公开(公告)号：EP1177092A1

公开(公告)日：2002-02-06

申请号：EP00914628.3

申请日：2000-02-17

申请人： CORNING INCORPORATED

发明人： HRDINA, Kenneth, E. ,  KAR, Gitimoy ,  WIGHT, John, F., Jr. ,  YU, Chunzhe, C.

IPC分类号： B32B3/12 ,  E04C2/36

CPC分类号： G02B6/02347 ,  B01D63/066 ,  B01D71/027 ,  B01D71/04 ,  C02F1/32 ,  C03B19/025 ,  C03B19/06 ,  C03B23/047 ,  C03B23/06 ,  C03B23/065 ,  C03B32/00 ,  C03B37/0124 ,  C03B2203/14 ,  C03B2203/42 ,  G02B6/02357 ,  G02B6/02371 ,  G02B6/02376 ,  Y10T428/24149 ,  Y10T428/24165

摘要： The present invention describes a glass honeycomb structure (100) having a variety of shapes and sizes depending on its ultimate application. Unlike prior art honeycomb structures made from ceramics, the inventive glass honeycomb can be readily bent and/or redrawn. Furthermore, the inventive honeycomb structure is light-weight, yet able to support heavy loads on its end faces (10a, 10b). Therefore, the inventive honeycomb can be used as a light-weight support for such objects as mirrors. Other useful properties of the extruded glass honeycomb are its high softening temperature, its transparency to ultraviolet and visible light, and its ability to be redrawn. Embodiments that rely upon one or more of these properties include: a bio-reactor, a membrane reactor, a capillary flow controller, a high efficiency filtration system, in-situ water treatment, high temperature dielectric material, and photonic band gap material.

公开(公告)号：EP2217539A1

公开(公告)日：2010-08-18

申请号：EP08854815.1

申请日：2008-11-19

申请人： Corning Incorporated

发明人： HRDINA, Kenneth, E. ,  SABIA, Robert

IPC分类号： C03C3/097

CPC分类号： C03C3/06 ,  C03B19/1407 ,  C03B19/143 ,  C03B19/1484 ,  C03B2201/42 ,  C03C2201/42 ,  C03C2203/40

摘要： A low expansion glass substrate includes titania and silica and has a thermal expansivity with an average gradient less than 1 ppb/°C /°C in a temperature range of 19°C to 25°C.

摘要翻译： 低膨胀玻璃基板包含二氧化钛和二氧化硅，并且具有在19℃至25℃的温度范围内具有小于1ppb /℃/℃的平均梯度的热膨胀系数。

公开(公告)号：EP1325386A1

公开(公告)日：2003-07-09

申请号：EP01973468.0

申请日：2001-09-26

申请人： CORNING INCORPORATED

发明人： ACKERMAN, Bradford, G. ,  BOWDEN, Bradley, F. ,  DAVIS, Claude, L., Jr. ,  HRDINA, Kenneth, E.

IPC分类号： G03B27/58 ,  G03B27/42

CPC分类号： G03F7/70716 ,  G03F7/70216 ,  G03F7/708

摘要： A lithographic stage includes a platen (31) having a top face and a bottom face and a holder (32) for holding an optical component on the top face of the platen. The platen is made of a light-weight material such as high purity fused silica or ultra low expansion glass. The bottom face of the platen may further include means for connecting to a positioning device in an extreme ultraviolet lithography system.

公开(公告)号：EP1224047A2

公开(公告)日：2002-07-24

申请号：EP00937499.2

申请日：2000-02-17

申请人： CORNING INCORPORATED

发明人： HRDINA, Kenneth, E. ,  KAR, Gitimoy ,  WIGHT, John, F. ,  YU, Chunzhe, C.

IPC分类号： B23B1/00

CPC分类号： G02B6/02347 ,  B28B3/269 ,  B28B11/003 ,  C03B19/025 ,  C03B19/06 ,  C03B23/047 ,  C03B23/065 ,  C03B32/00 ,  C03B37/0124 ,  C03B2203/42 ,  G02B6/02361 ,  G02B6/02371 ,  G02B6/02376 ,  Y10T428/236 ,  Y10T428/24149

摘要： The present invention describes an extrusion process for manufacturing a titanium-containing silicate glass honeycomb structure (100), having a variety of shapes and sizes depending on its ultimate application. The titanium-containing glass honeycomb has a very low coefficient of thermal expansion (CTE) and the CTE can be varied by adjusting the titanium level to match the CTE of members that are bonded to the honeycomb. Furthermore, the inventive honeycomb structure is lightweight, yet able to advantageously used as a light-weight support for such objects as mirrors. Especially extraterrestrial environments where temperature extremes are present. These honeycombs can be used singularly or in aggregates to provide such support. Embodiments are described wherein the mass of the honeycomb is further reduced by removing select portions of the honeycomb without deleteriously impacting its ability for load bearing.

公开(公告)号：EP1218796A1

公开(公告)日：2002-07-03

申请号：EP00945368.9

申请日：2000-07-13

申请人： Corning Incorporated

发明人： DAVIS, Claude, L. ,  HRDINA, Kenneth, E. ,  SABIA, Robert

IPC分类号： G03C5/00

CPC分类号： G21K1/062 ,  B82Y10/00 ,  B82Y40/00 ,  G02B17/06 ,  G03F1/24 ,  G03F1/60 ,  G03F7/702 ,  G03F7/70233 ,  G03F7/70283 ,  G03F7/70891 ,  G03F7/70958 ,  Y10S438/947 ,  Y10S438/974

摘要： The present invention relates to reflective masks and their use for reflecting extreme ultraviolet soft x-ray photons to enable the use of extreme ultraviolet soft x-ray radiation projection lithographic methods and systems for producing integrated circuits and forming patterns with extremely small feature dimensions. The projection lithographic method includes providing an illumination sub-system for producing and directing an extreme ultraviolet soft x-ray radiation μ from an extreme ultraviolet soft x-ray source; providing a mask sub-system illuminated by the extreme ultraviolet soft x-ray radiation μ produced by the illumination sub-system and providing the mask sub-system includes providing a patterned reflective mask for forming a projected mask pattern when illuminated by radiation μ. Providing the patterned reflective mask includes providing a Ti doped high purity SiO2 glass wafer with a patterned absorbing overlay overlaying the reflective multilayer coated Ti doped high purity SiO2 glass defect free wafer surface that has an Ra roughness ≤0.15 nm. The method includes providing a projection sub-system and a print media subject wafer which has a radiation sensitive wafer surface wherein the projection sub-system projects the projected mask pattern from the patterned reflective mask onto the radiation sensitive wafer surface.

公开(公告)号：EP1224047B1

公开(公告)日：2009-10-28

申请号：EP00937499.2

申请日：2000-02-17

申请人： Corning Incorporated

发明人： HRDINA, Kenneth, E. ,  KAR, Gitimoy ,  WIGHT, John, F. ,  YU, Chunzhe, C.

IPC分类号： B23B1/00 ,  C03B19/06 ,  C03B23/047 ,  C03B23/06 ,  B28B3/20 ,  B28B11/00

CPC分类号： G02B6/02347 ,  B28B3/269 ,  B28B11/003 ,  C03B19/025 ,  C03B19/06 ,  C03B23/047 ,  C03B23/065 ,  C03B32/00 ,  C03B37/0124 ,  C03B2203/42 ,  G02B6/02361 ,  G02B6/02371 ,  G02B6/02376 ,  Y10T428/236 ,  Y10T428/24149

摘要： The present invention describes an extrusion process for manufacturing a titanium-containing silicate glass honeycomb structure (100), having a variety of shapes and sizes depending on its ultimate application. The titanium-containing glass honeycomb has a very low coefficient of thermal expansion (CTE) and the CTE can be varied by adjusting the titanium level to match the CTE of members that are bonded to the honeycomb. Furthermore, the inventive honeycomb structure is lightweight, yet able to advantageously used as a light-weight support for such objects as mirrors. Especially extraterrestrial environments where temperature extremes are present. These honeycombs can be used singularly or in aggregates to provide such support. Embodiments are described wherein the mass of the honeycomb is further reduced by removing select portions of the honeycomb without deleteriously impacting its ability for load bearing.

公开(公告)号：EP1283819A1

公开(公告)日：2003-02-19

申请号：EP01918777.2

申请日：2001-03-16

申请人： CORNING INCORPORATED

发明人： CAIN, Michael, B. ,  HRDINA, Kenneth, E. ,  ROSPLOCK, Cynthia, K.

IPC分类号： C03B37/014 ,  C03B37/018 ,  C03B19/14 ,  C23C16/448

CPC分类号： C03B37/01807 ,  C03B19/1415 ,  C03B37/01413 ,  C03B2201/42 ,  C03B2207/85 ,  C03B2207/87 ,  C23C16/4481

摘要： A method of vaporizing a liquid TiO2 precursor utilized in making a titania-doped fused silica preform includes passing the liquid TiO2 precursor through a packed-bed vaporizer with a carrier gas under conditions sufficient to vaporize the TiO2 precursor without substantial thermal degradation thereof. Further, the method includes commingling the vaporized TiO2 precursor with a vaporized SiO2 precursor and delivering the mixture to a vapor utilization site to form the preform. In one embodiment of the present invention, liquid TiO2 and SiO2 precursors are contemporaneously vaporized in the vaporizer and delivered to the vaporization utilization site to form the preform.

公开(公告)号：EP1214718A1

公开(公告)日：2002-06-19

申请号：EP00948609.3

申请日：2000-07-10

申请人： CORNING INCORPORATED

发明人： DAVIS, Claude, L., Jr. ,  HRDINA, Kenneth, E.

IPC分类号： G21K5/00 ,  C23C14/02 ,  C23C28/00

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  C03B19/1415 ,  C03B2201/07 ,  C03B2201/42 ,  G02B5/0891 ,  G02B17/0615 ,  G02B17/0636 ,  G03F1/24 ,  G03F1/60 ,  G03F7/702 ,  G03F7/70233 ,  G03F7/70283 ,  G03F7/70891 ,  G03F7/70958 ,  G21K1/062 ,  G21K2201/064 ,  G21K2201/067

摘要： The projection lithographic method for producing integrated circuits and forming patterns with extremely small feature dimensions includes an illumination sub-system (36) for producing and directing an extreme ultraviolet soft x-ray radiation μ from an extreme ultraviolet soft x-ray source (38); a mask stage (22) illuminated by the extreme ultraviolet soft x-ray radiation μ produced by illumination stage and the mask stage (22) includes a pattern when illuminated by radiation μ. A protection sub-system includes reflective multilayer coated Ti doped high purity SiO2 glass defect free surface (32) and printed media subject wafer which has a radiation sensitive surface.

摘要翻译： 用于制造集成电路和形成具有极小特征尺寸的图案的投影光刻方法包括用于产生和引导来自极紫外线软X射线源（38）的极紫外线软X射线辐射λ的照明子系统（36） ; 由照明级产生的极紫外线软X射线辐射λ照射的掩模台（22）和掩模台（22）包括当被辐射λ照射时的图案。 保护子系统包括具有辐射敏感表面的反射多层涂覆的Ti掺杂的高纯度SiO 2玻璃无缺陷表面（32）和印刷媒体对象晶片。