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    Electrical connector system
    2.
    发明公开
    Electrical connector system 有权
    Elektrisches Verbindersystem

    公开(公告)号：EP2369683A1

    公开(公告)日：2011-09-28

    申请号：EP11158733.3

    申请日：2011-03-17

    Applicant: Tyco Electronics Corporation

    Inventor： Morgan, Chad William ,  Helster, David Wayne ,  Woodford, Michael William

    IPC: H01R12/52 ,  H01R12/58 ,  H01R12/72 ,  H01R13/6474

    CPC classification number: H01R13/6474 ,  H01R12/52 ,  H01R12/585 ,  H01R12/722 ,  H01R12/724 ,  H01R13/514 ,  H01R13/6477 ,  H01R13/6587 ,  H05K1/0245 ,  H05K3/308 ,  H05K3/429 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2203/0242 ,  Y10S439/941

    Abstract: An electrical connector assembly comprises a circuit board (12) having vias (54) each extending at least partially through the circuit board (12) along parallel via axes (106). An electrical connector is mounted on the circuit board (12). The electrical connector comprises a plurality of variable depth signal terminals (26) configured to extend different depths into respective ones of the vias (54). The signal terminals (26) each have a terminal axis (134). The signal terminals (26) are arranged in pairs carrying differential pair signals, with the signal terminals (26) of each pair extending to the same depth in the respective vias (54). The terminal axes (134) of the signal terminals (26) of each pair are offset with respect to the corresponding via axes (106) along a majority of the depth of the signal terminals (26) within the vias (54).

    Abstract translation: 电连接器组件包括具有通孔（54）的电路板（12），每个通孔（54）至少部分地沿着平行于轴线（106）延伸穿过电路板（12）。 电连接器安装在电路板（12）上。 电连接器包括多个可变深度信号端子（26），其被配置为将不同深度延伸到相应的通路（54）中。 信号端子（26）各自具有端子轴（134）。 信号端子（26）成对地布置成携带差分对信号，每对信号端子（26）在相应的通孔（54）中延伸到相同的深度。 每对信号端子（26）的端子轴（134）相对于通孔（54）内的信号端子（26）的深度的大部分相对于相应的通孔轴线（106）偏移。

    Package modification for channel-routed circuit boards
    5.
    发明公开
    Package modification for channel-routed circuit boards 审中-公开
    PackalsmodifizierungfürKanalführungs-Leiterplatten

    公开(公告)号：EP1478215A3

    公开(公告)日：2006-02-08

    申请号：EP04394023.8

    申请日：2004-05-07

    Applicant: Nortel Networks Limited

    Inventor： Difilippo, Luigi ,  Wyrzykowska, Aneta ,  Kwong, Herman

    IPC: H05K3/30 ,  H05K3/46

    CPC classification number: H05K1/112 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2224/0401

    Abstract: A method for implementing a circuit component (160) on a surface of a multilayer circuit board (110) is provided. The circuit component includes a plurality of pins (162,164,166,168,170,172,174,176) and the circuit board (110) includes a plurality of electrically conductive vias (142,148,150,152,156) penetrating at least one layer of the circuit board (110) and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board (110). The method comprises the step of forming at least one pin (162,168A,170A,172,176A) of the plurality of pins (162,164,166,168,170,172,174,176) of the circuit component (160) to have a length compatible with a depth of a corresponding via (142,148,150,152,156) of the circuit board (110).

    Abstract translation: 提供一种在多层电路板（110）的表面上实现电路部件（160）的方法。 电路部件包括多个引脚（162,164,166,168,170,172,174,176），并且电路板（110）包括穿透电路板（110）的至少一个层的多个导电通孔（142,148,150,152,156），并布置成形成至少一个 通道，用于在电路板（110）的一个或多个信号层处布线一个或多个迹线。 该方法包括形成电路部件（160）的多个引脚（162,164,166,168,170,172,174,176）的至少一个引脚（162,168A，170A，172,176A）以使其长度与对应的通孔（142,148,150,152,156）的深度相兼容的步骤， 的电路板（110）。

    Technique for interconnecting multilayer circuit boards
    6.
    发明公开
    Technique for interconnecting multilayer circuit boards 审中-公开
    Verbindungstechnikfürmehrlagige gedruckte Leiterplatten

    公开(公告)号：EP1487060A2

    公开(公告)日：2004-12-15

    申请号：EP04394034.5

    申请日：2004-06-11

    Applicant: Nortel Networks Limited

    Inventor： Kwong, Herman ,  Difilippo, Luigi ,  Wyrzykowska, Aneta

    IPC: H01R12/06

    CPC classification number: H01R12/523 ,  H01R12/57 ,  H01R13/642 ,  H01R13/665 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/368 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/10659 ,  H05K2203/061 ,  Y10T409/300112 ,  Y10T409/300616

    Abstract: A circuit device for interconnecting first and second multilayer circuit boards is described herein. The first multilayer circuit board may include a first plurality of electrically conductive vias of varying depths and the second multilayer circuit board may include a second plurality of electrically conductive vias. The circuit device comprises a first plurality of pins located on a first side of the circuit device corresponding to the first plurality of electrically conductive vias of the first multilayer circuit board, each pin having a length compatible with a depth of a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board. The circuit device further comprises a second plurality of pins located on a second side of the circuit device corresponding to the second plurality of electrically conductive vias of the second multilayer circuit board.

    Abstract translation: 本文描述了用于互连第一和第二多层电路板的电路装置。 第一多层电路板可以包括具有不同深度的第一多个导电通孔，并且第二多层电路板可以包括第二多个导电通孔。 所述电路装置包括位于所述电路装置的与所述第一多层电路板的所述第一多个导电通孔相对应的第一侧​​上的第一多个销，每个销的长度与所述第一多层电路板的相应一个的深度相兼容 多个第一多层电路板的导电通孔。 电路装置还包括位于电路装置的第二侧上的第二多个针，其对应于第二多层电路板的第二多个导电通路。

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