ELECTRONIC CONTROL DEVICE
    1.
    发明公开
    ELECTRONIC CONTROL DEVICE 审中-公开
    ELEKTRONISCHE STEUERUNGSVORRICHTUNG

    公开(公告)号:EP2991465A4

    公开(公告)日:2017-04-19

    申请号:EP14789081

    申请日:2014-04-23

    Abstract: The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.

    Abstract translation: 本发明的目的在于提高电子部件与布线图案之间的焊料连接部分的可靠性。 一对布线图案(31A和31B)通过绝缘层(37)形成在电路布线板(30)上。 每个布线图案(31A和31B)具有平台(33a或33b)和比平台更窄的布线部分(34a或34b)。 通过焊料(42)将芯片元件(41)焊接到焊盘(33a和33b)上。 将各布线部分(34a或34b)连接到相应焊盘(33a或33b)的每个连接部分(53)的x(宽度)方向中心(Xa)设置在两个区域 其中芯片部件(41)的预定宽度(Wc)的区域在x(纵向)方向上延伸,并且芯片部件(41)的预定长度(Lc)的区域以ay( 横向)方向。

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