Abstract:
A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.
Abstract:
A package structure 800 and method of packaging for an interferometric modulator 830 is described. A transparent substrate 810 having an interferometric modulator 830 formed thereon is shown. A backplane 820 is joined to the transparent substrate 810 with a seal 840 where the interferometric modulator is exposed to the surrounding environment through an opening 850 in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure 800.
Abstract:
In one embodiment, a micro device is formed by depositing a sacrificial layer over a metallic electrode (step 304), forming a moveable structure over the sacrificial layer (step 306), and then etching the sacrificial layer with a noble gas fluoride (step 308). Because the metallic electrode is comprised of a metallic material that also serves as an etch stop in the sacrificial layer etch, charge does not appreciably build up in the metallic electrode. This helps stabilize the driving characteristic of the moveable structure. In one embodiment, the moveable structure is a ribbon in a light modulator.
Abstract:
The invention provides an MEMS element having improved characteristics, reducing beam strain deformation, and a method of producing the same, and a diffraction type MEMS element. The MEMS element of the invention comprises a substrate-side electrode, and a beam driven by an electrostatic force produced between it and the substrate-side electrode, the beam being formed of a plurality of thin films including a drive-side electrode, the beam being provided with a deformation preventing means for preventing beam deformation due to stress-induced strain in the thin films. The diffraction type MEMS element of the invention, which has the same substrate-side electrode as in the above arrangement, has a plurality of mutually independent beams opposed to the substrate-side electrode.
Abstract:
A package structure 800 and method of packaging for an interferometric modulator 830 is described. A transparent substrate 810 having an interferometric modulator 830 formed thereon is shown. A backplane 820 is joined to the transparent substrate 810 with a seal 840 where the interferometric modulator is exposed to the surrounding environment through an opening 850 in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure 800.
Abstract:
An analog beam-steering free-space optical switch for connecting and switching a plurality of optical signals includes a plurality of optical devices and electrostatic actuators for driving the optical devices. Each optical device is pivotally borne to allow rotation around a prescribed center, and each electrostatic actuator includes the substrate that holds the optical devices and a plurality of driving electrodes secured to the substrate. The application of electrostatic voltage between an optical device and the driving electrodes generates electrostatic driving torque for causing the optical device to tilt with respect to the substrate around the center of rotation, whereby the direction of reflection of an optical signal is changed. The driving electrodes are arranged in a radial pattern relative to the electrode center. Each driving electrode is formed such that the electrode width of a prescribed outer portion relative to the electrode center decreases with progression toward the outside. In addition, each driving electrode is shaped such that the width of a prescribed inner portion with respect to the electrode center decreases with progression toward the inside. Forming the driving electrodes in this way improves the driving torque characteristic of the micromirror and extends the range of steering angles within which stable positioning can be performed by low-voltage drive.