摘要:
The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.
摘要:
Process for manufacturing a smooth, or even ultrasmooth, printable sheet comprising the steps consisting in: preparing a multilayer structure (12) comprising at least one lower plastic film (14), a non-stick intermediate layer (16), and a printable upper layer (18), sizing one face (30) of a substrate (24) or the upper face (28) of the printable layer, and applying the substrate to the printable layer, in order to laminate them, then removing the plastic film from the printable layer, this printable layer (18) defining, on the sheet, a smooth or ultrasmooth face (22).
摘要:
The present invention relates to translucent or transparent paper suitable for laminate and packaging applications. More particularly, the present invention relates to a translucent paper having improved transparency by a coating process. Said transparent or translucent paper serves as a recyclable, repulpable and renewable alternative to plastic wrappers and laminates.
摘要:
The invention relates to a paper-based printed electronic device comprising one or more sheets of paper that is impregnated with a resin in way to fill the voids (or pores) of porous networks of cellulose fibers and in particular to saturate said porous networks of cellulose fibers, as well as to coat the outer surfaces of the printed electronics with said resin. A fully encapsulated electronic device is obtained which is protected against external environmental and physical damages such as against moisture and oxygen and has acquired sufficient resistance to tearing. The impregnated and encapsulated electronic device can then be successfully integrated into an object in a form of a flat or curved monolithic structure. This may especially be achieved through a lamination process, as said device sustains high pressure, high temperature, does not create bubbles, does not delaminate, and can be fully embedded into an end product.
摘要:
The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.