公开(公告)号：EP0521335B1

公开(公告)日：1998-09-02

申请号：EP92110122.6

申请日：1992-06-16

申请人： FUJITSU LIMITED

发明人： Sono, Michio, c/o Fujitsu Limited ,  Kasai, Junichi, c/o Fujitsu Limited ,  Saito, Kouji, c/o Fujitsu Limited ,  Mitobe, Kazuhiko, c/o Fujitsu Limited ,  Yoshimoto, Masanori, c/o Fujitsu Limited

IPC分类号： H01L23/495

CPC分类号： H05K1/0203 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10469 ,  H05K2201/1053 ,  H05K2201/10659 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP0521335A1

公开(公告)日：1993-01-07

申请号：EP92110122.6

申请日：1992-06-16

申请人： FUJITSU LIMITED

发明人： Sono, Michio, c/o Fujitsu Limited ,  Kasai, Junichi, c/o Fujitsu Limited ,  Saito, Kouji, c/o Fujitsu Limited ,  Mitobe, Kazuhiko, c/o Fujitsu Limited ,  Yoshimoto, Masanori, c/o Fujitsu Limited

IPC分类号： H01L23/495

CPC分类号： H05K1/0203 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10469 ,  H05K2201/1053 ,  H05K2201/10659 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises a semiconductor chip; a resin package body (11) for accommodating the semiconductor chip; a plurality of interconnection leads (14) provided on the resin package body along a lower edge of the package body such that the interconnection leads project outward from the lower edge; and a heat dissipation lead (31) held on the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead (31) comprises a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supporting the semiconductor chip thereon, while the heat sink part projects outward from the resin package body and including a part that extends in a downward direction. The heat sink part has a lower edge (31a) that is formed at a level substantially flush with the outer lead part of the interconnection leads such that the semiconductor device is held upright, when placed on the substrate, by the outer lead part of the interconnection leads and by the lower edge of the heat sink part of the heat dissipation lead.

摘要翻译： 半导体器件包括半导体芯片; 用于容纳半导体芯片的树脂封装体（11）; 多个互连引线（14），沿着所述封装体的下边缘设置在所述树脂封装主体上，使得所述互连引线从所述下边缘向外突出; 以及保持在树脂封装主体上用于散发由半导体芯片产生的热量的散热引线（31）。 散热引线31包括具有台部和散热部的导热材料板，其中台部保持在树脂封装主体的内部并在其上支撑半导体芯片，同时散热部向外伸出 并且包括沿向下方向延伸的部分。 散热部分具有下边缘（31a），该下边缘形成在与互连引线的外引线部分基本齐平的水平面上，使得半导体器件在被放置在基板上时被直立地保持在基板的外引线部分上 互连引线和散热片散热片的下边缘。