摘要:
A recording head for discharging ink by using thermal energy comprises a plurality of outlets for discharging ink and a substrate (100) including a common substrate plate (1) of P type, a plurality of electrothermal converting elements (RH1, RH2) and a plurality of functional elements (SH1, SH2) connected to the respective electrothermal converting elements (RH1, RH2) and formed on the common substrate plate (1) as well as the electrothermal converting elements (RH1, RH2). Each of the functional elements (SH1, SH2) has a first semiconductor region (2, 5) of N type, a second semiconductor region (4) of P type provided within the first semiconductor region and a third semiconductor region (8) of N type provided within the second semiconductor region (4), so as to form a rectifying junction. The first, second and third semiconductor regions are formed by diffusion of impurity atoms in the common semiconductor substrate plate (1).
摘要:
A deposited film formation method comprises the steps of:
(a) feeding a gas of an organometallic compound containing molybdenum atom and hydrogen gas onto a substrate having an electron donative surface; and (b) maintaining the temperature of the electron donative surface within the range of the decomposition temperature of the organometallic compound or lower and 800 °C or lower to form a molybdenum film on the electron donative surface.
摘要:
This invention provides a method of forming a deposition film serving as a high-quality wiring layer having good stress migration durability against any material such as a non-monocrystalline material. A substrate is located in a deposition film formation space, a gas of an alkylaluminum halide is supplied to the deposition film formation space, and an aluminum film is selectively formed on an electron donor surface at a partial pressure of the alkylaluminum halide of 7 x 10⁻³ Torr to 9 x 10⁻² Torr in the range of a decomposition temperature or more of the alkylaluminum halide and 450°C or less. When deposition is to be performed on the non-monocrystalline material, a chemical treatment for terminating with hydrogen atoms a non-electron donor surface of a substrate having the electron donor surface and the non-electron donor surface is performed, and the deposition film is deposited by a non-selective deposition method.
摘要:
A process for forming a deposited film comprises the steps of; (a) disposing in a space for forming a deposited film a substrate having an electron donative surface; (b) introducing to the space for forming a deposited film i) a gas comprising an organic metal compound containing a tungsten atom and ii) a hydrogen gas; and (c) forming a tungsten film on the electron donative surface.
摘要:
A recording head (100) comprises: a liquid emission section (500) having an orifice for emitting an ink; an electro-thermal transducer (103,104) producing a thermal energy for use in emission of the ink supplied to a liquid emission section; and a functional element electrically connected to the electro-thermal transducer, wherein the functional element has a layer formed from the same material as that of a heat generating resistive layer (103) constituting the electro-thermal transducer.
摘要:
A process for preparing a semiconductor substrate comprises a step of making a silicon substrate porous, a step of forming a non-porous silicon monocrystalline layer on the resulting porous substrate, a step of bonding the surface of the non-porous silicon monocrystalline layer to another substrate having a metallic surface, and a step of removing the porous silicon layer of the bonded substrates by selective etching.
摘要:
A method for producing a substrate (100) for a recording head wherein a plurality of electro-thermal converting elements (110), a plurality of driving functional elements (120) for respectively driving the electro-thermal converting elements (110) and a plurality of wiring electrodes (104) for respectively connecting each of the driving functional elements (120) and each of the electro-thermal converting elements (110) are formed on a supporting member by photolithography comprises forming the wiring electrodes by etching a material layer for the wiring electrodes (104) while etchingwise removing a photoresist for masking the material layer for the wiring electrodes (104).