公开(公告)号：EP2866534A1

公开(公告)日：2015-04-29

申请号：EP13807421.6

申请日：2013-06-21

Applicant: Kyocera Corporation

Inventor： OHASHI,Yoshio ,  SHIKATA,Kunihide

IPC: H05K3/38 ,  H05K1/09 ,  H05K3/12

CPC classification number: H05K1/181 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/59 ,  C04B2237/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/388 ,  H05K2201/10462 ,  H05K2201/2063 ,  Y02P70/611 ,  H01L2924/00014

Abstract: [Object] To provide a highly reliable circuit board which can be used for a long period of time and an electronic apparatus including this circuit board and an electronic component mounted thereon.
[Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.

Abstract translation: 本发明的目的在于提供一种能够长期使用的高可靠性的电路基板以及搭载该电路基板和电子部件的电子设备。 该电路板包括陶瓷烧结体（11）和设置在其至少一个主表面（11a）上的金属布线层（13），其间插入玻璃层（12），并且当 观察垂直于陶瓷烧结体（11）的主表面（11a）的电路板，玻璃层（12）和金属布线层（13）之间的界面（15）的长度与长度 所述玻璃层（12）的沿着所述主面（11a）的方向的宽度（12a）为1.25〜1.80。 结果，可以获得良好的散热特性，并且由于电子部件（21）的操作和/或冷却/冷却，金属布线层（13）不容易从陶瓷烧结体（11） 通过反复开关操作进行加热循环，从而可以提供可长期使用的高度可靠的电路板。

公开(公告)号：EP1876695B1

公开(公告)日：2008-12-17

申请号：EP06014158.7

申请日：2006-07-07

Applicant: Tinyplug Technology (Shenzhen) Limited

Inventor： Zhenghong, Zhou

IPC: H02M3/335

CPC classification number: H01R13/6675 ,  H01F27/04 ,  H01F27/323 ,  H01F27/367 ,  H01F27/38 ,  H01F27/40 ,  H02M3/33523 ,  H05K1/0256 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2203/0191 ,  H05K2203/1572

公开(公告)号：EP1458226A2

公开(公告)日：2004-09-15

申请号：EP04250498.5

申请日：2004-01-29

Applicant: Fujitsu Hitachi Plasma Display Limited

Inventor： Koizumi, Haruo, Fujitsu Hitachi P. D. Ltd. ,  Onozawa, Makoto, Fujitsu Hitachi P. D. Ltd.

IPC: H05K1/18 ,  H05K1/16 ,  H01F27/02 ,  H01F17/00

CPC classification number: H05K1/18 ,  H01F5/003 ,  H01F17/0033 ,  H01F27/22 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/165 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board assembly (10) has a flat coil element (13) mounted on a circuit board (11) so that an electric power loss is not generated even when the flat coil element (13) is mounted to the circuit board (11) together with a circuit part (15) having a large heat sink (16). A module mounted (11) on the circuit board has an electronic circuit device (15) and a heat radiator (16) attached to the electronic circuit device (15). The heat radiator (16) has an extending part (16a) protruding from the electronic circuit device (15) and extending parallel to a surface of the circuit board (11). A coil mounting area provided with no pattern wire is formed in a part of the circuit board (11) facing the extending part (16a). The flat coil element (13) is mounted parallel to the circuit board (11) in a state where a coil part of the flat coil element (13) faces the coil mounting area.

Abstract translation: 电路板组件（10）具有安装在电路板（11）上的扁平线圈元件（13），使得即使当扁平线圈元件（13）安装到电路板（11）时也不产生电力损耗， 以及具有大散热器（16）的电路部分（15）。 安装在电路板上的模块（11）具有安装在电子电路装置（15）上的电子电路装置（15）和散热器（16）。 散热器（16）具有从电子电路装置（15）突出并平行于电路板（11）的表面延伸的延伸部分（16a）。 在电路板（11）的与延伸部分（16a）相对的部分中形成没有图案线的线圈安装区域。 在扁平线圈元件（13）的线圈部分面向线圈安装区域的状态下，扁平线圈元件（13）平行于电路板（11）安装。

公开(公告)号：EP2757613B1

公开(公告)日：2015-11-18

申请号：EP13183848.4

申请日：2013-09-11

Applicant: Samsung SDI Co., Ltd.

Inventor： Yi, Sang-Il ,  Kang, Moon-Gil

IPC: H01M2/20 ,  H01M2/34 ,  H01M10/42 ,  H05K1/00 ,  H05K3/34 ,  H05K3/40 ,  H01M2/10

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP2525399A1

公开(公告)日：2012-11-21

申请号：EP10856616.7

申请日：2010-11-16

Applicant: ZTE Corporation

Inventor： LV, Fei ,  GE, Hu ,  SONG, Jie

IPC: H01L23/31 ,  H01L23/48 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

Abstract translation: 本公开公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝着PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。

公开(公告)号：EP2182784A1

公开(公告)日：2010-05-05

申请号：EP09170533.5

申请日：2009-09-17

Applicant: MEDISON CO., LTD.

Inventor： Jin, Gil Ju ,  Park, Jung Lim ,  Kim, Jae Yk

IPC: H05K1/02 ,  B06B1/06 ,  B29C65/48 ,  B29C65/00 ,  B23K1/20

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Disclosed herein are a PCB and a probe including the same. The probe includes a transducer (110; 710), a PCB (120; 220; 320; 420; 520; 620; 720) having a pattern part (125; 225; 325; 425; 525; 625) contacting the transducer (110; 710) via face-to-face contact, and a bonding member (130) bonding the transducer (110; 710) to the pattern part (125; 225; 325; 425; 525; 625) of the PCB (120; 220; 320; 420; 520; 620; 720). A bonding part of the PCB (120; 220; 320; 420; 520; 620; 720) is provided with the pattern part (125; 225; 325; 425; 525; 625) to increase a bonding area of the bonding part and to allow the bonding member (130) to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer (110; 710) and the PCB (120; 220; 320; 420; 520; 620; 720). As a result, the transducer (110; 710) can be reliably bonded to the PCB (120; 220; 320; 420; 520; 620; 720), so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 本文公开了一种PCB和包括该PCB的探针。 所述探头包括换能器（110; 710），具有与所述换能器（110）接触的图案部分（125; 225; 325; 425; 525; 625）的PCB（120; 220; 320; 420; 520; ;将所述换能器（110; 710）连接到所述PCB（120; 220）的图案部分（125; 225; 325; 425; 525; 625）上的接合部件（130） ; 320; 420; 520; 620; 720）。 PCB（120; 220; 320; 420; 520; 620; 720）的接合部分设置有图案部分（125; 225; 325; 425; 525; 625），以增加接合部分的接合面积， 以允许接合部件（130）不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善换能器（110; 710）和PCB（120; 220; 320; 320）之间的结合力。 420; 520; 620; 720）。 结果，传感器（110; 710）可以可靠地结合到PCB（120; 220; 320; 420; 520; 620; 720），从而可以防止换能器的性能由于连接不良而被劣化 在PCB和传感器之间。

公开(公告)号：EP1996000A3

公开(公告)日：2009-07-22

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

公开(公告)号：EP1714535A1

公开(公告)日：2006-10-25

申请号：EP04804614.8

申请日：2004-11-30

Applicant: ROBERT BOSCH GMBH

Inventor： MUELLER, Wolfgang ,  UHLAND, Thomas ,  SCHMIDT, Dirk ,  DEGIRMENCI, Ibrahim ,  DISTLER, Frank

IPC: H05K7/20 ,  H05K5/00 ,  B60R16/02

CPC classification number: H05K3/301 ,  H05K1/18 ,  H05K3/0061 ,  H05K5/0056 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/2045

Abstract: A device (10) for the vibration-proof mounting of electric special components (11, 12) and/or electric circuits, particularly configured as a second assembly level in a control unit, is comprised of a support (13) to which a circuit support (14) having special components (11, 12) fastened thereto is applied at least to a portion of the support surface in an electrically insulated manner, preferably by gluing.

公开(公告)号：EP0983713A1

公开(公告)日：2000-03-08

申请号：EP99915500.5

申请日：1999-03-04

Applicant: Patent-Treuhand-Gesellschaftfür elektrische Glühlampen mbH

Inventor： FRANCK, Felix

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K13/04 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10651

Abstract: The invention relates to the spatial arrangement of radially and axially cabled components on a circuit card (4). According to the invention, at least one axially cabled component, e.g. a diode (2), and optionally an axial SMD component, are arranged beneath at least one radially cabled component, e.g. an encased capacitor (1) and directly adjacent to the leads thereof (7, 8). In another embodiment, the body of the axially cabled component (2) is partly surrounded by at least one lead (7) of the radially cabled component (1), thus optimally utilizing the space beneath said component (1).

公开(公告)号：EP0522633A2

公开(公告)日：1993-01-13

申请号：EP92201948.4

申请日：1992-06-30

Applicant: Philips Electronics N.V.

Inventor： Bax, Fransiscus Wilhelmus Maria

IPC: H01R33/09

CPC classification number: H05K3/301 ,  H01R12/58 ,  H01R33/09 ,  H05K2201/10462 ,  H05K2201/10568 ,  H05K2201/10606 ,  H05K2203/167 ,  Y10S362/80

Abstract: The elctric lamp having a cap (10) of synthetic resin is suitable for use on a printed circuit board (6). The cap (10) has resilient arms (15) extending alongside a plane (8) through the axis (2) of the lamp vessel (1). The holder portion (11) of the cap (3) holding the lamp vessel (1), and the arms (3) can clamp a p.c.b. (6) in between them. Means (19, 21) may be present to keep the lamp fixed in an opening (9) in p.c.b. (6) or at an edge thereof. The lamp requires little space on a p.c.b.

Abstract translation: 具有合成树脂的盖（10）的电弧灯适用于印刷电路板（6）。 盖（10）具有通过灯容器（1）的轴线（2）沿平面（8）延伸的弹性臂（15）。 保持灯泡（1）的盖（3）的保持部（11）和臂（3）可以夹住p.c.b。 （6）之间。 可以存在装置（19,21）以将灯固定在p.c.b中的开口（9）中。 （6）或其边缘。 灯泡在p.c.b上几乎没有空间。