公开(公告)号：EP3331978A1

公开(公告)日：2018-06-13

申请号：EP16833562.8

申请日：2016-07-28

申请人： Fujifilm Electronic Materials USA, Inc.

发明人： SAKAMURI, Raj ,  DIMOV, Ognian N. ,  NAIINI, Ahmad A. ,  MALIK, Sanjay ,  DE, Binod B. ,  REINERTH, William A.

IPC分类号： C11D11/00 ,  C09G1/02 ,  C11D7/32 ,  C11D7/50 ,  H01L21/304

CPC分类号： C09G1/02 ,  C09D5/08 ,  C11D3/0073 ,  C11D7/32 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/3281 ,  C11D7/50 ,  C11D7/5004 ,  C11D11/00 ,  C11D11/0047 ,  G03F7/027 ,  G03F7/2053 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02063 ,  H01L21/31133

摘要： This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weight a hydroxylammonium compound; (d) 5 - 95 percent by weight an organic solvent; (e) 0.1 - 5 percent by weight a corrosion inhibitor compound; and (f) 2 -25 percent by weight water.

公开(公告)号：EP2997075A1

公开(公告)日：2016-03-23

申请号：EP14797717.7

申请日：2014-05-16

申请人： FujiFilm Electronic Materials USA, Inc.

发明人： MALIK, Sanjay ,  REINERTH, William A. ,  DE, Binod B. ,  NAIINI, Ahmad A.

IPC分类号： C08G81/02

CPC分类号： C08G73/1032 ,  B05D1/005 ,  B05D1/02 ,  C07C211/09 ,  C07C321/00 ,  C07C2602/08 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K5/0025 ,  C08K5/06 ,  C08K5/07 ,  C08K5/101 ,  C08K5/1535 ,  C09D179/08 ,  H01L21/02118 ,  H01L21/02282 ,  H01L23/293 ,  C08K5/37

摘要： This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.

公开(公告)号：EP3417010A1

公开(公告)日：2018-12-26

申请号：EP17865691.4

申请日：2017-10-18

申请人： FujiFilm Electronic Materials USA, Inc.

发明人： DE, Binod B. ,  MALIK, Sanjay ,  REINERTH, William A. ,  DIMOV, Ognian N. ,  NAIINI, Ahmad A. ,  SAKAMURI, Raj

IPC分类号： C08L79/08 ,  C08G73/14 ,  C08J5/18 ,  H01L23/29

摘要： This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here](la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

公开(公告)号：EP1861750A2

公开(公告)日：2007-12-05

申请号：EP06748492.3

申请日：2006-03-22

申请人： FujiFilm Electronic Materials USA, Inc.

发明人： POWELL, David B. ,  NAIINI, Ahmad A. ,  METIVIER, N. Jon ,  PERRY, Donald F.

IPC分类号： G03C5/00

CPC分类号： G03F7/11 ,  G03F7/038 ,  G03F7/039 ,  G03F7/09 ,  G03F7/16

摘要： A pretreatment composition for treating a substrate to be subjected to forming a relief pattern thereon by exposure to actinic radiation, the pretreatment composition comprising: (a) at least one compound having Structure (VI), wherein, V is selected from CH and N, Y is selected from O and NR3 wherein R3 is selected from H, CH3 and C2H5, R1 and R2 are each independently selected from H, a C1 - C4 alkyl group, a C1 - C4 alkoxy group, cyclopentyl and cyclohexyl, or alternatively, R1 and R2 can be fused to produce a substituted or unsubstituted benzene ring, with the proviso that the substituent is not an electron withdrawing group, (b) at least one organic solvent, and optionally, (c) at least one adhesion promoter; wherein the amount of the compound of Structure (VI) present in the composition effective to inhibit residue from forming when the photosensitive composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate. Processes for pretreatment of substrates and processes for forming relief images on pretreated substrates are disclosed.