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    Thermal separation of electronic control chassis heatsink fins
    3.
    发明公开
    Thermal separation of electronic control chassis heatsink fins 审中-公开
    的电子控制单元壳体的散热片的热分离

    公开(公告)号：EP2658359A3

    公开(公告)日：2016-10-19

    申请号：EP13158841.0

    申请日：2013-03-12

    申请人： Hamilton Sundstrand Corporation

    发明人： Kokas, Jay W. ,  Maynard, Michael ,  Querns, Kerry R.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20418 ,  H05K7/14 ,  H05K7/20518

    摘要： An electronics chassis, 12, for containing and supporting electronic components having different operating temperatures includes a plurality of thermally conductive walls forming an enclosure. There is a first heat dissipator, 30, in at least one of the walls having a external heat dissipator and a second heat dissipator, 32, in at least one of the walls having a external heat dissipator. There is a thermal isolator, 34, positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material.

    High temperature environment capable motor controller
    4.
    发明公开
    High temperature environment capable motor controller 审中-公开
    环境能力的高温的发动机控制单元

    公开(公告)号：EP2584879A3

    公开(公告)日：2016-04-13

    申请号：EP12188743.4

    申请日：2012-10-16

    申请人： Hamilton Sundstrand Corporation

    发明人： Kokas, Jay W. ,  Versailles, Richard E. ,  Klapatch, Robert D. ,  Maynard, Michael ,  Querns, Kerry R.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20518 ,  H05K7/205

    摘要： A motor controller for use in an environment at a high maximum environmental temperature comprises an insulated chassis, a high-temperature capable electronic component, a low-temperature capable electronic component, and a heat pump. The high-temperature capable electronic component is rated for a temperature higher than the environmental temperature, whereas the low-temperature capable electronic component is rated for a temperature lower than the maximum environmental temperature. The insulated chassis has a finned surface to which the high-temperature capable electronic component is mounted, either directly or via thermally conductive posts. The low-temperature capable electronic component is attached to or integrated into a printed wiring board supported inside the insulated chassis by the thermally conductive posts. The heat pump is configured to draw heat from the low-temperature capable electronic component through the thermally conductive posts and a thermal spreader abutting the heat pump, and to expel heat into the finned surface of the insulating chassis.

    Thermal separation of electronic control chassis heatsink fins
    5.
    发明公开
    Thermal separation of electronic control chassis heatsink fins 审中-公开
    Thermische Trennung derKühlkörperrippeneines elektronischenSteuerungsgehäuses

    公开(公告)号：EP2658359A2

    公开(公告)日：2013-10-30

    申请号：EP13158841.0

    申请日：2013-03-12

    申请人： Hamilton Sundstrand Corporation

    发明人： Kokas, Jay W. ,  Maynard, Michael ,  Querns, Kerry R.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20418 ,  H05K7/14 ,  H05K7/20518

    摘要： An electronics chassis, 12, for containing and supporting electronic components having different operating temperatures includes a plurality of thermally conductive walls forming an enclosure. There is a first heat dissipator, 30, in at least one of the walls having a external heat dissipator and a second heat dissipator, 32, in at least one of the walls having a external heat dissipator. There is a thermal isolator, 34, positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material.

    摘要翻译： 用于容纳和支撑具有不同操作温度的电子部件的电子底盘12包括形成外壳的多个导热壁。 在至少一个具有外部散热器的壁中，至少一个壁具有外部散热器和第二散热器32，在至少一个壁中具有外部散热器，第一散热器30。 存在位于至少一个壁中的隔热器34，以在散热器之间提供热隔离，并且热隔离器包括绝热材料。

    Thermal separation of electronic control chassis heatsink fins
    6.
    发明授权
    Thermal separation of electronic control chassis heatsink fins 有权

    公开(公告)号：EP2658359B1

    公开(公告)日：2018-08-08

    申请号：EP13158841.0

    申请日：2013-03-12

    申请人： Hamilton Sundstrand Corporation

    发明人： Kokas, Jay W. ,  Maynard, Michael ,  Querns, Kerry R.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20418 ,  H05K7/14 ,  H05K7/20518

    摘要： An electronics chassis, 12, for containing and supporting electronic components having different operating temperatures includes a plurality of thermally conductive walls forming an enclosure. There is a first heat dissipator, 30, in at least one of the walls having a external heat dissipator and a second heat dissipator, 32, in at least one of the walls having a external heat dissipator. There is a thermal isolator, 34, positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material.

    Electric motor braking using thermoelectric cooling
    7.
    发明公开
    Electric motor braking using thermoelectric cooling 审中-公开
    采用热电冷却的电动机制动

    公开(公告)号：EP2717463A3

    公开(公告)日：2017-04-26

    申请号：EP13178936.4

    申请日：2013-08-01

    申请人： Hamilton Sundstrand Corporation

    发明人： Klapatch, Robert D. ,  Querns, Kerry R. ,  Versailles, Richard E.

    IPC分类号： H02P3/00 ,  H02P3/22 ,  H02P3/12 ,  F25B21/02

    CPC分类号： H02P3/00 ,  F25B21/02 ,  H02P3/12 ,  H02P3/22

    摘要： An electric motor controller, 202, includes controller electronics, 208, configured to control an electric motor, 204. The electric motor controller, 202, also includes a thermoelectric cooler in thermal communication with the controller electronics. The thermoelectric cooler is configured to receive a braking current associated with braking of the electric motor and provide cooling to the controller electronics.

    摘要翻译： 电动机控制器202包括配置成控制电动机204的控制器电子装置208.电动机控制器202还包括与控制器电子装置热连通的热电冷却器。 热电冷却器被配置为接收与电动机的制动相关联的制动电流并且向控制器电子器件提供冷却。

    High temperature environment capable motor controller
    10.
    发明公开
    High temperature environment capable motor controller 审中-公开
    UmgebungsfähigesHochtemperatur-Motorsteuergerät

    公开(公告)号：EP2584879A2

    公开(公告)日：2013-04-24

    申请号：EP12188743.4

    申请日：2012-10-16

    申请人： Hamilton Sundstrand Corporation

    发明人： Kokas, Jay W. ,  Versailles, Richard E. ,  Klapatch, Robert D. ,  Maynard, Michael ,  Querns, Kerry R.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20518 ,  H05K7/205

    摘要： A motor controller for use in an environment at a high maximum environmental temperature comprises an insulated chassis, a high-temperature capable electronic component, a low-temperature capable electronic component, and a heat pump. The high-temperature capable electronic component is rated for a temperature higher than the environmental temperature, whereas the low-temperature capable electronic component is rated for a temperature lower than the maximum environmental temperature. The insulated chassis has a finned surface to which the high-temperature capable electronic component is mounted, either directly or via thermally conductive posts. The low-temperature capable electronic component is attached to or integrated into a printed wiring board supported inside the insulated chassis by the thermally conductive posts. The heat pump is configured to draw heat from the low-temperature capable electronic component through the thermally conductive posts and a thermal spreader abutting the heat pump, and to expel heat into the finned surface of the insulating chassis.

    摘要翻译： 在高最高环境温度的环境中使用的电动机控制器包括绝缘底盘，高温能力电子部件，低温电子部件和热泵。 高温电子元件的额定温度高于环境温度，而低温电子元器件的额定温度低于最高环境温度。 绝缘底座具有安装高温电子部件的翅片表面，直接地或通过导热柱。 低温电子元件通过导热柱附接到或集成到支撑在绝缘底盘内的印刷线路板上。 热泵被构造成通过导热柱和附着热泵的热散布器从具有低温能力的电子部件吸取热量，并将热量排出到绝缘底盘的翅片表面。