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公开(公告)号：EP0144063A3
公开(公告)日：1987-05-20
申请号：EP84114367
申请日：1984-11-28
IPC分类号： H05K03/46
CPC分类号： H05K3/102 , H05K3/0023 , H05K3/185 , H05K3/246 , H05K3/4661 , H05K2201/0195 , H05K2201/0347 , H05K2201/09509 , H05K2203/0505 , H05K2203/0525 , H05K2203/0577 , H05K2203/072 , Y10T29/49155 , Y10T29/49204
摘要： @ A process for preparing a two layer printed circuit having conductive interconnections wherein at least one layer of a photoadhesive composition is applied to a substrate bearing an electrically conductive circuit pattern and exposing said photoadhesive layer or layers through a circuit image of three different optical densities, i.e., zero, gray and opaque, removing portions of the photosensitive layer by solvent washout, applying finely divided metal, alloy or plating catalyst to adherent image areas, optionally curing the printed circuit, e.g., heating or ultraviolet exposure and plating to form an interconnected electrically conductive circuit pattern. Multilayer printed circuits can also be prepared by repeating the steps using additional layers of photoadhesive material.
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公开(公告)号：EP0144063A2
公开(公告)日：1985-06-12
申请号：EP84114367.0
申请日：1984-11-28
IPC分类号： H05K3/46
CPC分类号： H05K3/102 , H05K3/0023 , H05K3/185 , H05K3/246 , H05K3/4661 , H05K2201/0195 , H05K2201/0347 , H05K2201/09509 , H05K2203/0505 , H05K2203/0525 , H05K2203/0577 , H05K2203/072 , Y10T29/49155 , Y10T29/49204
摘要： @ A process for preparing a two layer printed circuit having conductive interconnections wherein at least one layer of a photoadhesive composition is applied to a substrate bearing an electrically conductive circuit pattern and exposing said photoadhesive layer or layers through a circuit image of three different optical densities, i.e., zero, gray and opaque, removing portions of the photosensitive layer by solvent washout, applying finely divided metal, alloy or plating catalyst to adherent image areas, optionally curing the printed circuit, e.g., heating or ultraviolet exposure and plating to form an interconnected electrically conductive circuit pattern. Multilayer printed circuits can also be prepared by repeating the steps using additional layers of photoadhesive material.
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3.发明公开
公开(公告)号：EP0259853A3
公开(公告)日：1989-11-08
申请号：EP87113176.9
申请日：1987-09-09
IPC分类号： G03F7/16
CPC分类号： B32B37/0038 , G03F7/161 , H05K3/0079 , H05K3/281 , H05K2203/0577 , H05K2203/068 , H05K2203/0759
摘要： Lamination of a photopolymerizable film onto a substrate with an intermediate photosensitive liquid which is substantially all monomer and photoinitiator.
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4.发明公开Organic vehicle for electronic composition 失效OrganischesTrägermediumfürelektronische Zusammensetzungen。
公开(公告)号：EP0611627A2
公开(公告)日：1994-08-24
申请号：EP94102215.4
申请日：1994-02-14
IPC分类号： B23K35/363 , H05K3/34
CPC分类号： B23K35/3612 , B23K35/025
摘要： An electronic paste or liquid composition is disclosed which contains a specific compound in conjunction with inorganic particles and/or activator.
摘要翻译： 公开了一种电子浆料或液体组合物，其包含与无机颗粒和/或活化剂结合的特定化合物。
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公开(公告)号：EP0144063B1
公开(公告)日：1990-08-16
申请号：EP84114367.0
申请日：1984-11-28
IPC分类号： H05K3/46
CPC分类号： H05K3/102 , H05K3/0023 , H05K3/185 , H05K3/246 , H05K3/4661 , H05K2201/0195 , H05K2201/0347 , H05K2201/09509 , H05K2203/0505 , H05K2203/0525 , H05K2203/0577 , H05K2203/072 , Y10T29/49155 , Y10T29/49204
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公开(公告)号：EP0611627A3
公开(公告)日：1995-05-03
申请号：EP94102215.4
申请日：1994-02-14
IPC分类号： B23K35/363 , H05K3/34
CPC分类号： B23K35/3612 , B23K35/025
摘要： An electronic paste or liquid composition is disclosed which contains a specific compound in conjunction with inorganic particles and/or activator.
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7.发明公开Lamination of photopolymerizable film onto a substrate employing an intermediate photosensitive layer 失效可光聚合膜的层压到由光敏液体中间层的装置的支持体。
公开(公告)号：EP0259853A2
公开(公告)日：1988-03-16
申请号：EP87113176.9
申请日：1987-09-09
IPC分类号： G03F7/16
CPC分类号： B32B37/0038 , G03F7/161 , H05K3/0079 , H05K3/281 , H05K2203/0577 , H05K2203/068 , H05K2203/0759
摘要： Lamination of a photopolymerizable film onto a substrate with an intermediate photosensitive liquid which is substantially all monomer and photoinitiator.
摘要翻译： 的层压可光聚合薄膜到具有一个底物在中间光敏液体全部是基本上所有的单体和光引发剂。
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公开(公告)号：EP0052806B1
公开(公告)日：1986-02-19
申请号：EP81109296.4
申请日：1981-10-29
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公开(公告)号：EP0052806A3
公开(公告)日：1983-03-16
申请号：EP81109296
申请日：1981-10-29
摘要： An imaged element containing a polymeric relief or stencil image, in which the polymer contains crosslinkable moieties, is subjected to an image enlargement process by contacting the image with a solution containing a swelling agent for the image, and a crosslinking agent. The process is particularly useful in enlarging the half-tone image dot area of photopolymer litho masks wherein the half-tone image areas consist of hardened upper skins which rest on softer undervolumes having a lesser degree of polymerization or hardening.
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公开(公告)号：EP0052806A2
公开(公告)日：1982-06-02
申请号：EP81109296.4
申请日：1981-10-29
摘要： An imaged element containing a polymeric relief or stencil image, in which the polymer contains crosslinkable moieties, is subjected to an image enlargement process by contacting the image with a solution containing a swelling agent for the image, and a crosslinking agent. The process is particularly useful in enlarging the half-tone image dot area of photopolymer litho masks wherein the half-tone image areas consist of hardened upper skins which rest on softer undervolumes having a lesser degree of polymerization or hardening.
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