公开(公告)号：EP2657966A4

公开(公告)日：2017-01-18

申请号：EP11850375

申请日：2011-12-07

申请人： HITACHI AUTOMOTIVE SYSTEMS LTD

发明人： SUWA TOKIHITO ,  KANEKO YUJIRO ,  YURA MASASHI ,  TSUYUNO NOBUTAKE ,  ISHII TOSHIAKI ,  KUSUKAWA JUNPEI

IPC分类号： H01L25/07 ,  H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L25/11 ,  H01L25/16 ,  H01L25/18 ,  H02M7/00 ,  H02M7/48 ,  H05K7/20

CPC分类号： H05K7/20509 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/473 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H05K7/209 ,  H05K7/20927 ,  H01L2924/00

公开(公告)号：EP3193176A4

公开(公告)日：2018-05-16

申请号：EP15840211

申请日：2015-06-29

申请人： HITACHI AUTOMOTIVE SYSTEMS LTD

发明人： KANAMARU MASATOSHI ,  HAYASHI MASAHIDE ,  YURA MASASHI ,  JEONG HEEWON

IPC分类号： G01P21/00 ,  B81B3/00 ,  B81B7/00 ,  H01L29/84

CPC分类号： B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/045 ,  B81B2203/0136 ,  B81C99/0045 ,  G01C19/574 ,  G01P15/08 ,  G01P15/125 ,  G01P21/00 ,  H01L29/84

摘要： For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.