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    Flexible connector for high density circuit applications
    1.
    发明公开
    Flexible connector for high density circuit applications 审中-公开
    Flexibler VerbinderfürSchaltungsanwendungen mit hoher Dichte

    公开(公告)号：EP1204302A1

    公开(公告)日：2002-05-08

    申请号：EP01410148.9

    申请日：2001-11-05

    Applicant: Cray Inc.

    Inventor： Yatskov, Alexander I. ,  Hellriegel, Stephen V.R.

    IPC: H05K1/11 ,  H05K3/36 ,  H01R12/12

    CPC classification number: H01R12/62 ,  H05K1/11 ,  H05K3/243 ,  H05K3/28 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0949

    Abstract: The flexible connector for high density circuit applications comprises a multi-layer flexible substrate (10) upon which are formed a plurality of contact pads (12), in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads (38) of similar size and configuration are formed on the surface of another device, i.e., circuit board (40), and provision made to align the contact pads (12) of the connector with those (38) of the circuit board (40). Micro-pads (20) are formed on the surface of the contact pads (12) on the connector such, that when the connector is brought into contact with the circuit board (40), and sufficient pressure is applied, the micro-pads (20) make actual electrical contact with the pads (38) of the circuit board (40). Since the total surface area in contact, namely the sum of the surface areas of the micro-pads (20), is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.

    Abstract translation: 用于高密度电路应用的柔性连接器包括多层柔性基板（10），其上形成有特定应用所需的密度的多个接触焊盘（12）。 该密度可能超过每平方英寸200个接触垫。 具有相似尺寸和结构的接触垫（38）形成在另一装置（即，电路板（40））的表面上，并且使连接器的接触焊盘（12）与电路板（38）的对准 （40）。 在连接器上的接触焊盘（12）的表面上形成微焊盘（20），当连接器与电路板（40）接触并施加足够的压力时，微焊盘 20）与电路板（40）的焊盘（38）实际电接触。 由于接触的总表面积，即微焊盘（20）的表面积的总和是连接器总面积的一小部分，所以即使在低接触面处也提供了大的压力 作为整体提供给连接器。

    Uniform pressure pad for electrical contacts
    2.
    发明公开
    Uniform pressure pad for electrical contacts 审中-公开
    Druckkissenfürelektrische Kontakte

    公开(公告)号：EP1204169A1

    公开(公告)日：2002-05-08

    申请号：EP01410146.3

    申请日：2001-11-05

    Applicant: Cray Inc.

    Inventor： Yatskov, Alexander I. ,  Hellriegel, Stephen V.R.

    IPC: H01R13/24

    CPC classification number: H01R13/2414

    Abstract: A uniform pressure pad formed of a resilient material having a plurality of uniform pressure areas formed between a row and column array of cavities formed in the pad thickness. The cavities surrounding the pressure areas allow the resilient pad material to flow evenly thereby providing uniformity in the pressure applied to each pressure area.

    Abstract translation: 由弹性材料形成的均匀的压力垫，其具有形成在衬垫厚度形成的空腔的行和列阵列之间形成的多个均匀的压力区域。 围绕压力区域的空腔允许弹性垫材料均匀流动，从而提供施加到每个压力区域的压力的均匀性。

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