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    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
    1.
    发明公开
    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS 审中-公开
    新型光敏树脂组合

    公开(公告)号：EP1886187A2

    公开(公告)日：2008-02-13

    申请号：EP06771936.9

    申请日：2006-06-02

    申请人： FujiFilm Electronic Materials USA, Inc.

    发明人： POWELL, David, P. ,  NAIINI, Ahmad, A. ,  METIVIER, N., Jon ,  RUSHKIN, Il'ya ,  HOPLA, Richard

    IPC分类号： G03C1/00

    CPC分类号： G03F7/023 ,  G03F7/022 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0751 ,  G03F7/085

    摘要： A photosensitive resin composition comprising: (d) at least one polybenzoxazole precursor polymer (e) at least one compound having structure VI : V1-Y-V2, wherein Y is selected from S, O, NR2, (HOCH)P , and Formula (A) each R1 is selected H, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group or a halogen, each R2 is selected from H, SH, CH3, C2H5, and a linear or branched C1-C4 alkyl group containing a thiol group; p is an integer of from 1 to 4, and wherein V1 and V2 are independently selected from the group consisting of Formula (B) and Formula (C) wherein, m is independently an integer from 0 to 4 with the proviso that m = 0 only when Y = Formula (D) n is an integer from 1 to 5; and each R1 is defined as above; and (f) at least one solvent; wherein the amount of the compound of Structure VI present is an amount effective to inhibit residue from forming when the composition is coated on a substrate and the substrate is subsequently processed to form an image, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety on the polymer, then (d) at least one photoactive compound is also present in the composition.

    PRETREATMENT COMPOSITIONS
    2.
    发明公开
    PRETREATMENT COMPOSITIONS 审中-公开
    组合物用于治疗

    公开(公告)号：EP1885819A2

    公开(公告)日：2008-02-13

    申请号：EP06771813.0

    申请日：2006-06-02

    申请人： FujiFilm Electronic Materials USA, Inc.

    发明人： POWELL, David, B. ,  NAIINI, Ahmad, A. ,  METIVIER, N. Jon ,  RUSHKIN, Il'ya ,  HOPLA, Richard

    IPC分类号： C09K13/00

    CPC分类号： G03F7/11 ,  G03F7/0046 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/0382 ,  G03F7/0392 ,  G03F7/0751 ,  Y10T428/12528

    摘要： A pretreatment composition of (a) at least one compound having structure Vl wherein Y is selected from the group consisting of S, O, NR2, (HOCH)P, and each R1 is independently selected from H, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group or a halogen, each R2 is independently H, SH, CH3, C2H5, and a linear or branched C1-C4 alkyl group containing a thiol group; and wherein V1 and V2 are independently selected from wherein, m is independently an integer from 0 to 4 with the proviso that m can = 0 only when Y = n is an integer from 1 to 5; p is an integer of from 1 to 4, and each R1 is defined as above; (b) at least one organic solvent, and optionally, (c) at least one adhesion promoter; wherein the amount of the compound of Structure Vl present in the composition is effective to inhibit residue from forming when the photosensitive composition is coated on a substrate and the coated substrate is processed to form an image thereon.

    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
    3.
    发明公开
    NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS 有权
    新型光敏树脂组合物

    公开(公告)号：EP1636649A2

    公开(公告)日：2006-03-22

    申请号：EP04754154.5

    申请日：2004-06-03

    申请人： FujiFilm Electronic Materials USA, Inc.

    发明人： RUSHKIN, Il'ya ,  NAIINI, Ahmad, A. ,  HOPLA, Richard ,  WATERSON, Pamela, J. ,  WEBER, William, D. ,  POWELL, David, B.

    IPC分类号： G03F1/00

    CPC分类号： G03F7/038 ,  G03F7/0382 ,  G03F7/0751 ,  Y10S430/106

    摘要： A heat resistant negative working photosensitive composition that comprises (a) one or more polybenzoxazole precursor polymers (I): wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar 1 is a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar 2 is a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, or a divalent aliphatic group that may contain silicon; Ar 3 is a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar 4 is Ar 1 (OH) 2 or Ar 2 ; G is a monovalent organic group a carbonyl, carbonyloxy or sulfonyl group; (b) one or more photo-active compounds which release acid upon irradiation (PAGs); (c) one or more latent crosslinkers each of which contains at least two ~N-(CH 2 OR) n units (n=1 or 2, wherein R is a linear or branched C 1 -C 8 alkyl group); (d) at least one solvent, and (e) at least one dissolution rate modifier, with the proviso that when the latent crosslinker is highly reactive, the dissolution rate modifier does not contain carboxylic acid groups.

    摘要翻译： 一种耐热负型光敏组合物，其包含（a）一种或多种聚苯并恶唑前体聚合物（I）：其中x是约10至约1000的整数，y是0至约900的整数并且（x + y）是 大约少于1000; Ar 1是四价芳族基团，四价杂环基团或其混合物; Ar 2是可以含有硅的二价芳族基团，二价杂环基团，二价脂环族基团或二价脂族基团; Ar 3是二价芳族基团，二价脂族基团，二价杂环基团或其混合物; Ar4是Ar1（OH）2或Ar2; G为一价有机基团，为羰基，羰氧基或磺酰基; （b）一种或多种在照射时释放酸的光敏化合物（PAG）; （c）一种或多种潜伏性交联剂，其每种含有至少两个N-（CH 2 OR）n单元（n = 1或2，其中R是直链或支链的C 1 -C 8烷基）; （d）至少一种溶剂，和（e）至少一种溶解速率调节剂，条件是当潜交联剂具有高度反应性时，溶解速率调节剂不含羧酸基团。