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公开(公告)号：EP2591497A2
公开(公告)日：2013-05-15
申请号：EP11728250.9
申请日：2011-06-23
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： B23K1/20 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L2224/11462 , H01L2924/00015 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/1134
摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.
摘要翻译： 描述了一种在基板上形成焊料沉积物的方法，包括以下步骤：i）提供包括至少一个内接触区域的基板，ii）使包括所述至少一个内接触区域的整个基板区域与适合于 在衬底表面上提供导电层，iii）形成图案化的抗蚀剂层，iv）将包含锡或锡合金的焊料沉积层电镀到内部接触区域上，v）去除图案化的抗蚀剂层，vi）形成阻焊剂 在基板表面上具有阻焊剂开口。
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公开(公告)号：EP2132817A1
公开(公告)日：2009-12-16
申请号：EP08734961.9
申请日：2008-04-02
发明人： METZGER, Dieter , LAMPRECHT, Sven
CPC分类号： C25D5/56 , C25D3/50 , C25D5/10 , C25D5/36 , H01M4/0452 , H01M4/8621 , H01M4/8885
摘要： A process for the preparation of electrodes for use in a fuel cell comprising a membrane electrode assembly with a negative and a positive electrode is described, said process comprising the following steps: (i) providing an electrode substrate and (ii) coating said substrate electrolytically from a plating bath with a metal layer, said metal being selected from Ag, Au, Pd and its alloys.
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公开(公告)号：EP3560304A1
公开(公告)日：2019-10-30
申请号：EP17818584.9
申请日：2017-12-22
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公开(公告)号：EP2601822B1
公开(公告)日：2019-07-10
申请号：EP11737966.9
申请日：2011-07-29
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公开(公告)号：EP1427869B1
公开(公告)日：2005-02-23
申请号：EP02754692.8
申请日：2002-06-17
IPC分类号： C23C18/00
CPC分类号： C23C18/1617
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公开(公告)号：EP4018790A1
公开(公告)日：2022-06-29
申请号：EP20756871.8
申请日：2020-08-19
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7.发明公开METHOD FOR REGENERATING ETCHING SOLUTIONS CONTAINING IRON FOR THE USE IN ETCHING OR PICKLING COPPER OR COPPER ALLOYS AND AN APPARATUS FOR CARRYING OUT SAID METHOD 有权METHOD FOR再生利用含铁蚀刻溶液蚀刻或铜或铜合金的耐污渍性和装置的实施过程
公开(公告)号：EP1633906A1
公开(公告)日：2006-03-15
申请号：EP04739653.6
申请日：2004-06-07
发明人： MATEJAT, Kai-Jens , LAMPRECHT, Sven
摘要： A method for the regeneration of etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out the method is described. The method involves feeding the etching solution to be regenerated from the etching system into an electrolysis cell being hermetically sealed or having an anode hood (8), the electrolysis cell comprising a cathode (1), an inert anode (2), means (3) for removing the electrolytically deposited copper from the cathode and means (4) for collecting the removed copper and applying a potential to the removed copper, wherein the electrolysis cell does not have an ion exchange membrane or a diaphragm.
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8.发明授权
公开(公告)号：EP1264010B1
公开(公告)日：2005-06-01
申请号：EP01915052.3
申请日：2001-02-23
发明人： MATEJAT, Kai-Jens , LAMPRECHT, Sven
IPC分类号： C25D21/14
摘要： The regulation of the concentration of metal ions in an electrolyte, for the electrolytic separation of metals, containing additional substances of an electrochemically reversible redox system is conventionally achieved by passing at least a part of the electrolyte through an auxiliary cell, comprising an insoluble auxiliary anode (20) and at least one auxiliary cathode (30), between which a flow of current is generated by application of a voltage. Excess amounts of the oxidised material from the redox system are thus reduced at the auxiliary cathode (30) and the formation of ions of the metal to be separated is avoided. According to the invention, pieces of the metal to be separated (30) are used as the auxiliary cathode.
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9.发明授权METHOD FOR REGENERATING ETCHING SOLUTIONS CONTAINING IRON FOR THE USE IN ETCHING OR PICKLING COPPER OR COPPER ALLOYS AND AN APPARATUS FOR CARRYING OUT SAID METHOD 有权METHOD FOR再生利用含铁蚀刻溶液蚀刻或铜或铜合金的耐污渍性和装置的实施过程
公开(公告)号：EP1633906B1
公开(公告)日：2007-10-17
申请号：EP04739653.6
申请日：2004-06-07
发明人： MATEJAT, Kai-Jens , LAMPRECHT, Sven
摘要： A method for the regeneration of etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out the method is described. The method involves feeding the etching solution to be regenerated from the etching system into an electrolysis cell being hermetically sealed or having an anode hood (8), the electrolysis cell comprising a cathode (1), an inert anode (2), means (3) for removing the electrolytically deposited copper from the cathode and means (4) for collecting the removed copper and applying a potential to the removed copper, wherein the electrolysis cell does not have an ion exchange membrane or a diaphragm.
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公开(公告)号：EP1427869A2
公开(公告)日：2004-06-16
申请号：EP02754692.8
申请日：2002-06-17
IPC分类号： C23C18/00
CPC分类号： C23C18/1617
摘要： The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.
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