公开(公告)号：EP2506192A2

公开(公告)日：2012-10-03

申请号：EP12159855.1

申请日：2012-03-16

申请人： Fujitsu Limited ,  Fujitsu Frontech Limited

发明人： Baba, Shunji ,  Ishikawa, Naoki ,  Hashimoto, Shigeru ,  Niwata, Tsuyoshi ,  Sugimura, Yoshiyasu ,  Nogami, Satoru ,  Miura, Mimpei

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07728

摘要： An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

摘要翻译： 公开了一种RFID标签，其包括具有柔性和弹性的第一片; 具有柔性和弹性的天线，并被配置为形成在所述第一片的表面上; 配置为电连接到所述天线的IC芯片; 具有柔性和弹性的第二片，被配置为附接到第一片并且用第一片覆盖天线和IC芯片; 以及具有柔性和弹性并被构造成覆盖IC芯片和IC芯片和天线的连接部分的加强构件。

公开(公告)号：EP1746651A3

公开(公告)日：2007-04-18

申请号：EP05257725.1

申请日：2005-12-15

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki ,  Kira, Hidehiko ,  Baba, Shunji ,  Kobayashi, Hiroshi ,  Kikuchi, Shunichi ,  Tsuneno, Tatsuro

IPC分类号： H01L23/498 ,  G06K19/077 ,  H01L21/00

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip (11) mounting method which mounts two or more IC chips (11) on a base (13), includes: preparing a wafer (10) by mounting a tape (30) on a face thereof, which is the reverse of the wafer (10) having a mounting surface to be attached to the base (13), and by dividing the wafer (10) into IC chips (11) by dicing while leaving the tape (30); positioning the wafer (10) to face the base (13) in such a direction that the mounting surface to be attached to the base (13) faces the base (13); sequentially pressing the IC chips (11) on the wafer (10) against the base (13) and temporarily fixing the IC chips (11) while the base (13) is being fed in a prescribed one-dimensional direction along the wafer (10) and while the wafer (10) is being moved two-dimensionally along the base (13) ; and fixing the IC chips (11) temporarily fixed on the base (13) on the base (13) by heating and pressurizing in a batch manner.

公开(公告)号：EP1746651B1

公开(公告)日：2016-09-28

申请号：EP05257725.1

申请日：2005-12-15

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki ,  Kira, Hidehiko ,  Baba, Shunji ,  Kobayashi, Hiroshi ,  Kikuchi, Shunichi ,  Tsuneno, Tatsuro

IPC分类号： H01L21/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L23/498 ,  G06K19/077

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

公开(公告)号：EP1746651A2

公开(公告)日：2007-01-24

申请号：EP05257725.1

申请日：2005-12-15

申请人： FUJITSU LIMITED ,  Fujitsu Frontech Limited

发明人： Ishikawa, Naoki ,  Kira, Hidehiko ,  Baba, Shunji ,  Kobayashi, Hiroshi ,  Kikuchi, Shunichi ,  Tsuneno, Tatsuro

IPC分类号： H01L23/498 ,  G06K19/077 ,  H01L21/00

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip (11) mounting method which mounts two or more IC chips (11) on a base (13), includes: preparing a wafer (10) by mounting a tape (30) on a face thereof, which is the reverse of the wafer (10) having a mounting surface to be attached to the base (13), and by dividing the wafer (10) into IC chips (11) by dicing while leaving the tape (30); positioning the wafer (10) to face the base (13) in such a direction that the mounting surface to be attached to the base (13) faces the base (13); sequentially pressing the IC chips (11) on the wafer (10) against the base (13) and temporarily fixing the IC chips (11) while the base (13) is being fed in a prescribed one-dimensional direction along the wafer (10) and while the wafer (10) is being moved two-dimensionally along the base (13) ; and fixing the IC chips (11) temporarily fixed on the base (13) on the base (13) by heating and pressurizing in a batch manner.

摘要翻译： 一种在基座（13）上安装两个或更多IC芯片（11）的IC芯片（11）安装方法包括：通过在其表面上安装带（30）来准备晶片（10）， 晶片（10）具有待安装到基座（13）的安装表面，并且通过在离开带（30）的同时通过切割将晶片（10）分割成IC芯片（11）; 将晶片（10）定位成使得待附接到基座（13）的安装表面朝向基座（13）的方向面对基座（13）; （13）沿着晶片（10）在规定的一维方向上进给的同时，顺序地将晶片（10）上的IC芯片（11）按压在底座（13）上并临时固定IC芯片 ），同时晶片（10）沿基座（13）二维移动; 并通过分批加热和加压将临时固定在基座（13）上的IC芯片（11）固定在基座（13）上。

公开(公告)号：EP2506192A3

公开(公告)日：2014-04-02

申请号：EP12159855.1

申请日：2012-03-16

申请人： Fujitsu Limited ,  Fujitsu Frontech Limited

发明人： Baba, Shunji ,  Ishikawa, Naoki ,  Hashimoto, Shigeru ,  Niwata, Tsuyoshi ,  Sugimura, Yoshiyasu ,  Nogami, Satoru ,  Miura, Mimpei

IPC分类号： G06K19/077

CPC分类号： G06K19/07749 ,  G06K19/07728

摘要： An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

摘要翻译： 公开了一种RFID标签，其包括具有柔性和弹性的第一片材​​; 天线，具有柔性和弹性并被构造成形成在所述第一片的表面上; IC芯片，被配置为电连接到天线; 第二片，其具有柔性和弹性，并被构造成附接到第一片并且用第一片覆盖天线和IC芯片; 以及具有柔性和弹性的加强构件，并被配置为覆盖IC芯片以及IC芯片和天线的连接部分。

公开(公告)号：EP1369910A3

公开(公告)日：2006-04-19

申请号：EP03016690.4

申请日：1998-03-20

申请人： FUJITSU LIMITED

发明人： Tsunoi, Kazuhisa ,  Kira, Hidehiko ,  Baba, Shunji ,  Fuji, Akira ,  Kusagaya, Toshihiro ,  Kobae, Kenji ,  Kainuma, Norio ,  Ishikawa, Naoki ,  Emoto, Satoshi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A semiconductor device (31) having bumps (36) is to be mounted on a board (33) having pads (34) so that each of the bumps (36) is joined to a corresponding one of the pads (34). Adhesive (39) to be hardened by heat is provided between the semiconductor device (31) and the board (33). The mounting method includes the steps of pressing the bumps (36) of the semiconductor device (31) on the pads (34) of the board (33), and heating a portion in which each of the bumps (36) and a corresponding one of the pads (34) are in contact with each other. A pressure of the bumps (36) to the pads (34) reaches a predetermined value before a temperature of the adhesive (39) to which heat is supplied in the above step reaches a temperature at which the adhesive (39) is hardened.

公开(公告)号：EP1369910B1

公开(公告)日：2009-08-19

申请号：EP03016690.4

申请日：1998-03-20

申请人： FUJITSU LIMITED

发明人： Tsunoi, Kazuhisa ,  Kira, Hidehiko ,  Baba, Shunji ,  Fuji, Akira ,  Kusagaya, Toshihiro ,  Kobae, Kenji ,  Kainuma, Norio ,  Ishikawa, Naoki ,  Emoto, Satoshi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

公开(公告)号：EP1369910A2

公开(公告)日：2003-12-10

申请号：EP03016690.4

申请日：1998-03-20

申请人： FUJITSU LIMITED

发明人： Tsunoi, Kazuhisa ,  Kira, Hidehiko ,  Baba, Shunji ,  Fuji, Akira ,  Kusagaya, Toshihiro ,  Kobae, Kenji ,  Kainuma, Norio ,  Ishikawa, Naoki ,  Emoto, Satoshi

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A semiconductor device (31) having bumps (36) is to be mounted on a board (33) having pads (34) so that each of the bumps (36) is joined to a corresponding one of the pads (34). Adhesive (39) to be hardened by heat is provided between the semiconductor device (31) and the board (33). The mounting method includes the steps of pressing the bumps (36) of the semiconductor device (31) on the pads (34) of the board (33), and heating a portion in which each of the bumps (36) and a corresponding one of the pads (34) are in contact with each other. A pressure of the bumps (36) to the pads (34) reaches a predetermined value before a temperature of the adhesive (39) to which heat is supplied in the above step reaches a temperature at which the adhesive (39) is hardened.

摘要翻译： 具有凸块（36）的半导体器件（31）将安装在具有焊盘（34）的板（33）上，使得每个凸块（36）接合到对应的一个焊盘（34）。 在半导体器件（31）和基板（33）之间设置被热硬化的粘合剂（39）。 安装方法包括以下步骤：将半导体器件（31）的凸块（36）按压在板（33）的焊盘（34）上，并且加热其中每个凸起（36）和相应的一个 的焊盘（34）彼此接触。 在上述步骤中供应热量的粘合剂（39）的温度达到粘合剂（39）硬化的温度之前，到焊盘（34）的凸起（36）的压力达到预定值。