-
公开(公告)号：EP3234219A1
公开(公告)日：2017-10-25
申请号：EP15813382.7
申请日：2015-12-17
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1646
摘要： The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aldehyde compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aldehyde compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
摘要翻译： 本发明涉及一种含水电镀液组合物和一种通过无电镀在衬底上沉积钯层的方法。 本发明的水系镀浴组合物含有钯离子源，钯离子还原剂和醛化合物。 含水电镀液组合物具有提高的钯沉积速率，同时保持浴稳定性。 含水电镀液组合物也具有延长的使用寿命。 本发明的醛化合物允许在浴寿命期间将沉积速率调节到恒定的范围并且在较低的温度下无电沉积钯层。 本发明的醛化合物激活具有低沉积速率的无电镀钯浴并重新激活老化的无电镀钯浴。
-
公开(公告)号：EP1427869B1
公开(公告)日：2005-02-23
申请号：EP02754692.8
申请日：2002-06-17
IPC分类号： C23C18/00
CPC分类号： C23C18/1617
-
公开(公告)号：EP3380650B1
公开(公告)日：2019-10-30
申请号：EP16801787.9
申请日：2016-11-28
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , RÜCKBROD, Sven
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
-
-
公开(公告)号：EP1917340B1
公开(公告)日：2008-12-17
申请号：EP06791636.1
申请日：2006-08-21
CPC分类号： H05K3/26 , C11D7/261 , C11D7/3218 , C11D7/5013 , C11D7/5022 , C11D11/0047 , G03F7/40 , G03F7/405 , G03F7/425 , H05K3/244 , H05K3/28 , H05K2201/0761 , H05K2203/122
摘要： To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof.
摘要翻译： 为了减少印刷电路板上的离子污染物，所述印刷电路板至少部分地被阻焊剂掩模覆盖并且在铜结构上设置有顶层，使用含有至少一种乙醇胺化合物和/或其盐的水性清洁溶液 ，至少一种醇溶剂和根据需要的至少一种胍化合物和/或其盐。
-
公开(公告)号：EP3380649B1
公开(公告)日：2019-10-30
申请号：EP16801528.7
申请日：2016-11-28
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , FROESE, Bernd
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
-
公开(公告)号：EP3380650A1
公开(公告)日：2018-10-03
申请号：EP16801787.9
申请日：2016-11-28
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , RÜCKBROD, Sven
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and a cyanide group containing aromatic compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the cyanide group containing aromatic compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The cyanide group containing aromatic compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
-
公开(公告)号：EP1427869A2
公开(公告)日：2004-06-16
申请号：EP02754692.8
申请日：2002-06-17
IPC分类号： C23C18/00
CPC分类号： C23C18/1617
摘要： The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.
-
公开(公告)号：EP3380649A1
公开(公告)日：2018-10-03
申请号：EP16801528.7
申请日：2016-11-28
发明人： WALTER, Andreas , SUCHENTRUNK, Christof , BECK, Thomas , STEINBERGER, Gerhard , BERA, Holger , BRUNNER, Heiko , FROESE, Bernd
IPC分类号： C23C18/44 , H01L21/288 , H05K3/24
摘要： The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.
-
10.发明公开
公开(公告)号：EP1917340A1
公开(公告)日：2008-05-07
申请号：EP06791636.1
申请日：2006-08-21
CPC分类号： H05K3/26 , C11D7/261 , C11D7/3218 , C11D7/5013 , C11D7/5022 , C11D11/0047 , G03F7/40 , G03F7/405 , G03F7/425 , H05K3/244 , H05K3/28 , H05K2201/0761 , H05K2203/122
摘要： To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof.
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.014 秒)
