H01L21/31133 , H01L21/47 , H01L21/477
摘要： The present invention relates to novel compositions comprising a metal component selected from a group chosen from at least one polyoxometalate, at least one heteropolyoxometalate and a mixture thereof; and, at least one organic component. The present invention also relates to methods of preparing the nanorod arrays and the nanorod materials and films. The present invention also relates to novel compositions to generate metal-oxide rich films, and also relates to processes for via or trench filling, reverse via or trench filling and imaging with underlayers. The materials are useful in wide range of manufacturing applications in many industries, including the semiconductor devices, electro-optical devices and energy storage industry.
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6.发明授权
公开(公告)号：EP3257069B1
公开(公告)日：2018-11-21
申请号：EP16702558.4
申请日：2016-02-02
IPC分类号： H01L21/02
CPC分类号： C09D5/006 , C23C18/1212 , C23C18/1216 , C23C18/1245 , C23C18/1295 , G03F7/11 , H01L21/02142 , H01L21/02172 , H01L21/02175 , H01L21/02282 , H01L21/3081 , H01L21/3086 , H01L21/31133 , H01L21/31138
摘要： The present invention relates to a novel composition with improved stability containing soluble, multi-ligand-substituted metal compound, a polyol compound and a solvent useful for filling material on photoresist patterns with good trench or via filling properties of microlithographic features, where the filled patterns having good plasma etch resistance in oxygen based plasmas and are used as a hard mask in forming fine patterns on semiconductor substrates by pattern transfer of this hard mask. The present invention further relates to using the novel composition in methods for manufacturing electronic devices.
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7.发明公开STABLE METAL COMPOUNDS AS HARDMASKS AND FILLING MATERIALS, THEIR COMPOSITIONS AND METHODS OF USE 有权稳定的金属化合物作为硬掩膜和填充，它们的组合物和方法使用
公开(公告)号：EP3039484A1
公开(公告)日：2016-07-06
申请号：EP14752886.3
申请日：2014-08-20
发明人： YAO, Huirong , MULLEN, Salem K. , WOLFER, Elizabeth , MCKENZIE, Douglas , CHO, JoonYeon , PADMANABAN, Munirathna
IPC分类号： G03F7/09 , H01L21/027 , C08G77/58 , C08G79/00
CPC分类号： C09D185/00 , C07F7/08 , C08G77/58 , G03F7/0752 , G03F7/091 , G03F7/094 , H01L21/0332 , H01L21/0337 , H01L21/0338
摘要： The present invention relates to novel, soluble, multi-ligand-substituted metal oxide compounds to form metal oxide films with improved stability as well as compositions made from them and methods of their use. Specifically, the invention pertains to compounds having the following structure (I) wherein M is a metal and n is 1 to 20, and wherein at least one of R1, R2, R3, and R4 is i) and at least at least one of R1, R2, R3, and R4 is ii), where i) is a silicon bearing organic moiety having at least 2 carbons, and ii) is an organic moiety. The invention also relates to spin-coatable compositions of compounds of structure (I) dissolved into a solvent. The present invention further relates to processes using this spin coatable composition to form a coating on a patterned substrate.
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8.发明公开STABLE METAL COMPOUNDS, THEIR COMPOSITIONS AND METHODS OF THEIR USE 审中-公开STABILE METALLVERBINDUNGEN，DEREN ZUSAMMENSETZUNGEN UND VERFAHREN ZU DEREN VERWENDUNG
公开(公告)号：EP2928899A2
公开(公告)日：2015-10-14
申请号：EP13852370.9
申请日：2013-12-06
发明人： YAO, Huirong , RAHMAN, M. Dalil , MULLEN, Salem K. , CHO, JoonYeon , ANYADIEGWU, Clement , PADMANABAN, Munirathna
摘要： The present disclosure relates to soluble, multi-ligand-substituted metal compounds with improved stability as well as compositions made from them and methods of their use.
摘要翻译： 本公开涉及具有改进稳定性的可溶性，多配位体取代的金属化合物以及由它们制备的组合物及其使用方法。
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