USE OF PRINTED ELECTRONICS ON PAPER TO EMBED A CIRCUIT INTO PLASTIC MOULDED OBJECTS
    2.
    发明公开
    USE OF PRINTED ELECTRONICS ON PAPER TO EMBED A CIRCUIT INTO PLASTIC MOULDED OBJECTS 审中-公开
    在纸上使用印刷电子将电路嵌入到塑料模制物体中

    公开(公告)号:EP3187322A1

    公开(公告)日:2017-07-05

    申请号:EP15307198.0

    申请日:2015-12-31

    IPC分类号: B29C45/14 B29L31/34

    摘要: The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.

    摘要翻译: 本发明涉及一种将基本上由承载电子墨水和/或印刷电子电路和/或装置的纸基底组成的标签(由此实现纸基电路)直接嵌入模制塑料件(也被称为塑料 对象),纸基电路的嵌入和塑料片的生产在一次操作中进行。 因此,本发明还涉及制造嵌入这种标签的塑料物品的方法。 本发明还涉及包含标签的塑料物体,该标签基本上由载有电子墨水的纸基材和/或印刷电子电路和/或装置(由此实现基于纸的电路)嵌入模制塑料中,特别是获得的物体 通过所公开的方法制备模制塑料片。

    PAPER-IN-RESIN ELECTRONICS - PROCESS FOR PRODUCING IT AND APPLICATION IN MANUFACTURED PRODUCTS

    公开(公告)号:EP3405011A1

    公开(公告)日:2018-11-21

    申请号:EP17305560.9

    申请日:2017-05-16

    IPC分类号: H05K1/03 D21H27/00 B32B21/06

    摘要: The invention relates to a paper-based printed electronic device comprising one or more sheets of paper that is impregnated with a resin in way to fill the voids (or pores) of porous networks of cellulose fibers and in particular to saturate said porous networks of cellulose fibers, as well as to coat the outer surfaces of the printed electronics with said resin. A fully encapsulated electronic device is obtained which is protected against external environmental and physical damages such as against moisture and oxygen and has acquired sufficient resistance to tearing. The impregnated and encapsulated electronic device can then be successfully integrated into an object in a form of a flat or curved monolithic structure. This may especially be achieved through a lamination process, as said device sustains high pressure, high temperature, does not create bubbles, does not delaminate, and can be fully embedded into an end product.