公开(公告)号：EP2919565A4

公开(公告)日：2016-07-13

申请号：EP13852709

申请日：2013-10-29

Applicant: KITAGAWA IND CO LTD

Inventor： NAKAMURA TATSUYA

IPC: H05K3/30 ,  H01G2/06 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: A capacitor holder comprises: a holding portion made of a resin to have a cylindrical inner wall surface, at least an outer peripheral portion of the inner wall surface being open, the holding portion being configured to hold a capacitor inserted through the opening into an inside of the inner wall surface while elastically deforming the resin; a fixed portion formed of the resin integrally with the holding portion and positioned opposite to the opening of the holding portion; a pair of fitting grooves formed at a pair of end surfaces of the fixed portion opposed to each other adjacent to the holding portion, the fitting grooves being configured to fittably engage with end edges of a printed circuit board to extend along a surface of the printed circuit board; and a proximity suppressor formed of the resin as a part of the fixed portion and configured to suppress portions of the fixed portion where the fitting grooves are formed from being brought into proximity each other.

公开(公告)号：EP2563106A3

公开(公告)日：2015-04-08

申请号：EP12169496.2

申请日：2012-05-25

Applicant: Kabushiki Kaisha Yaskawa Denki

Inventor： Sasahara, Kenta ,  Mizumoto, Junya ,  Sakai, Masafumi

IPC: H05K3/30 ,  H05K3/34 ,  H01G2/04 ,  H01G4/38 ,  H01G9/26 ,  H01G2/06

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G9/26 ,  H05K3/303 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10454 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2201/2045

Abstract: Provided is a lead component holder and an electronic device capable of improving vibration resistance performance. A lead component holder (10) includes a plurality of supporting portions (30a, 30b, 30c) each supporting one of lead components (C) at a position distant from a component mounting surface of a substrate (22), and at least one of coupling members (32a, 32b) respectively coupling the adjacent supporting portions (30a, 30b) and (30b, 30c) at a position distant from the component mounting surface. An electronic device (12) includes the substrate (22), the lead component holder (10), and an electronic component mounted to the substrate (22) located below the coupling members (32a, 32b).

公开(公告)号：EP2712282A2

公开(公告)日：2014-03-26

申请号：EP13177904

申请日：2013-07-24

Applicant: JOHNSON & JOHNSON VISION CARE

Inventor： PUGH RANDALL B ,  RIALL JAMES DANIEL ,  OTTS DANIEL B ,  TONER ADAM ,  FLITSCH FREDERICK A

IPC: H05K1/02 ,  B29D11/00 ,  G02C7/04 ,  H01L23/04

CPC classification number: G02C7/083 ,  B29D11/00038 ,  B29D11/00817 ,  G02C7/04 ,  G02C7/049 ,  H01L23/04 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K2201/10568 ,  H05K2201/10583 ,  H01L2924/00

Abstract: Methods to form a device whereon flexible component elements are attached upon three-dimensional surfaces are described. In some aspects, the present invention includes incorporating flexible semiconductor devices onto three-dimensional surfaces with electrical contacts. In some aspects, the formed device may be incorporated in an ophthalmic device.

Abstract translation: 描述了在三维表面上形成柔性元件附着的装置的方法。 在一些方面，本发明包括将柔性半导体器件结合到具有电触点的三维表面上。 在一些方面，所形成的装置可以结合在眼科装置中。

公开(公告)号：EP1883282B1

公开(公告)日：2012-01-18

申请号：EP07014532.1

申请日：2007-07-24

Applicant: DENSO CORPORATION

Inventor： Kawabata, Akira ,  Fukaya, Yuichiro

IPC: H05K3/30 ,  H05K5/02 ,  H05K1/18 ,  H01M2/10

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

公开(公告)号：EP1459611B1

公开(公告)日：2011-06-22

申请号：EP02798283.4

申请日：2002-12-19

Applicant: ROBERT BOSCH GMBH

Inventor： SCHIEFER, Peter

IPC: H05K5/00

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0056 ,  H05K5/0069 ,  H05K9/0037 ,  H05K9/0049 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10583 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The invention relates to a housing system for an electric device (1), which has at least two housing parts (2, 3) and an electronic circuit arranged on a circuit board (4) therein, provided with a conductive layer which is connected to the ground of at least one metallic housing part (2). The housing part (3) is made of a plastic part. At least the connecting device (9) for the voltage source of the device and/or the signal transmission to the electronic circuit is integrated therein. The circuit board (4) is covered on both sides. Perturbing-radiation-sensitive components (5) are arranged on the side thereof, and are continuously surrounded by the metallic housing part (2) and the conductive layer, and other components (6) and contacts of the connecting device (9) are arranged on the other side of the circuit board (4).

公开(公告)号：EP1742507B1

公开(公告)日：2010-09-15

申请号：EP06014139.7

申请日：2006-07-07

Applicant: Hosiden Corporation

Inventor： Izuchi, Toshiro c/o Hosiden Kyushu Corp. ,  Ono, Kazuo c/o Hosiden Kyushu Corp. ,  Nakanishi, Kensuke c/o Hosiden Kyushu Corp. ,  Onishi, Hiroaki c/o Hosiden Kyushu Corp.

IPC: H04R19/00

CPC classification number: H05K3/341 ,  H04R1/06 ,  H04R19/016 ,  H04R31/006 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K2203/1178 ,  Y02P70/613

公开(公告)号：EP1996000A3

公开(公告)日：2009-07-22

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

公开(公告)号：EP0556184A1

公开(公告)日：1993-08-25

申请号：EP91914556.0

申请日：1991-08-15

Applicant: HILLER, Peter

Inventor： HILLER, Peter

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/184 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10659

Abstract: La présente invention se rapporte à une plaquette à circuits imprimés comportant des composants électriques, où les composants avec leurs corps isolés (3) sont placés dans des trous de passage (10) de la plaquette à circuits imprimés (9), et où ils sont légèrement en saillie sur le dessous et sur le dessus de la plaquette, en portant dans ces zones des surfaces de contact, lesquelles sont brasées à des pistes conductrices de la plaquette. Les extrémités inférieures des composants se terminent en forme de calotte hémisphérique ou en pointes arrondies et présentent des surfaces de contact inférieures correspondantes, lesquelles font saillie dans des pistes conductrices de la plaquette à circuits imprimés (9) se présentant sous forme de pastilles (7) et lesquelles sont brasées à ces dernières. Les extrémités supérieures des composants portent plusieurs surfaces de contact supérieures (1.1, 1.2) isolées les unes des autres, lesquelles sont reliées à des éléments de contact (2.1, 2.2) en saillie du corps (3) et reliées en pont autour des trous (10) de la plaquette à circuits imprimés, au moyen d'une pâte à braser (5), à des pistes conductrices (6) du dessus de la plaquette à circuits imprimés.

公开(公告)号：EP3200568A1

公开(公告)日：2017-08-02

申请号：EP17151706.3

申请日：2017-01-17

Applicant: BIOTRONIK SE & Co. KG

Inventor： Henschel, Martin

IPC: H05K1/02 ,  H01R4/02 ,  H05K3/32 ,  B23K26/00 ,  H05K3/22 ,  H05K3/40

CPC classification number: H01R11/01 ,  A61N1/3758 ,  B23K26/22 ,  B23K26/242 ,  B23K26/28 ,  B23K26/32 ,  B23K2201/36 ,  B23K2201/38 ,  H01M2/204 ,  H01R4/029 ,  H01R43/0221 ,  H05K1/0293 ,  H05K3/222 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/10053 ,  H05K2201/10181 ,  H05K2201/10242 ,  H05K2201/10363 ,  H05K2201/10583 ,  H05K2203/107 ,  H05K2203/173

Abstract: Die Erfindung betrifft eine Batteriebrücke (1) für eine elektronische Vorrichtung, vorzugsweise für ein elektronisches Implantat. Um einen Stromkreis einer derartigen Vorrichtung einfach und mittels eines automatischen Verfahrens aktivieren zu können, besitzt die Batteriebrücke erfindungsgemäß ein elektrisch leitendes erstes Kontaktelement (11), ein elektrisch leitendes zweites Kontaktelement (12) und einen Isolator (13), wobei das erste Kontaktelement und das zweite Kontaktelement ein schweißbares Material aufweisen,
wobei in einem ersten Zustand der Batteriebrücke das erste Kontaktelement über einen vorgegebenen Luftspalt beabstandet von dem zweiten Kontaktelement angeordnet ist und das erste Kontaktelement durch den Luftspalt und den Isolator elektrisch von dem zweiten Kontaktelement isoliert ist,
wobei die Batteriebrücke derart ausgebildet ist, dass sie mittels Verschweißen (40) des ersten Kontaktelements und des zweiten Kontaktelements miteinander in einen zweiten Zustand überführbar ist, bei dem der Luftspalt zwischen dem ersten Kontaktelement und dem zweiten Kontaktelement zumindest abschnittsweise elektrisch leitend geschlossen ist (42).
Die Erfindung betrifft ferner ein Verfahren zum Aktivieren einer elektronischen Vorrichtung mit einem elektrischen Schaltkreis und einer derartigen Batteriebrücke.

Abstract translation: 本发明涉及一种用于电子设备的电池桥（1），优选用于电子植入物。 为了激活该装置的电路和装置简单地自动过程根据本发明的导电的第一接触元件（11），导电的第二接触元件（12）和绝缘体（13）具有电池桥，所述第一接触元件和所述 具有可焊接的材料的第二接触元件，其特征在于，在电池电桥的第一状态超过预定气隙的第一接触元件从所述第二接触元件和所述第一接触元件间隔开的电通过空气间隙与所述第二接触元件的绝缘体，其中，所述电池电桥以这样的方式分离 被设计成使得它在所述第一接触构件和第二接触元件abschnittswe之间的空气间隙的至少由所述第一接触构件和在第二状态的第二接触元件彼此的焊接（40）的装置可以被转移， 导电的导体闭合（42）。 本发明进一步涉及用于激活具有电路和电池桥的电子设备的方法。

公开(公告)号：EP2909876A1

公开(公告)日：2015-08-26

申请号：EP14701570.5

申请日：2014-01-28

Applicant: Alligator Ventilfabrik GmbH

Inventor： MARKERT, Christian

IPC: H01M2/02 ,  H01M2/10 ,  H05K3/32 ,  H01R13/24 ,  B60C23/04

CPC classification number: H01M2/0222 ,  B60C23/04 ,  B60C23/041 ,  B60C23/0494 ,  H01M2/026 ,  H01M2/0277 ,  H01M2/1044 ,  H01M2/20 ,  H01M2220/30 ,  H05K3/3426 ,  H05K2201/10151 ,  H05K2201/10583 ,  Y02P70/613

Abstract: The invention relates to a button cell, in particular for a tyre pressure sensor, comprising: a first electric pole formed by a first front face and a second electric pole formed by a second front face opposite said first front face; a first contact tab which is mounted on the first front face and has a substantially planar extension within the plane of the first front face, or a first contact tab which is formed by the first front face; a second contact tab which is mounted on the second front face and which extends in an angled manner from the plane of the second front face substantially into the plane of the first front face; an insulating layer provided on the button cell, at least in the region of the first and second contact tabs, or over the external circumference of the button cell; The invention is characterised in that the insulating layer has a plurality of openings which completely penetrate said layer and which are distributed over the surface of the insulating layer.