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20 条记录 (耗时 0.016 秒)

    A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
    9.
    发明公开
    A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor 审中-公开
    内置Inspektionvsvorrichtung及其方法的半导体制造装置

    公开(公告)号：EP1744348A3

    公开(公告)日：2007-06-20

    申请号：EP06019773.8

    申请日：2002-11-01

    申请人： EBARA CORPORATION

    发明人： Satake, Tohru ,  Noji, Nobuharu

    IPC分类号： H01L21/00 ,  H01J37/28

    CPC分类号： H01L21/67219 ,  B24B37/005 ,  G03F7/70616 ,  G03F7/70991 ,  H01J37/28 ,  H01J2237/2817 ,  H01L21/67288 ,  Y10T29/41

    摘要： According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit (21), a chemical and mechanical polishing unit (22), a cleaning unit (23), a drying unit (24) and an unload unit (26). The chemical and mechanical polishing apparatus (100) receives a sample from a preceding step (107), carries out respective processes for the sample by said respective units disposed within the polishing apparatus (100) and then transfers the processed sample to a subsequent step (109). Sample loading and unloading means and a sample transfer means are no more necessary for transferring the sample between respective units.

    Coating, modification and etching of substrate surface with particle beam irradiation
    10.
    发明公开
    Coating, modification and etching of substrate surface with particle beam irradiation 审中-公开
    Beschichten，VerändernundÄtzeneines Substrats mittels Teilchenbestrahlung

    公开(公告)号：EP1160826A2

    公开(公告)日：2001-12-05

    申请号：EP01113180.2

    申请日：2001-05-30

    申请人： EBARA CORPORATION

    发明人： Ogure, Naoaki ,  Horie, Kuniaki ,  Araki, Yuji ,  Nagasaka, Hiroshi ,  Kakutani, Momoko ,  Satake, Tohru

    IPC分类号： H01J37/305 ,  H01J37/317

    CPC分类号： H01J37/32422 ,  C23C16/18 ,  C23C16/452 ,  C23C16/486 ,  C23C16/487 ,  H01J37/3233 ,  H01L21/28556 ,  H01L21/32136

    摘要： There is provided a method of applying a surface treatment, such as coating, denaturation, modification and etching, to a surface of a substrate. The method comprises the steps of bringing a surface treatment gas (27) into contact with a surface of a substrate (Wf), and irradiating the surface of the substrate with a fast particle beam (29) to enhance an activity of the surface and/or the surface treatment gas thereby facilitating the reaction between the surface and the gas. The fast particle beam may be selected from a group consisting of an electron beam, a charged particle beam, an atomic beam and molecular beam. For example, in a coating operation, chemically deposition of predetermined component elements of the gas onto the surface is effected and a predetermined portion in the surface of the substrate is irradiated with a particle beam to form a coating layer on the predetermined portion.

    摘要翻译： 提供了将表面处理如涂层，变性，改性和蚀刻施加到基材的表面的方法。 该方法包括以下步骤：使表面处理气体（27）与基底（Wf）的表面接触，并用快速粒子束（29）照射基底表面，以增强表面的活性和/ 或表面处理气体，从而促进表面和气体之间的反应。 快速粒子束可以选自电子束，带电粒子束，原子束和分子束。 例如，在涂布操作中，将气体的预定组分元素化学沉积到表面上，并且用颗粒束照射基板表面中的预定部分，以在预定部分上形成涂层。