公开(公告)号：EP2048930A4

公开(公告)日：2011-04-27

申请号：EP07791948

申请日：2007-08-03

Applicant: BRIDGESTONE CORP

Inventor： KOTSUBO HIDEFUMI ,  FUNAKI TATSUYA ,  SASAKI KIYOMI

IPC: H05K9/00 ,  B32B7/02 ,  B32B15/08 ,  C23C18/18 ,  G09F9/00

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/30 ,  C23C18/31 ,  H05K3/182 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2203/0709 ,  H05K2203/124 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2826

公开(公告)号：EP1993338A4

公开(公告)日：2011-05-25

申请号：EP07738017

申请日：2007-03-08

Applicant: BRIDGESTONE CORP

Inventor： KOTSUBO HIDEFUMI ,  FUNAKI TATSUYA ,  SASAKI KIYOMI

IPC: H05K9/00 ,  B32B15/08 ,  G02B1/10

CPC classification number: G02B1/10 ,  G02B5/204 ,  H05K9/0094

Abstract: The present invention provides a process for preparing the light transmissive electromagnetic wave shielding material having an enhanced productivity. A process for preparing a light transmissive electoromagnetic shielding material comprising; coating a transparent substrate with a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof to form a coated layer and drying the coated layer to provide a pretreatment layer on the transparent substrate, forming a plating protective layer in the dot pattern on the pretreatment layer, and subjecting the exposing part of the pretreatment layer having no plating protective layer to electroless plating to form a metal conductive layer in the mesh pattern.

公开(公告)号：EP2120525A4

公开(公告)日：2011-05-25

申请号：EP08721360

申请日：2008-03-05

Applicant: BRIDGESTONE CORP

Inventor： KOTSUBO HIDEFUMI ,  FUNAKI TATSUYA ,  SASAKI KIYOMI ,  HANZAWA KENTARO

IPC: H05K9/00 ,  B32B15/08 ,  E04B1/92 ,  G09F9/00

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1669 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  H05K9/0005 ,  H05K2201/0221 ,  Y10T428/2991 ,  Y10T428/2998

公开(公告)号：EP2059107A4

公开(公告)日：2011-05-18

申请号：EP07806483

申请日：2007-08-31

Applicant: BRIDGESTONE CORP

Inventor： KOTSUBO HIDEFUMI ,  FUNAKI TATSUYA ,  SASAKI KIYOMI

IPC: H05K9/00 ,  B32B15/04 ,  G09F9/00

CPC classification number: H05K9/0096 ,  H05K1/02 ,  H05K3/182 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0709 ,  Y10T428/24917

公开(公告)号：EP1696719A4

公开(公告)日：2008-10-29

申请号：EP04818497

申请日：2004-11-11

Applicant: BRIDGESTONE CORP

Inventor： FUNAKI TATSUYA ,  KOTSUBO HIDEFUMI ,  SASAKI KIYOMI

IPC: H05K9/00 ,  B32B15/08 ,  B32B27/30 ,  G09F9/00

CPC classification number: H05K9/0005 ,  C03C17/34 ,  C03C2217/476 ,  C03C2217/479 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/31 ,  H01J2211/446 ,  H05K9/0096

Abstract: A resin pattern (3) is formed by printing an ultraviolet-curing resin paste containing an electroless plating catalyst on the surface of a transparent base (1) and curing the thus-printed pattern (2) by irradiating it with ultraviolet light. At this time, an uncured layer (3A) is left in the surface of the resin pattern (3). Then, a plating layer (4) is formed on the resin pattern (3) by electroless plating, thereby forming a conductive pattern (5). During the electroless plating, the uncured layer (3A) is eroded in the plating bath and catalyst particles are exposed. The plating layer (4) is formed using the thus-exposed catalyst particles as the nuclei.

公开(公告)号：EP1564239A4

公开(公告)日：2007-08-01

申请号：EP03751377

申请日：2003-10-08

Applicant: BRIDGESTONE CORP

Inventor： KITANO HIDEKI ,  SASAKI KIYOMI ,  MURAYAMA KENJI ,  KOTSUBO HIDEFUMI

IPC: C08J5/18 ,  B32B5/14 ,  B32B7/02 ,  B32B7/10 ,  B32B7/12 ,  C08L101/00 ,  C09J7/02 ,  C09J133/06 ,  G02B1/10 ,  G02B5/00 ,  G02B5/20 ,  G02B5/22 ,  G03B17/26 ,  G09F9/00

CPC classification number: B32B7/12 ,  B32B7/10 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2309/105 ,  B32B2457/20 ,  B32B2551/00 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J133/06 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2433/00 ,  G02B5/20 ,  G02B5/22 ,  G03B17/26 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2891

Abstract: An adhesion-including film is provided, wherein the total light transmittance is varied in a width direction of the film. The adhesion-including film includes a mold release film, a first adhesive layer disposed on this mold release film, a second adhesive layer disposed on the first adhesive layer, a base film on the second adhesive layer, and an antireflection film disposed on the film surface opposite to the second adhesive layer of the base film. The first adhesive layer is highly colored as compared with the second adhesive layer. The second adhesive layer may be colorless. The thickness of the central portion of the first adhesive layer in the width direction of the film is larger than the thicknesses of both end sides. The total thickness of the first adhesive layer and the second adhesive layer is uniform all over the film.