公开(公告)号：EP1689219A2

公开(公告)日：2006-08-09

申请号：EP06075222.7

申请日：2006-02-01

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Fortune, Duane D.

IPC: H05K5/06 ,  H05K5/00

CPC classification number: H05K5/064 ,  H01R13/5202 ,  H01R13/5216 ,  H05K3/284 ,  H05K5/0069 ,  H05K2201/10189 ,  Y10S439/936

Abstract: A sealed electronic module includes a housing (10) having an open end for receiving a circuit board (26), and a slotted side wall (14) for receiving a connector header (34) mounted on the circuit board (26). The connector header (34) fits snugly in the side wall slot (32) and includes an integral trough (44) that engages the interior face of the side wall (14) to form a U-shaped channel that surrounds the sides and bottom of the slot (32). The housing (10) is positioned with its open end upward, and potting material (52) is dispensed onto the exposed surface of the circuit board (26) in a single step to seal the circuit board (26) to the housing (10). A portion of the potting material (52) flows into and fills the U-shaped channel to seal the connector header (34) to the housing (10).

Abstract translation: 密封的电子模块包括具有用于接收电路板（26）的开口端的壳体（10）和用于接收安装在电路板（26）上的连接器集管（34）的开槽侧壁（14）。 连接器集管（34）紧密地配合在侧壁槽（32）中并且包括与侧壁（14）的内表面接合的整体槽（44），以形成U形通道，该通道围绕侧壁 槽（32）。 壳体（10）以其开口端向上定位，并且灌封材料（52）以单个步骤分配到电路板（26）的暴露表面上，以将电路板（26）密封到壳体（10） 。 灌封材料（52）的一部分流入并填充U形通道以将连接器集管（34）密封到壳体（10）。

公开(公告)号：EP2088840A3

公开(公告)日：2010-03-31

申请号：EP09151627.8

申请日：2009-01-29

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/30

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

Abstract: An electronic component assembly includes an electrical component (12) assembled to a base (14) and mounted to a support (16). The component electrical leads (20,21) protrude through holes, along a channel, and make contact with connectors (38) on the base. The base (14) is formed of a polymeric material and contains protrusions (44) for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component (12) and the support (16).

公开(公告)号：EP2088840A2

公开(公告)日：2009-08-12

申请号：EP09151627.8

申请日：2009-01-29

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/30

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

Abstract: An electronic component assembly includes an electrical component (12) assembled to a base (14) and mounted to a support (16). The component electrical leads (20,21) protrude through holes, along a channel, and make contact with connectors (38) on the base. The base (14) is formed of a polymeric material and contains protrusions (44) for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component (12) and the support (16).

Abstract translation: 电子部件组件包括组装到基座（14）并安装到支撑件（16）上的电气部件（12）。 部件电引线（20,21）沿着通道突出穿过孔，并与基座上的连接器（38）接触。 基座（14）由聚合物材料形成并且包含用于机械地支撑电气部件的凸起（44）。 当基座安装到支撑件上时，连接器完成电气部件（12）和支撑件（16）之间的电连接。

公开(公告)号：EP2088840B1

公开(公告)日：2016-08-31

申请号：EP09151627.8

申请日：2009-01-29

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/30 ,  H01G2/06 ,  H01G2/10 ,  H01R12/58 ,  H05K3/32

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

公开(公告)号：EP1996000A3

公开(公告)日：2009-07-22

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

公开(公告)号：EP1689219B1

公开(公告)日：2011-11-23

申请号：EP06075222.7

申请日：2006-02-01

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Fortune, Duane D.

IPC: B60R16/023 ,  H05K3/28 ,  H05K5/06 ,  H05K5/00

CPC classification number: H05K5/064 ,  H01R13/5202 ,  H01R13/5216 ,  H05K3/284 ,  H05K5/0069 ,  H05K2201/10189 ,  Y10S439/936

公开(公告)号：EP1689219A3

公开(公告)日：2009-01-21

申请号：EP06075222.7

申请日：2006-02-01

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Fortune, Duane D.

IPC: B60R16/023 ,  H05K3/28 ,  H05K5/06 ,  H05K5/00

CPC classification number: H05K5/064 ,  H01R13/5202 ,  H01R13/5216 ,  H05K3/284 ,  H05K5/0069 ,  H05K2201/10189 ,  Y10S439/936

Abstract: A sealed electronic module includes a housing (10) having an open end for receiving a circuit board (26), and a slotted side wall (14) for receiving a connector header (34) mounted on the circuit board (26). The connector header (34) fits snugly in the side wall slot (32) and includes an integral trough (44) that engages the interior face of the side wall (14) to form a U-shaped channel that surrounds the sides and bottom of the slot (32). The housing (10) is positioned with its open end upward, and potting material (52) is dispensed onto the exposed surface of the circuit board (26) in a single step to seal the circuit board (26) to the housing (10). A portion of the potting material (52) flows into and fills the U-shaped channel to seal the connector header (34) to the housing (10).

Abstract translation: 密封电子模块包括具有用于接收电路板（26）的开口端的壳体（10）和用于接收安装在电路板（26）上的连接器头部（34）的开槽侧壁（14）。 连接器头部（34）紧贴地装配在侧壁槽（32）中并且包括与侧壁（14）的内表面接合以形成U形通道的整体槽（44），该U形通道围绕侧壁 槽（32）。 壳体（10）以其开口端朝上的方式定位，并且封装材料（52）在单个步骤中分配到电路板（26）的暴露表面上以将电路板（26）密封到壳体（10） 。 灌封材料（52）的一部分流入并填充U形通道以将连接器头部（34）密封到壳体（10）。

公开(公告)号：EP1996000A2

公开(公告)日：2008-11-26

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

Abstract translation: 一种支架安装装置（10/50/80）包括用于板外安装有铅或表面安装部件（18,20 / 58-62 / 92-96）的绝缘载体（12/52/82） 特别是大的温度敏感分立元件，如电容器。 载体（12/52/82）具有相对于电路板（14）升高的部件安装表面，并且相对于电路板（14）定位，使得电路板面积在 载体（12/52/82）可用于放置较小的非温度敏感组件。 车外部件（18,20 / 58-62 / 92-96）安装在载体（12/52/82）的部件安装表面上，并且载体（82）可以包括支撑特征（102） 用于为部件（92-96）提供额外的机械支撑。 用于将升高的部件（18,20 / 58-62 / 92-96）电连接到电路板（14）的电引线（16/56/88）可以嵌入成型在载体（12/52）中，或 可插入载体（82）中的电镀通孔（110）中。