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公开(公告)号：EP1794836A4
公开(公告)日：2010-03-24
申请号：EP05776596
申请日：2005-08-01
Applicant: HARRIS CORP
Inventor： SMITH SINJIN C W , NEWTON CHARLES M , GASSMAN RICHARD
CPC classification number: H02J7/34 , H01L35/30 , H01M10/052 , H01M10/0525 , H01M10/0565 , H02J2001/004
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Patent Agency Ranking2.发明公开METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS HAVING HEAT SENSITIVE CIRCUIT ELEMENTS 有权方法和设备柔性电路与热敏感的电路元件密封
公开(公告)号：EP1848578A4
公开(公告)日：2010-09-22
申请号：EP06719889
申请日：2006-01-31
Applicant: HARRIS CORP
Inventor： SMITH C W , NEWTON CHARLES M , JAYNES PAUL B
CPC classification number: B32B37/06 , B32B37/04 , B32B37/08 , B32B37/10 , B32B37/1009 , B32B37/185 , B32B2305/55 , B32B2309/02 , B32B2457/08 , H05K1/189 , H05K3/284 , H05K2201/064 , H05K2203/068 , H05K2203/1121 , H05K2203/1311 , H05K2203/304
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3.发明公开
公开(公告)号：EP1790060A4
公开(公告)日：2012-01-04
申请号：EP05776571
申请日：2005-08-01
Applicant: HARRIS CORP
Inventor： SMITH SINJIN C W , NEWTON CHARLES M , GASSMAN RICHARD
CPC classification number: H01L35/30 , F23C2900/03001 , H02N3/00
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公开(公告)号：EP1790019A4
公开(公告)日：2010-03-24
申请号：EP05778443
申请日：2005-08-01
Applicant: HARRIS CORP
Inventor： SMITH SINJIN C W , NEWTON CHARLES M , GASSMAN RICHARD
CPC classification number: H01L35/30
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5.发明公开METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE 有权对于一个LCP基板进行密封，方法和设备MANUFACTURED柔性电路
公开(公告)号：EP1789840A4
公开(公告)日：2009-09-02
申请号：EP05781615
申请日：2005-08-01
Applicant: HARRIS CORP
Inventor： SMITH C W SINJIN , NEWTON CHARLES M , JAYNES PAUL B
IPC: G02F1/1339
CPC classification number: H05K3/281 , B30B5/02 , B30B15/34 , B32B37/10 , B32B37/1009 , B32B37/185 , B32B2305/34 , B32B2305/55 , H05K1/189 , H05K3/284 , H05K2201/0141 , H05K2203/065 , H05K2203/068 , H05K2203/1311
Abstract: A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.
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公开(公告)号：EP1812955A4
公开(公告)日：2009-01-07
申请号：EP05816032
申请日：2005-10-20
Applicant: HARRIS CORP
Inventor： SMITH C W SINJIN , JAYNES PAUL B , NEWTON CHARLES M
IPC: H01K3/22
CPC classification number: H05K3/0014 , H05K1/0366 , H05K2201/0141 , H05K2201/0323 , H05K2201/09018 , H05K2201/091 , H05K2203/1105 , H05K2203/302 , Y10S156/924 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49158 , Y10T156/1189 , Y10T428/10 , Y10T428/1005
Abstract: A method and apparatus relating to a multifunctional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
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