公开(公告)号：EP1446988A2

公开(公告)日：2004-08-18

申请号：EP02768647.6

申请日：2002-08-21

申请人： GENERAL ELECTRIC COMPANY

发明人： EBERHARD, Jeffrey, Wayne ,  COLE, Herbert, Stanley ,  KWASNICK, Robert, Forrest ,  SITNIK-NIETERS, Theresa, Ann

IPC分类号： H05G1/00

CPC分类号： G01T1/2002 ,  G01T1/1642 ,  G01T1/2018 ,  Y10T156/10

摘要： A radiation imaging system (20) comprising a scintillator (26), an imager array (30), and a lamination layer (22). Lamination layer (22) bonds and optically couples scintillator (26) to imager array (30). Lamination layer (22) is comprised of a lamination material that is substantially free from void spaces. Radiation imaging system (20) fabrication comprises the steps of disposing lamination layer (22) between a light imager (24) and a scintillator (26) to form a subassembly (150). Light imager (24) comprises imager array (30), an imaging plate surface (34) and a plurality of contact pads (32). Additional steps include subjecting subassembly (150) to a vacuum; heating subassembly (150) to a bonding temperature, exerting a bonding force on subassembly (150), maintaining the vacuum, the bonding temperature and the bonding force until light imager (24) is bonded to the scintillator (26) and the lamination layer (22) is comprised of lamination material that is substantially free from void spaces.

公开(公告)号：EP0710430B1

公开(公告)日：2004-11-24

申请号：EP95920427.2

申请日：1995-05-15

申请人： GENERAL ELECTRIC COMPANY

发明人： WOJNAROWSKI, Robert, John ,  COLE, Herbert, Stanley ,  SITNIK-NIETERS, Theresa, Ann ,  DAUM, Wolfgang

IPC分类号： H05K1/03 ,  H01L23/532 ,  H01L23/538

CPC分类号： H05K1/0313 ,  H01L21/481 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2203/083 ,  H05K2203/122 ,  Y10S521/918 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer (20a) for interconnecting a circuit chip (14) supported by a substrate (10) and the use as printed circuit board material (110).

公开(公告)号：EP0710430A1

公开(公告)日：1996-05-08

申请号：EP95920427.0

申请日：1995-05-15

申请人： GENERAL ELECTRIC COMPANY

发明人： WOJNAROWSKI, Robert, John ,  COLE, Herbert, Stanley ,  SITNIK-NIETERS, Theresa, Ann ,  DAUM, Wolfgang

IPC分类号： B32B7 ,  B32B18 ,  H01L21 ,  H01L23 ,  H05K1 ,  H05K3

CPC分类号： H05K1/0313 ,  H01L21/481 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2203/083 ,  H05K2203/122 ,  Y10S521/918 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer (20a) for interconnecting a circuit chip (14) supported by a substrate (10) and the use as printed circuit board material (110).