摘要:
Provided is an actinic-ray- or radiation-sensitive resin composition, includes a resin (P) containing a repeating unit (A) that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and a repeating unit (B) with a structure that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, and a compound (U) structured so that when the composition is formed into a film, the compound is unevenly distributed in a surface of the film.
摘要:
A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing the polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film, (c) exposing the resist film via an immersion medium, and (d) performing development with a negative developer.
摘要:
A pattern forming method performs a multiple exposure process, the multiple exposure process comprising: exposing a resist film with actinic rays or radiation a plurality of times, wherein a contact angle of the resist film for water is 75° or more.
摘要:
A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing the polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film, (c) exposing the resist film via an immersion medium, and (d) performing development with a negative developer.
摘要:
Provided is a pattern-forming method including, in the following order: (1) a process of forming a film with an actinic ray-sensitive or radiation-sensitive resin composition comprising a resin which contains an acid-decomposable repeating unit and is capable of decreasing the solubility in an organic solvent by the action of an acid; (2) a process of exposing the film with an electron beam or an EUV ray; and (4) a process of developing the film with a developer containing an organic solvent, wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises: (A) the resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility in an organic solvent by the action of an acid; (B) a compound generating an acid upon irradiation with an actinic ray or radiation; and (C) a solvent; and resin (A) is (Ai) a resin having a lactone group and containing a repeating unit represented by the following formula (1), or (Aii) a resin containing a repeating unit having an alicyclic hydrocarbon structure substituted with a hydroxyl group or cyano group and a repeating unit represented by the following formula (1):
wherein A represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, or a cyano group; R represents a halogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, an aralkyl group, an alkoxy group, an alkylcarbonyloxy group, an alkylsulfonyloxy group, an alkyloxycarbonyl group or an aryloxycarbonyl group, and when two or more R's are present, each R may be the same as or different from every other R or when two or more R's are present, they may form a ring in combination with each other; a represents an integer of 1 to 3; and b represents an integer of 0 to (3-a).
摘要:
A pattern forming method, comprising: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; (C) developing the resist film with a positive developer which is an alkali developer; and (D) developing the resist film with a negative developer containing an organic solvent.
摘要:
A pattern forming method, comprising: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer containing butyl acetate.
摘要:
A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer which is an alkaline developer and less soluble in a negative developer comprising an organic solvent upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer comprising an organic solvent.