公开(公告)号：EP3195707A1

公开(公告)日：2017-07-26

申请号：EP14758210.0

申请日：2014-08-12

Applicant: Advanced Bionics AG

Inventor： LI, Lin ,  XIE, Jian ,  WALTER, Jeryle

IPC: H05K3/32 ,  H01R4/02

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

Abstract translation: 将导线（126）连接到馈通引脚（104）和包括连接到馈通引脚的导线的装置的方法。

公开(公告)号：EP2845456A1

公开(公告)日：2015-03-11

申请号：EP13720315.4

申请日：2013-04-24

Applicant: Robert Bosch GmbH

Inventor： GUYENOT, Michael ,  RATCHEV, Roumen ,  FIX, Andreas

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/321 ,  H05K3/3447 ,  H05K2201/10909

Abstract: The invention relates to a method for producing an electrical via between one or more electrical or electronic components (10) and a circuit board (16). First, a conductive polymer layer (42) is applied to soldering tips (46) of connecting wires (12) over part of the surface or over the full surface thereof. At least one electrical or electronic component is joined to the circuit board (16) in a THT process. At least one solder connection is produced between the circuit board (16) and connecting wires (12) of the at least one electrical or electronic component (10) by means of selective soldering or a solder wave (28).

Abstract translation: 本发明涉及一种用于在一个或多个电气或电子部件（10）和电路板（16）之间生产电气通孔的方法。 首先，将导电聚合物层（42）施加到连接线（12）的焊接尖端（46）上的部分表面上或其整个表面上。 至少一个电子或电子部件在THT工艺中被连接到电路板（16）。 通过选择性焊接或焊波（28）在电路板（16）和至少一个电气或电子部件（10）的连接线（12）之间产生至少一个焊接连接。

公开(公告)号：EP1916883A1

公开(公告)日：2008-04-30

申请号：EP08003138.8

申请日：2004-12-15

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Kambara, Yasushi ,  Motoyama, Akira ,  Nakajima, Masayuki

IPC: H05B41/282 ,  H05B41/02 ,  H01G2/06

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

Abstract: A lighting device for a lamp device is provided. The lighting device comprises a circuit board and film capacitors, packaged on the circuit board by using leadless flow solders, wherein each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless, wherein the film capacitors are constructed by a combination of a polypropylene film and an aluminum foil, or by an aluminum-deposited polypropylene film, and wherein a cross-sectional area of the film capacitors is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130°C or less.

Abstract translation: 提供了一种用于灯装置的照明装置。 照明装置包括电路板和薄膜电容器，其通过使用无铅流动焊料封装在电路板上，其中每个薄膜电容器包括聚丙烯薄膜和引线，并且导线的材料的导热率低于 铜，以及薄膜电容器的端子和内部材料是无引线的，其中薄膜电容器通过聚丙烯薄膜和铝箔的组合或通过铝沉积聚丙烯薄膜构成，并且其中所述薄膜电容器的横截面积 薄膜电容器为35mm 2以下，焊接工序中的薄膜电容器的引线的末端的温度为130℃以下。

公开(公告)号：EP1275463B1

公开(公告)日：2007-02-28

申请号：EP02011162.1

申请日：1998-12-09

Applicant: Hitachi, Ltd.

Inventor： Shimokawa, Hanae, Hitachi,Ltd., Int. Propt. Group ,  Soga, Tasao, Hitachi,Ltd., Int. Propt. Group ,  Okudaira, Hiroaki, Hitachi,Ltd., Int. Propt. Group ,  Ishida, Toshiharu, Hitachi,Ltd., Int. Propt. Group ,  Nakatsuka, Tetsuya, Hitachi,Ltd., Int.Propt.Group ,  Inaba, Yoshiharu, Hitachi,Ltd., Int.Propt.Group ,  Nishimura, Asao, Hitachi,Ltd., Int.Propt.Group

IPC: B23K1/20 ,  B23K35/26 ,  H05K3/34 ,  H01L23/50 ,  C22C13/02

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

公开(公告)号：EP1716732A2

公开(公告)日：2006-11-02

申请号：EP05706011.3

申请日：2005-01-21

Applicant: ENTHONE, INCORPORATED

Inventor： XU, Chen c/o Enthone Inc. ,  ZHANG, Yun c/o Enthone Inc. ,  FAN, Chonglun c/o Enthone Inc. ,  KHASELEV, Oscar c/o Enthone Inc. ,  ABYS, Joseph, A. c/o Enthone Inc. ,  WALCH, Eric ,  KLEINFELD, Marlies ,  ECKERT, Hans, Ullrich

IPC: H05K3/34

CPC classification number: H01L23/49582 ,  C25D5/12 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01R4/02 ,  H01R13/03 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T428/12722 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.

公开(公告)号：EP1681131A1

公开(公告)日：2006-07-19

申请号：EP06005992.0

申请日：1998-12-09

Applicant: HITACHI, LTD.

Inventor： Shimokawa, Hanae c/o Hitachi, Ltd., I.P. Group ,  Soga, Tasao c/o Hitachi, Ltd., I.P. Group ,  Okudaira, Hiroaki c/o Hitachi, Ltd., I.P. Group ,  Ishida, Toshiharu c/o Hitachi, Ltd., I.P. Group ,  Nakatsuka, Tetsuya c/o Hitachi, Ltd., I.P. Group ,  Inaba, Yoshiharu c/o Hitachi, Ltd., I.P. Group ,  Nishimura, Asao c/o Hitachi, Ltd., I.P. Group

IPC: B23K35/26 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.

Abstract translation: 提供通过无铅焊料的接合结构和包含接合结构的电子制品。 粘合结构相对于时间的变化具有稳定的结合界面，足够的强度和耐发生晶须同时保持焊料的良好润湿性。 在接合结构中，通过Sn-Bi合金层向电极施加无铅Sn-Ag-Bi合金焊料。 Sn-Bi合金优选含有1〜20重量％的Bi，以获得良好的焊料润湿性。 为了获得本发明中具有较高可靠性的理想的接合特性，在Sn-Bi合金层下方设置有铜层，从而获得足够的接合强度。

公开(公告)号：EP1092338B1

公开(公告)日：2004-12-15

申请号：EP99933638.1

申请日：1999-06-30

Applicant: FormFactor, Inc.

Inventor： PEDERSEN, David, V. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, Y.

IPC: H05K3/32

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

公开(公告)号：EP1475177A1

公开(公告)日：2004-11-10

申请号：EP04010549.6

申请日：2004-05-04

Applicant: Murata Co., Ltd. ,  MORIMURA BROS., Inc.,

Inventor： Kato, Kazuhiko ,  Yanagida, Satoshi ,  Sato, Osamu ,  Kondo, Mineo

IPC: B23K1/00 ,  H01R4/02 ,  H05K3/12

CPC classification number: B23K1/00 ,  H01R4/028 ,  H05K3/3447 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/013

Abstract: The present invention provides an apparatus (30) for forming a solder wicking prevention zone operating when a connector member with a connector is processed using molten solder, to hinder the solder from spreading to a contact site of the connector in a wettable manner. The apparatus includes a main forming agent tank (34) which stores a main forming agent used to form the solder wicking prevention zone, an ejection nozzle (38), in particular an ink jet printer, which ejects the main forming agent stored in the main forming agent tank (34), and a direction control section (46) which controls an ejection direction of the main forming agent ejected by the ejection nozzle (38). The direction control section (46) controls the ejection direction of the main forming agent ejected by the ejection nozzle (38), so as to apply the main forming agent to a predetermined position on the connector member to form the solder wicking prevention zone.

Abstract translation: 本发明提供了对形成焊料芯吸预防区操作当与连接器的连接器构件使用熔融焊料处理，从以可湿性方式蔓延到所述连接器的接触部位妨碍焊料装置（30）。 该设备包括一个主形成剂罐（34），其存储主形成剂用于形成焊料在喷出管嘴（38）的芯吸预防区，特别是喷墨打印机，其喷射存储在主主要形成剂 形成剂罐（34），以及控制于射血通过排出喷嘴（38）喷射的主要形成剂的方向的方向控制部（46）。 方向控制部（46），控制由喷嘴（38）喷出，以便作为主要形成剂施加到所述连接器构件上的预定位置，以形成焊料芯吸预防区主要形成剂的喷射方向。

公开(公告)号：EP1275463A3

公开(公告)日：2003-02-12

申请号：EP02011162.1

申请日：1998-12-09

Applicant: Hitachi, Ltd.

Inventor： Shimokawa, Hanae, Hitachi,Ltd., Int. Propt. Group ,  Soga, Tasao, Hitachi,Ltd., Int. Propt. Group ,  Okudaira, Hiroaki, Hitachi,Ltd., Int. Propt. Group ,  Ishida, Toshiharu, Hitachi,Ltd., Int. Propt. Group ,  Nakatsuka, Tetsuya, Hitachi,Ltd., Int.Propt.Group ,  Inaba, Yoshiharu, Hitachi,Ltd., Int.Propt.Group ,  Nishimura, Asao, Hitachi,Ltd., Int.Propt.Group

IPC: B23K1/20 ,  B23K35/26 ,  H05K3/34 ,  H01L23/50 ,  C22C13/02

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.

公开(公告)号：EP0858859A1

公开(公告)日：1998-08-19

申请号：EP97925301.0

申请日：1997-06-06

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： SAKAI, Yoshinori ,  SUETSUGU, Kenichiro ,  YAMAGUCHI, Atsushi

IPC: B23K35/26

CPC classification number: B23K35/262 ,  B23K2201/36 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10909

Abstract: A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented.
This is a solder alloy of electrode for joining electronic parts comprising Sn, Ag and Cu as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 92 to 97 wt.% of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.

Abstract translation: 提出了一种无电极焊接合金，用于连接电子零件质地细腻，耐热疲劳特性优异的电极。 这是用于连接包含Sn，Ag和Cu的电子部件作为主要成分的电极用焊料合金，特别是用于接合含有92〜97重量％的Sn，3.0〜6.0重量％的电子部件的电极用焊料合金。 Ag％，0.1〜2.0wt。 Cu的百分比。 通过向主要由Sn组成的焊料中添加少量Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。 此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。