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Patent Agency Ranking1.发明公开CURABLE RESIN COMPOSITION, AND IMAGE-SENSOR-CHIP PRODUCTION METHOD AND IMAGE SENSOR CHIP USING SAME 审中-公开固化树脂组合物和图像感应器芯片的制造方法和图像感应器芯片
公开(公告)号：EP2927717A4
公开(公告)日：2016-01-06
申请号：EP13858731
申请日：2013-11-27
Applicant: FUJIFILM CORP
Inventor： EZOE TOSHIHIDE , NARA YUKI , SHIMADA KAZUTO
IPC: G02B5/22 , C08L101/00 , C09D7/12 , C09D201/00 , H01L27/14 , H04N5/225 , H04N5/335
CPC classification number: C09D7/007 , C08K5/55 , C09D5/00 , C09D7/41 , C09D201/00 , G02B1/11 , G02B5/223 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14685 , H01L2224/13 , H04N5/2254
Abstract: To provide a curable resin composition capable of producing an image sensor chip in which the color shading is suppressed, a production method of image sensor chip using the same, and an image sensor chip. A curable resin composition which is capable of being coated so as to have a film thickness of 20 µm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm.
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2.发明公开CURABLE RESIN COMPOSITION FOR FORMING INFRARED-REFLECTING FILM, INFRARED-REFLECTING FILM AND MANUFACTURING METHOD THEREFOR, INFRARED CUT-OFF FILTER, AND SOLID-STATE IMAGING ELEMENT USING SAME 审中-公开可固化树脂组合物的制造红外反射膜，红外反射膜及其制造方法，红外EDGE滤光器，固体摄像元件，其
公开(公告)号：EP2940090A4
公开(公告)日：2016-01-06
申请号：EP13869456
申请日：2013-12-25
Applicant: FUJIFILM CORP
Inventor： EZOE TOSHIHIDE , SHIMADA KAZUTO , SONODA SHINICHIRO
IPC: C09D201/00 , B32B7/02 , B32B27/00 , C08L101/00 , C09D7/12 , G02B5/20 , G02B5/22 , G02B5/26 , G02B5/28 , H01L27/14
CPC classification number: G02B5/208 , B32B7/02 , B32B27/08 , B32B27/20 , B32B27/283 , B32B2255/10 , B32B2264/102 , B32B2307/4026 , B32B2307/418 , B32B2457/00 , C08L101/00 , C09D5/004 , C09D7/63 , C09D133/14 , C09D151/003 , C09D201/00 , G02B5/26 , G02B5/282 , H01L27/14618 , H01L27/14621 , H01L2224/13
Abstract: Provided are a curable resin composition for forming an infrared reflective film which is capable of forming the infrared reflective film having an infrared light shielding property without vapor deposition, the infrared reflective film obtained using the same, and a manufacturing method thereof, and an infrared ray cutoff filter having a near infrared light shielding property, and an infrared light shielding property. The curable resin composition for forming the infrared reflective film with a refractive index ranging from 1.65 to 2.00 is coatable with a film thickness of 50 nm to 250 nm, and the curable resin composition for forming the infrared reflective film with a refractive index ranging from 1.20 to 1.45 is coatable with a film thickness of 50 nm to 250 nm.
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3.发明公开CURABLE RESIN COMPOSITION, AND IMAGE-SENSOR-CHIP PRODUCTION METHOD AND IMAGE SENSOR CHIP USING SAME 审中-公开ÄARE IT IT IT UNG IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT IT
公开(公告)号：EP2927716A4
公开(公告)日：2015-12-30
申请号：EP13858244
申请日：2013-11-27
Applicant: FUJIFILM CORP
Inventor： EZOE TOSHIHIDE , SHIMADA KAZUTO
IPC: G02B5/22 , C08L101/00 , C09D7/12 , C09D201/00 , H01L27/14 , H04N5/225 , H04N5/335
CPC classification number: H01L27/14623 , C08L101/00 , C09B57/004 , C09B67/0013 , C09D7/12 , C09D201/00 , G02B5/223 , H01L27/14618 , H01L27/1462 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14685 , H01L27/14687 , H01L2924/0002 , H04N5/225 , H04N5/2254 , H04N5/335 , H01L2924/00
Abstract: To provide a curable resin composition capable of producing an image sensor chip in which the color shading is suppressed, a production method of image sensor chip using the same, and an image sensor chip. A curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip using the same, and an image sensor chip.
Abstract translation: 为了提供能够制造抑制色调的图像传感器芯片的可固化树脂组合物，使用该图像传感器芯片的图像传感器芯片的制造方法和图像传感器芯片。 一种固化性树脂组合物，其能够涂布在固态成像器件基板上，并且含有在600〜850nm的波长范围内具有最大吸收波长的染料，使用该染料的图像传感器芯片的制造方法以及 图像传感器芯片。
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4.发明公开NEAR-INFRARED ABSORBING COMPOSITION, NEAR-INFRARED BLOCKING FILTER, METHOD FOR PRODUCING NEAR-INFRARED BLOCKING FILTER, CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE 有权近吸收组合物，近阻塞滤波器，用于生产近陷波滤波器，相机模块及其制造方法的相机模块
公开(公告)号：EP2960691A4
公开(公告)日：2016-02-17
申请号：EP14754459
申请日：2014-02-13
Applicant: FUJIFILM CORP
Inventor： NARA YUKI , BAK SEONGMU , EZOE TOSHIHIDE , KAWASHIMA TAKASHI , HITOMI SEIICHI
CPC classification number: G02B5/208 , G02B1/04 , G02B13/003 , G03B11/00 , H01L27/14621 , H01L27/14638 , H01L27/14685 , H04N5/2254 , H04N5/33 , H04N5/335 , C08L63/00 , C08L101/14
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5.发明公开CURABLE RESIN COMPOSITION, INFRARED CUT-OFF FILTER, AND SOLID-STATE IMAGING ELEMENT USING SAME 审中-公开固化树脂组合物，红外阻隔来滤光器，固体摄像元件，其
公开(公告)号：EP2940081A4
公开(公告)日：2016-01-06
申请号：EP13867254
申请日：2013-12-25
Applicant: FUJIFILM CORP
Inventor： EZOE TOSHIHIDE , SHIMADA KAZUTO , SONODA SHINICHIRO
CPC classification number: G02B5/208 , B32B7/02 , B32B27/08 , B32B27/20 , B32B27/283 , B32B2264/102 , B32B2307/4026 , B32B2307/418 , B32B2457/00 , C08K3/22 , C08K5/0041 , C08K5/16 , C08K5/3417 , C08K2003/2241 , C08L101/12 , C09D5/004 , C09D183/04 , G02B1/04 , G02B5/223 , G02B5/282 , H04N9/045
Abstract: Provided are a curable resin composition capable of forming an infrared ray cutoff filter which has a near infrared light shielding property, and an infrared light shielding property without vapor deposition, the infrared ray cutoff filter obtained therefrom, and a solid-state imaging device using the same. The curable resin composition contains a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and capable of forming a high refractive index layer with a refractive index ranging from 1.65 to 2.00, or the curable resin composition contains a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and capable of forming a low refractive index layer with a refractive index ranging from 1.20 to 1.45.
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