公开(公告)号：EP2372337A3

公开(公告)日：2014-01-22

申请号：EP11160332.0

申请日：2011-03-30

Applicant: FEI Company

Inventor： Tanner, Ryan

IPC: G01N1/28 ,  H01J37/304 ,  H01J37/26

CPC classification number: H01J37/3005 ,  G01N1/286 ,  H01J37/26 ,  H01J37/265 ,  H01J37/28 ,  H01J37/30 ,  H01J37/3045 ,  H01J37/3056 ,  H01J2237/2611 ,  H01J2237/28 ,  H01J2237/2803 ,  H01J2237/2814 ,  H01J2237/30472 ,  H01J2237/3174 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: A method and apparatus for performing a slice and view technique with a charged particle beam system. The feature of interest in an image of a sample is located by machine vision, and the area to be milled and imaged in a subsequent slice and view iteration is determined through analysis of data gathered by the machine vision at least in part. A determined milling area may be represented as a bounding box around a feature, which dimensions can be changed in accordance with the analysis step. In a dual beam system, the FIB is then adjusted accordingly to slice and mill a new face in the subsequent slice and view iteration, and the SEM images the new face. Because the present invention accurately locates the feature and determines an appropriate size of area to mill and image, efficiency is increased by preventing the unnecessary milling of substrate that does not contain the feature of interest.

公开(公告)号：EP2693457B1

公开(公告)日：2016-03-23

申请号：EP13176584.4

申请日：2013-07-16

Applicant: FEI COMPANY

Inventor： Young, Richard ,  Tanner, Ryan ,  Warschauer, Reinier

IPC: H01J37/28 ,  H01J37/26

CPC classification number: H01J37/265 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/31749

公开(公告)号：EP2693457A3

公开(公告)日：2015-01-28

申请号：EP13176584.4

申请日：2013-07-16

Applicant: FEI COMPANY

Inventor： Young, Richard ,  Tanner, Ryan ,  Warschauer, Reinier

IPC: H01J37/28 ,  H01J37/26

CPC classification number: H01J37/265 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/31749

Abstract: A device for imaging and processing a workpiece having nanometric features through the use of at least one charged particle beam, by both fully automated procedures and manual assistance procedures. The device includes a user interface, including a schedule input entry device and a human operator ready input that can be placed in a first state or a second state and a procedure scheduler, accepting a schedule of procedures, including fully automated procedures and manual assistance procedures, from the schedule input entry device. Additionally, a procedure sequencer that, when the human operator ready input is in the second state, sequences through fully automated procedures until the human operator ready input is placed into the first state, at which time the sequencer begins sequencing the manual assistance procedures, after reaching a safe termination point for the fully automated procedures being performed.

公开(公告)号：EP2693457A2

公开(公告)日：2014-02-05

申请号：EP13176584.4

申请日：2013-07-16

Applicant: FEI COMPANY

Inventor： Young, Richard ,  Tanner, Ryan ,  Warschauer, Reinier

IPC: H01J37/28 ,  H01J37/26

CPC classification number: H01J37/265 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/31749

Abstract: A device for imaging and processing a workpiece having nanometric features through the use of at least one charged particle beam, by both fully automated procedures and manual assistance procedures. The device includes a user interface, including a schedule input entry device and a human operator ready input that can be placed in a first state or a second state and a procedure scheduler, accepting a schedule of procedures, including fully automated procedures and manual assistance procedures, from the schedule input entry device. Additionally, a procedure sequencer that, when the human operator ready input is in the second state, sequences through fully automated procedures until the human operator ready input is placed into the first state, at which time the sequencer begins sequencing the manual assistance procedures, after reaching a safe termination point for the fully automated procedures being performed.

Abstract translation: 一种用于成像和处理通过使用至少一个带电粒子束的具有纳米级特征的工件的装置，由这两个完全自动化的程序和手动协助程序。 该装置包括一个用户接口，包括日程输入输入装置和人类操作者准备好输入确实可在第一状态或第二状态和程序调度器放置，接受的步骤的时间表，包括全自动化程序和手动协助程序 从时间表输入进入装置。 此外，一个程序定序器，当操作人员就绪输入处于所述第二状态时，通过完全自动化的程序序列，直到操作人员准备输入被置于第一状态时，在WhichTime定序开始测序手动辅助程序，后 深远的完全自动化的过程在安全终止点执行。

公开(公告)号：EP2372337A2

公开(公告)日：2011-10-05

申请号：EP11160332.0

申请日：2011-03-30

Applicant: FEI Company

Inventor： Tanner, Ryan

IPC: G01N1/28

CPC classification number: H01J37/3005 ,  G01N1/286 ,  H01J37/26 ,  H01J37/265 ,  H01J37/28 ,  H01J37/30 ,  H01J37/3045 ,  H01J37/3056 ,  H01J2237/2611 ,  H01J2237/28 ,  H01J2237/2803 ,  H01J2237/2814 ,  H01J2237/30472 ,  H01J2237/3174 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: A method and apparatus for performing a slice and view technique with a charged particle beam system. The feature of interest in an image of a sample is located by machine vision, and the area to be milled and imaged in a subsequent slice and view iteration is determined through analysis of data gathered by the machine vision at least in part. A determined milling area may be represented as a bounding box around a feature, which dimensions can be changed in accordance with the analysis step. In a dual beam system, the FIB is then adjusted accordingly to slice and mill a new face in the subsequent slice and view iteration, and the SEM images the new face. Because the present invention accurately locates the feature and determines an appropriate size of area to mill and image, efficiency is increased by preventing the unnecessary milling of substrate that does not contain the feature of interest.

Abstract translation: 一种利用带电粒子束系统执行切片和观察技术的方法和装置。 通过机器视觉来定位样本图像中的兴趣特征，并且通过至少部分地通过机器视觉收集的数据的分析来确定要在后续切片和观看迭代中被研磨和成像的区域。 确定的铣削区域可以表示为围绕特征的边界框，该尺寸可以根据分析步骤而改变。 在双光束系统中，然后相应地调整FIB以在随后的切片中切片并研磨新的面并查看迭代，并且SEM对新的面进行成像。 因为本发明精确地定位了特征并且确定适当的尺寸以进行研磨和图像，所以通过防止不需要研磨不包含感兴趣特征的基底来提高效率。