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    Method of manufacturing a sealed electronic module
    1.
    发明公开
    Method of manufacturing a sealed electronic module 审中-公开
    Herstellungsverfahren eines abgedichteten elektonischen Moduls

    公开(公告)号：EP1581036A2

    公开(公告)日：2005-09-28

    申请号：EP05005217.4

    申请日：2005-03-10

    Applicant: Delphi Technologies, Inc.

    Inventor： Hunkeler, Hugh R. ,  Fortune, Duane D.

    IPC: H05K5/06

    CPC classification number: H05K5/064 ,  B60R16/0239 ,  H05K3/284 ,  H05K3/361 ,  H05K5/0039 ,  H05K7/1417 ,  H05K7/142 ,  H05K7/20463 ,  H05K2201/10189 ,  H05K2201/10977

    Abstract: A circuit board (28) is inserted into an open-ended housing (10) and potting material (56) is dispensed onto the exposed face of the circuit board (28) in a single step to seal the circuit board (28) to the housing (10). One or more electrical interconnects such as a connector header (50) or a ribbon cable (42) attached to the circuit board (28) extend upward through the potting material (56) so that the potting material (56) also forms an environmental seal around the electrical interconnects (42/50).

    Abstract translation: 将电路板（28）插入到开放式端部壳体（10）中，并且将灌封材料（56）以一个步骤分配到电路板（28）的暴露面上，以将电路板（28）密封到 房屋（10）。 附接到电路板（28）的连接器集管（50）或带状电缆（42）的一个或多个电互连件向上延伸穿过灌封材料（56），使得灌封材料（56）也形成环境密封 围绕电互连（42/50）。

    Child seat and method for monitoring installation of the child seat
    3.
    发明公开
    Child seat and method for monitoring installation of the child seat 有权
    儿童座椅和方法监测儿童座椅安装

    公开(公告)号：EP2072324A3

    公开(公告)日：2015-11-11

    申请号：EP08171458.6

    申请日：2008-12-12

    Applicant: Delphi Technologies, Inc.

    Inventor： Hinze, Lee R. ,  Hunkeler, Hugh R.

    IPC: B60N2/28

    CPC classification number: B60N2/2806 ,  B60N2/2812 ,  B60N2002/2815

    Abstract: A child seat (20) and a method for monitoring installation of the child seat (20) are provided. The child seat (20) includes a child seat frame (40) configured to receive a child occupant. The child seat frame (40) is configured to receive a seat belt webbing (24) for securing the child seat frame (40) to a vehicle seat (22). The child seat (20) further includes a first bladder (44) configured to contact the seat belt webbing (24). The first bladder (44) has a fluid therein. The child seat (20) further includes a first pressure sensor (52) fluidly communicating with the fluid in the first bladder (44). The first pressure sensor (52) is configured to output a first signal indicative of an amount of pressure in the first bladder (44). The child seat (20) further includes a controller (56) coupled to the child seat frame (40) configured to receive the first signal and to compute a first tension value based on the first signal. The controller (56) is further configured to generate a second signal to induce a first device disposed on the child seat frame (40) to indicate when the first tension value is less than a first predetermined tension value.

    Sealed electronic module with seal-in-place connector header
    7.
    发明公开
    Sealed electronic module with seal-in-place connector header 有权
    Abgedichtes elekronisches Modul mit einemörtlichabgedichten Verbinder

    公开(公告)号：EP1689219A2

    公开(公告)日：2006-08-09

    申请号：EP06075222.7

    申请日：2006-02-01

    Applicant: Delphi Technologies, Inc.

    Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Fortune, Duane D.

    IPC: H05K5/06 ,  H05K5/00

    CPC classification number: H05K5/064 ,  H01R13/5202 ,  H01R13/5216 ,  H05K3/284 ,  H05K5/0069 ,  H05K2201/10189 ,  Y10S439/936

    Abstract: A sealed electronic module includes a housing (10) having an open end for receiving a circuit board (26), and a slotted side wall (14) for receiving a connector header (34) mounted on the circuit board (26). The connector header (34) fits snugly in the side wall slot (32) and includes an integral trough (44) that engages the interior face of the side wall (14) to form a U-shaped channel that surrounds the sides and bottom of the slot (32). The housing (10) is positioned with its open end upward, and potting material (52) is dispensed onto the exposed surface of the circuit board (26) in a single step to seal the circuit board (26) to the housing (10). A portion of the potting material (52) flows into and fills the U-shaped channel to seal the connector header (34) to the housing (10).

    Abstract translation: 密封的电子模块包括具有用于接收电路板（26）的开口端的壳体（10）和用于接收安装在电路板（26）上的连接器集管（34）的开槽侧壁（14）。 连接器集管（34）紧密地配合在侧壁槽（32）中并且包括与侧壁（14）的内表面接合的整体槽（44），以形成U形通道，该通道围绕侧壁 槽（32）。 壳体（10）以其开口端向上定位，并且灌封材料（52）以单个步骤分配到电路板（26）的暴露表面上，以将电路板（26）密封到壳体（10） 。 灌封材料（52）的一部分流入并填充U形通道以将连接器集管（34）密封到壳体（10）。

    Sealed electronic module with seal-in-place connector header
    9.
    发明公开
    Sealed electronic module with seal-in-place connector header 有权
    密封电子模块，带有密封就地连接头

    公开(公告)号：EP1689219A3

    公开(公告)日：2009-01-21

    申请号：EP06075222.7

    申请日：2006-02-01

    Applicant: Delphi Technologies, Inc.

    Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Fortune, Duane D.

    IPC: B60R16/023 ,  H05K3/28 ,  H05K5/06 ,  H05K5/00

    CPC classification number: H05K5/064 ,  H01R13/5202 ,  H01R13/5216 ,  H05K3/284 ,  H05K5/0069 ,  H05K2201/10189 ,  Y10S439/936

    Abstract: A sealed electronic module includes a housing (10) having an open end for receiving a circuit board (26), and a slotted side wall (14) for receiving a connector header (34) mounted on the circuit board (26). The connector header (34) fits snugly in the side wall slot (32) and includes an integral trough (44) that engages the interior face of the side wall (14) to form a U-shaped channel that surrounds the sides and bottom of the slot (32). The housing (10) is positioned with its open end upward, and potting material (52) is dispensed onto the exposed surface of the circuit board (26) in a single step to seal the circuit board (26) to the housing (10). A portion of the potting material (52) flows into and fills the U-shaped channel to seal the connector header (34) to the housing (10).

    Abstract translation: 密封电子模块包括具有用于接收电路板（26）的开口端的壳体（10）和用于接收安装在电路板（26）上的连接器头部（34）的开槽侧壁（14）。 连接器头部（34）紧贴地装配在侧壁槽（32）中并且包括与侧壁（14）的内表面接合以形成U形通道的整体槽（44），该U形通道围绕侧壁 槽（32）。 壳体（10）以其开口端朝上的方式定位，并且封装材料（52）在单个步骤中分配到电路板（26）的暴露表面上以将电路板（26）密封到壳体（10） 。 灌封材料（52）的一部分流入并填充U形通道以将连接器头部（34）密封到壳体（10）。

    Stand-off mounting apparatus for discrete electrical components
    10.
    发明公开
    Stand-off mounting apparatus for discrete electrical components 审中-公开
    Abstandsmontagegerätfürgetrennte elektrische Komponenten

    公开(公告)号：EP1996000A2

    公开(公告)日：2008-11-26

    申请号：EP08155194.7

    申请日：2008-04-25

    Applicant: Delphi Technologies, Inc.

    Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

    IPC: H05K3/00

    CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

    Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

    Abstract translation: 一种支架安装装置（10/50/80）包括用于板外安装有铅或表面安装部件（18,20 / 58-62 / 92-96）的绝缘载体（12/52/82） 特别是大的温度敏感分立元件，如电容器。 载体（12/52/82）具有相对于电路板（14）升高的部件安装表面，并且相对于电路板（14）定位，使得电路板面积在 载体（12/52/82）可用于放置较小的非温度敏感组件。 车外部件（18,20 / 58-62 / 92-96）安装在载体（12/52/82）的部件安装表面上，并且载体（82）可以包括支撑特征（102） 用于为部件（92-96）提供额外的机械支撑。 用于将升高的部件（18,20 / 58-62 / 92-96）电连接到电路板（14）的电引线（16/56/88）可以嵌入成型在载体（12/52）中，或 可插入载体（82）中的电镀通孔（110）中。

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