公开(公告)号：EP2863425A2

公开(公告)日：2015-04-22

申请号：EP15150109.5

申请日：2006-04-06

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ,  SHOWA DENKO KABUSHIKI KAISHA

Inventor： Otoshi, Kota ,  Kono, Eiji ,  Kubo, Hidehito ,  Kimbara, Masahiko ,  Furukawa, Yuichi ,  Yamauchi, Shinobu ,  Hoshino, Ryoichi ,  Wakabayashi, Nobuhiro ,  Nakagawa, Shintaro

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/473 ,  H05K3/00 ,  H05K3/34 ,  H01L23/373 ,  H05K1/03 ,  H05K3/40

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/09681 ,  H05K2201/0969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat radiator (1) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate (3). A metal layer (7) is formed on a side of the insulating substrate (3) opposite the heat-generating-element-mounting side. A stress relaxation member (4) intervenes between the metal layer (7) of the insulating substrate (3) and the heat sink (5). The stress relaxation member (4) is formed of an aluminum plate (10) having a plurality of through holes (9) formed therein, and the through holes (9) serve as stress-absorbing spaces. The stress relaxation member (4) is metal-bonded to the metal layer (7) of the insulating substrate (3) and to the heat sink (5). This heat radiator (1) is low in material cost and exhibits excellent heat radiation performance.

Abstract translation: 散热器（1）包括第一侧用作发热元件安装侧的绝缘基板（3）和固定到绝缘基板（3）的第二侧的散热片（5）。 金属层（7）形成在与发热元件安装侧相对的绝缘基板（3）侧。 应力松弛部件（4）介于绝缘基板（3）的金属层（7）和散热片（5）之间。 应力松弛部件（4）由形成有多个通孔（9）的铝板（10）形成，通孔（9）作为应力吸收空间。 应力松弛部件（4）与绝缘基板（3）的金属层（7）和散热片（5）金属接合。 该散热器（1）的材料成本低，散热性能优异。

公开(公告)号：EP2246881A4

公开(公告)日：2014-07-30

申请号：EP09712696

申请日：2009-02-19

Applicant: BARUN ELECTRONICS CO LTD

Inventor： KIM SUNG WOOK

IPC: H01L21/50 ,  H01L23/10

CPC classification number: H01L21/50 ,  H01L23/10 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/0373

公开(公告)号：EP2496061A1

公开(公告)日：2012-09-05

申请号：EP10826347.6

申请日：2010-10-28

Applicant: Panasonic Corporation

Inventor： YOSHIOKA, Shingo ,  FUJIWARA, Hiroaki ,  TAKASHITA, Hiromitsu ,  TAKEDA, Tsuyoshi

IPC: H05K3/34 ,  H01L23/12 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.

Abstract translation: 一种电路板，H10gemäß到本发明是一种电路板H10在电路H6的有包括布线部分和H6A被H6B在绝缘基底基板H1的表面设置的焊盘部。 该电路H6被配置的搜索做了导体H5被嵌入在绝缘基底物H1的表面上形成的电路凹槽H3，和导体的表面粗糙度H5是在布线部H6A和焊盘部分的H6B不同 电路H6。 在这种情况下，优选的是没有在焊盘部的导体H5的表面粗糙度H6B比配线部H6A导体H5的表面粗糙度越大。

公开(公告)号：EP2445322A1

公开(公告)日：2012-04-25

申请号：EP11192444.5

申请日：2010-05-18

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： Yamamoto, Masamichi ,  Nakatsugi, Kyouichirou ,  Yamaguchi, Takashi ,  Kawakami, Shigeki ,  Kimura, Michihiro

IPC: H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost.
[Solution] A connection method according to the present invention includes a step (a3) of preparing a base material (321) including an electrode (322) for connection using an adhesive and an electrode (326) for connection using solder; a step (b3) of covering the electrode for connection using an adhesive and the electrode for connection using solder with oxidation preventing films (325); after the step (b3), a step (c3) of bonding the electrode (322) for connection using an adhesive to a connection conductor (312) with an adhesive (330) containing a thermosetting resin to establish electrical connection; and after the step (c3), a step (d3) of joining the electrode (326) for connection using solder to a connection conductor (342) using solder (350) by solder reflow treatment in a non-oxidizing atmosphere, wherein an increase in connection resistance between the electrode for connection using an adhesive and the connection conductor before and after the step (d3) is within a predetermined range.

Abstract translation: 提供了一种连接方法和电子设备，其中可以简化制造过程，并且可以以低成本生产使用粘合剂的连接结构。 [解决方案]根据本发明的连接方法包括制备包括用于使用粘合剂连接的电极（322）和用于使用焊料进行连接的电极（326）的基材（321）的步骤（a3） 使用粘合剂覆盖用于连接的电极的步骤（b3）和使用具有防氧化膜的焊料的连接用电极（325）; 在步骤（b3）之后，使用粘合剂（330）将用粘合剂连接的电极（322）与含有热固性树脂的连接导体（312）接合以建立电连接的步骤（c3） 在步骤（c3）之后，在非氧化性气氛中通过焊锡回流处理使用焊料（350）将用于使用焊料进行连接的电极（326）连接到连接导体（342）的步骤（d3），其中增加 在步骤（d3）之前和之后，使用粘合剂连接的电极与连接导体之间的连接电阻在预定范围内。

公开(公告)号：EP2257142A1

公开(公告)日：2010-12-01

申请号：EP10003119.4

申请日：2010-03-24

Applicant: Semikron Elektronik GmbH & Co. KG Patentabteilung

Inventor： Sagebaum, Ulrich ,  Radüge, Christian

IPC: H05K3/32 ,  H01C1/14 ,  H01G4/228 ,  H01L21/60

CPC classification number: H05K3/321 ,  H01G4/228 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29298 ,  H01L2224/32059 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H05K2201/0373 ,  H05K2201/068 ,  H05K2203/1131 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Es wird eine Befestigung mindestens eines Bauelementes (12) an einem Substrat (10) und/oder eines Anschlusselementes (14) an dem Bauelement (12) und/oder an dem Substrat (10) durch Drucksintern beschrieben. Zwischen dem Bauelement (12) und dem Substrat (10) und/oder dem Anschlusselement (14) und dem Bauelement (12) und/oder dem Anschlusselement (14) und dem Substrat (10) ist eine die unterschiedlichen Wärmeausdehnungskoeffizienten des Anschlusselementes (14), des Bauelementes (12) und des Substrates (10) ausgleichende Zwischenschicht (16) vorgesehen, die eine Dicke von ≥ 50 µm aufweist. Die Sinter-Zwischenschicht (16) besteht aus Silber oder einer Silberlegierung und ist nicht vollflächig sondern oberflächlich strukturiert ausgebildet.

Abstract translation: 所述紧固件具有的结构元件（12）和一个衬底（10）之间和/或一个连接元件（14）和结构元件之间和/或所述连接元件和所述基板之间设置一个烧结的中间层（16）。 的层补偿基板，连接元件和结构元件的不同热膨胀系数。 该层由银或银合金的，并且表现出厚度小于或等于50微米。 所述层设置有贯通孔（18）没有形成的表面结构。

公开(公告)号：EP1901350A4

公开(公告)日：2010-03-10

申请号：EP06767882

申请日：2006-07-05

Applicant: TOYOTA JIDOSHOKKI KK ,  SHOWA DENKO KK

Inventor： OTOSHI KOTA ,  KONO EIJI ,  TOH KEIJI ,  TANAKA KATSUFUMI ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP1890343A1

公开(公告)日：2008-02-20

申请号：EP06757029.1

申请日：2006-06-06

Applicant: FUJIKURA LTD.

Inventor： TAKEMOTO, Kyosuke c/o Fujikura Ltd. ,  SUZUKI, Ryuji c/o Fujikura Ltd., Sakura Works ,  OHASHI, Masakazu c/o Fujikura Ltd.

IPC: H01L33/00 ,  F21V19/00 ,  F21V29/00 ,  H05K1/05 ,  F21Y101/02

CPC classification number: H05K1/021 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/0373 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In accordance with the present invention, a light-emitting element mounting board is provided including an enamel layer which covers the surface of a core metal, wherein reflective cup portions for mounting light-emitting elements are provided on one face of the board, and wherein a heat radiating part is formed by at least partially removing the enamel layer on the other face of the board, and exposing the core metal. Further, a light-emitting element module including light-emitting elements mounted thereon, a lighting device including the light-emitting element, a display device, and traffic signal equipment are provided.

公开(公告)号：EP1797749A1

公开(公告)日：2007-06-20

申请号：EP05802899.4

申请日：2005-09-29

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： DAVOINE, Cécile ,  MARION, François

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0469 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/81193 ,  H01L2224/81208 ,  H01L2224/81345 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2203/0278 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The invention concerns a method for electrical connection between a first component (10) comprising, on one side, a set of first contacts (8) and a set of hard conductive tips (13) and a second component (11) comprising, on one side, a set of second contacts (9) and a set of ductile conductive protrusions (14), wherein the two sides are placed mutually opposite and brought together so that the tips (13) can penetrate said protrusions (14), wherein the space between two tips (13) is less than the width of a protrusion (14) and than the width of a first contact (8). The invention also concerns such a component provided with a set of hard conductive tips.

公开(公告)号：EP1451831A4

公开(公告)日：2006-11-02

申请号：EP02771903

申请日：2002-11-04

Applicant: COCHLEAR LTD

Inventor： PARKER JOHN ,  EROL HARVEY

IPC: A61F11/00 ,  H05K1/02 ,  B32B7/02 ,  C25D1/10 ,  H01B5/14 ,  H01B13/00 ,  H05K1/00 ,  H05K3/20

CPC classification number: H05K1/0265 ,  C25D1/10 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/0317 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/1152

Abstract: A thin flexible electric conductor for use in implantable devices such as cochlear implants, consists of a conductive metal layer coated on a flexible three dimensionally textured surface so that the current capacity of the conductor is increased relative to the current capacity of a conductor of the same size that is not on a three dimensional surface. The flexible substrate is treated to form a three dimensional surface such as with corrugations and a conductive layer is deposited onto the surface.

公开(公告)号：EP1548824A3

公开(公告)日：2006-08-23

申请号：EP04257575.3

申请日：2004-12-06

Applicant: STMicroelectronics, Inc.

Inventor： Chiu, Anthony M. ,  Tee, Tong Yan

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2924/00014 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45099

Abstract: A system and method is disclosed for improving solder joint reliability in an integrated circuit package. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.

Abstract translation: 公开了一种用于提高集成电路封装中的焊点可靠性的系统和方法。 四边形，平坦的，非引线的集成电路封装的每个端子形成有在端子的底表面中限定焊料槽的部分。 集成电路封装的管芯焊盘的外表面也形成有在管芯焊盘的周边上限定多个焊料槽的部分。 当将焊料施加到管芯焊盘和端子时，填充焊料槽的焊料增加了集成电路封装的焊点可靠性。