公开(公告)号：EP2528066A1

公开(公告)日：2012-11-28

申请号：EP11734709.6

申请日：2011-01-20

申请人： FUJIKURA LTD. ,  Goo Chemical Co., Ltd.

发明人： KOSHIMIZU Kazutoshi ,  OTA Shigeo

IPC分类号： H01B1/22 ,  C08F2/54 ,  C08J7/04 ,  C09D5/00 ,  C09D5/24 ,  C09D7/12 ,  C09D201/00 ,  H01B13/00 ,  H05K3/12

CPC分类号： C08F2/54 ,  C08J7/047 ,  C08J7/18 ,  C08J2433/12 ,  C08K5/0016 ,  C09D5/24 ,  C09D7/63 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2203/092

摘要： The present invention provides an electroconductive paste for electron beam curing that allows the formation of a circuit board having an electroconductive layer that has superior hardness and bendability as well as superior adhesion to a plastic base even if used in a high-temperature environment. The present invention is an electroconductive paste for electron beam curing comprising an electroconductive powder, a radical polymerizable composition and a plasticizer, wherein the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.

摘要翻译： 对本发明的导电性糊料提供用于电子束固化确实允许在具有导电层并在电路板的形成具有优异的硬度和可弯曲性以及优异的密合性，即使在高温环境下使用的塑料基材。 本发明是一种导电性糊料电子束固化包含导电粉末，自由基聚合性组合物和增塑剂，worin增塑剂是在5组质量份的比例以质量由质量并入至20份，基于100份的 自由基聚合性组合物。