摘要:
A compound semiconductor layer (GaAs or AlGaAs layer) is grown by an MBE process and is doped by forming dopant (Si or Be) atomic planes. In order to obtain a high carrier (electron or hole) concentration of the layer, atomic plane doping at a sheet dopant concentration of 2 x 10 12 cm -2 or more is repeated at constant intervals of atomic planes of 6 nm or less.
摘要翻译:通过MBE工艺生长化合物半导体层(GaAs或AlGaAs层),并通过形成掺杂剂(Si或Be)原子面进行掺杂。 为了获得该层的高载流子(电子或空穴)浓度,以恒定的间隔重复在2×10 -2 cm -2以上的片状掺杂剂浓度下的原子平面掺杂 原子面为6nm以下。
摘要:
A semiconductor device of the quantum interference type has channel means (4,6;55) for passing carriers from a source region (31;36;52) to a drain region (33;56) of the device, at least part of the said channel means (4,6;55) comprising two conductive paths extending in parallel between the source and drain regions (31;36;52/32;56), and field control means (35;59) arranged for subjecting the said conductive paths to a selectively variable electric or magnetic field so as to control the passage of carriers through the said channel means (4,6;55). The device is provided with carrier-energy filtering means (40;53) arranged for restricting the energy levels, of carriers entering the said channel means (4,6;55), to a predetermined narrow band of energy levels. In this way quantum interference in the device can be improved as compared with a known semiconductor device of the quantum interference type.
摘要:
In order to manufacture an IC comprising high electron mobility semiconductor devices, it is necessary to make the carriers in channel layer not to loose their high mobility by thermal treatment during the IC fabrication process. It has been found that the mobility of the two dimensional electron gas (2DEG) is lost by scattering of ionized impurity diffused from doped layer into spacer layer which separates the 2DEG in channel layer from the doped layer. A multilayered structure is proposed including a channel layer (12) made of i-GaAs and formed on a high resistivity GaAs substrate (11), a first spacer layer (13) of undoped Al x Ga 1-x As, a second spacer layer (14) of i-GaAs and a doped layer of n-Al x Ga 1 - x As. The thickness of the second spacer layer (14) is approximately 2 x 10- 9 m, and that of the first spacer is approximately 4x 10 -9 m. A high electron mobility transistor, having such a structure could withstand a heat treatment at 750° C for 10 min. and at more than 950° C for 10 sec. for annealing, the second spacer (14) preventing the diffusion of impurity.
摘要:
A quantum interference semiconductor device for producing an output in response to interference of electron waves comprises a source region (214) for injecting electrons, a drain region (216) for collecting electrons, a passage (217) for flowing the injected electrons from the source region to the drain region, a passage dividing structure (218, 220, 222) provided in the passage for dividing the passage into a first region in contact with the source region and a second region in contact with the drain region by inducing depletion regions in the passage so as to prohibit the electrons flowing through the passage, the passage dividing structure having a longitudinal size approximately equal to or smaller than the inelastic and elastic scattering length of electrons and constructed such that a plurality of spot-like channel regions (224, 226) are provided in the passage dividing structure for passing the electrons from the first region to the second region in a form of electron waves with respective phase shifts, each of the plurality of spot-like channel regions having a lateral width confined approximately equal to or smaller than the de Broglie wavelength of the electrons passing therethrough, and a control structure (218, 220) for controlling the phase of electron waves passing through at least one of the plurality of spot-like channel regions.
摘要:
A field effect semiconductor device which utilizes a two-dimensional electron gas is composed of a semi-insulating substrate (1 an i-type active layer (2); a superlattice structure layer which comprises a first i-type thin layer (3A), a thin layer (3B) doped with dopant by an atomic plane doping process, and a second i-type thin layer (3C), these thin layers forming a quantum well; generally an n-type layer; and electrodes (6, 7, 8) for source, drain, and gate.
摘要:
A field effect semiconductor device which utilizes a two-dimensional electron gas is composed of a semi-insulating substrate (1 an i-type active layer (2); a superlattice structure layer which comprises a first i-type thin layer (3A), a thin layer (3B) doped with dopant by an atomic plane doping process, and a second i-type thin layer (3C), these thin layers forming a quantum well; generally an n-type layer; and electrodes (6, 7, 8) for source, drain, and gate.
摘要:
In order to manufacture an IC comprising high electron mobility semiconductor devices, it is necessary to make the carriers in channel layer not to loose their high mobility by thermal treatment during the IC fabrication process. It has been found that the mobility of the two dimensional electron gas (2DEG) is lost by scattering of ionized impurity diffused from doped layer into spacer layer which separates the 2DEG in channel layer from the doped layer. A multilayered structure is proposed including a channel layer (12) made of i-GaAs and formed on a high resistivity GaAs substrate (11), a first spacer layer (13) of undoped Al x Ga 1-x As, a second spacer layer (14) of i-GaAs and a doped layer of n-Al x Ga 1 - x As. The thickness of the second spacer layer (14) is approximately 2 x 10- 9 m, and that of the first spacer is approximately 4x 10 -9 m. A high electron mobility transistor, having such a structure could withstand a heat treatment at 750° C for 10 min. and at more than 950° C for 10 sec. for annealing, the second spacer (14) preventing the diffusion of impurity.
摘要:
A quantum interference semiconductor device for producing an output in response to interference of electron waves comprises a source region (214) for injecting electrons, a drain region (216) for collecting electrons, a passage (217) for flowing the injected electrons from the source region to the drain region, a passage dividing structure (218, 220, 222) provided in the passage for dividing the passage into a first region in contact with the source region and a second region in contact with the drain region by inducing depletion regions in the passage so as to prohibit the electrons flowing through the passage, the passage dividing structure having a longitudinal size approximately equal to or smaller than the inelastic and elastic scattering length of electrons and constructed such that a plurality of spot-like channel regions (224, 226) are provided in the passage dividing structure for passing the electrons from the first region to the second region in a form of electron waves with respective phase shifts, each of the plurality of spot-like channel regions having a lateral width confined approximately equal to or smaller than the de Broglie wavelength of the electrons passing therethrough, and a control structure (218, 220) for controlling the phase of electron waves passing through at least one of the plurality of spot-like channel regions.