摘要:
An optical system includes first and second optical systems, a first controller for controlling a temperature of the first optical system to a first temperature, and a second controller for controlling a temperature of the second optical system to a second temperature different from the first temperature.
摘要:
An X-ray exposure apparatus includes a stage (1) for holding a reflection type mask (MS) having a multilayered reflection pattern for circuit manufacturing, a stage (50) for holding a wafer (WF) to be exposed to the pattern of the mask with X-rays, and a reflection reduction imaging system, disposed between the mask stage and the wafer stage, including a reflecting mirror arrangement, containing a plurality of curved reflecting mirrors (M1, M2, M3) coated with multilayer films, for receiving X-rays from a mask (MS) and directing them to a wafer (WF) to expose the wafer to the pattern of the mask with the X-rays in a reduced scale.
摘要:
A scanning optical device for scanning a material to be scanned with beams emitted from a light source (1) thereof, has a storage device for storing information relating to the quantity of deviation of a scanning optical system. The convergent position of the beams is adjustable in the direction of the optical axis by at least partially controlling the elements of the scanning optical system in accordance with information relating the quantity of deviation supplied by the storage device. The quantity of deviation such as an image distortion of the scanning optical system can be compensated by a simple structure. Therefore, a recording device or reading device employing the scanning optical system exhibiting high resolution, low cost and a capability of preventing deterioration in the gradation expression can be realized.
摘要:
An X-ray exposure apparatus includes an X-ray source; and a directing optical system for directing an X-ray beam from the X-ray source to a surface to be exposed, the directing optical system including a mirror having a reflection surface of a curvature radius R with respect to a predetermined sectional plane, for reflecting the X-ray beam and for expanding the diameter thereof with respect to the sectional plane; wherein the mirror satisfies the following conditions: R = (2d₁d₂σ′)/{[Δ-(d₁+d₂)σ′]·α} where d₁: the distance from the emission point of the X-ray source to the center of effective X-ray beam diameter on the reflection surface; d₂: the distance from the center of effective X-ray beam diameter on the reflection surface to the center of effective X-ray beam diameter on the surface to be exposed; α: the angle defined at the center of effective X-ray beam diameter on the reflection surface, between the X-ray beam and the reflection surface; σ′: a standard deviation of a distribution of intensities of the rays having different emission angles at the sectional plane, at the gravity center wavelength of the X-ray beam from the X-ray source; Δ: 0.43a≦ Δ ≦4.0a; and a : the length of the surface to be exposed, with respect to the sectional plane.
摘要:
A reflection type mask usable to print a pattern upon a semiconductor wafer by use of soft X-rays or otherwise is disclosed. A reflective surface is formed by a multilayered film which is formed on a substrate by layering different materials having different refractive indices in consideration of Bragg diffraction and Fresnel reflection. A non-reflective portion is formed on the reflecting surface to provide a desired pattern. Alternatively, a pattern comprising a multilayered structure may be formed upon a non-reflective substrate. The mask of the present invention assures pattern printing of high contrast.