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公开(公告)号：EP2952486A1
公开(公告)日：2015-12-09
申请号：EP14171020.2
申请日：2014-06-03
IPC分类号： C03C3/062 , C03C3/064 , C03C3/091 , C03C4/16 , C03C8/16 , C03C8/20 , H01C17/065 , H01G4/10 , H01G4/12
CPC分类号： H01B3/087 , C03C3/062 , C03C3/064 , C03C3/091 , C03C4/16 , C03C8/16 , C03C8/20 , C03C2207/08 , H01B19/02 , H01C17/06533 , H01G4/105 , H01G4/129
摘要： A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt% and no more than about 35 wt%, based upon 100% total weight of the glass composition, (ii) the median particle size (d 50 ) of the glass composition is no more than about 5 µm, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.
摘要翻译： 一种适用于电子设备的电介质玻璃组合物，其包含足够量的二氧化硅以在经受潮湿环境时赋予玻璃组合物耐久性，以及一种或多种碱金属氧化物，其中（i） 基于玻璃组合物的总重量的100％，碱金属氧化物为至少约10重量％且不超过约35重量％，（ii）玻璃组合物的中值粒径（d 50）不大于约 5μm，并且（iii）提供玻璃组合物的热膨胀系数至少约10ppm / K且不超过约25ppm / K。
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2.发明公开Solderable conductive polymer thick film composition 审中-公开LötbareleitfähigePolymer-Dickschichtzusammensetzung
公开(公告)号：EP2918371A1
公开(公告)日：2015-09-16
申请号：EP14000869.9
申请日：2014-03-11
发明人： Shahbazi, Samson , Grabey, Steven
IPC分类号： B23K35/30 , B23K35/32 , B23K35/36 , B23K35/365 , B23K35/02
CPC分类号： H05K3/3457 , B23K35/0244 , B23K35/025 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/322 , B23K35/3613 , B23K35/362 , B23K35/365 , H05K3/3478 , H05K3/3489 , H05K2203/041 , H05K2203/0485 , H05K2203/12 , Y10T428/31678
摘要： A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.
摘要翻译： 提供了适用于包含金属颗粒和包含至少一种酚醛树脂和溶剂的有机载体的无铅焊接的导电聚合物厚膜组合物。 还提供了焊接到本发明的导电聚合物厚膜组合物的方法。 提供了由本发明的导电性聚合物厚膜组合物形成的基板表面上的基板和固化聚合物膜的制品。
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公开(公告)号：EP2819126A1
公开(公告)日：2014-12-31
申请号：EP14174832.7
申请日：2014-06-27
CPC分类号： H01B1/16 , A61L31/022 , A61L31/026 , A61L31/18 , A61N1/05 , C04B41/4501 , C04B41/4576 , C08K3/08 , C08K3/22 , C08L1/28 , C08L93/04 , H01B1/22 , Y10T428/24273 , Y10T428/24322
摘要： An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al 2 O 3 , and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.
摘要翻译： 基于100重量％的浆料，包含约60-80重量％的铂颗粒，约10-20重量％的Al 2 O 3和约10-20重量％的有机载体的导电孔塞，其中 有机载体包括至少一种粘度调节组分，其量足以提供具有约800-1,500kcPs的粘度的导电孔塞糊。 还提供了一种用于具有本发明的导电孔塞膏的可植入医疗装置的陶瓷基片组件及其形成方法。
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公开(公告)号：EP2706538A2
公开(公告)日：2014-03-12
申请号：EP13004325.0
申请日：2013-09-04
IPC分类号： H01B1/22
摘要： An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m 2 /g, second copper particles having a specific surface area of about 0.5 ∼ 2.5 m 2 /g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zincbarium oxide glass frit, and an organic vehicle.
摘要翻译： 一种导电浆料，其包含比表面积为约0.15-1.0m 2 / g的第一铜粒子，比表面积为约0.5-2.5m 2 / g的第二铜粒子，玻璃料和有机载体。 根据本发明的另一实施例，第一铜颗粒为约60-80重量％ ％的糊剂，而第二铜颗粒的含量高达约20wt。 粘贴的百分比。 根据另一个实施例，玻璃料是无铅的并且是约1-10wt。 粘贴的百分比。 优选地，玻璃料包含硼 - 锌 - 钡氧化物玻璃料。 根据另一个实施例，糊剂还包含氧化铜。 本发明的另一个实施方案涉及一种导电浆料，其包含约60-95wt。 ％铜组分，硼锌钡玻璃料和有机载体。
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5.发明公开Soldering method for polymer thick film compositions 审中-公开LötverfahrenfürPolymerdickfilmzusammensetzungen
公开(公告)号：EP2918370A1
公开(公告)日：2015-09-16
申请号：EP14000868.1
申请日：2014-03-11
发明人： Grabey, Steven , Groman, Sarah , Persons, Ryan , Shahbazi, Samson
CPC分类号： B23K31/02 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/28 , B23K35/282 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/3613 , B32B15/08 , B32B37/24 , B32B2307/202 , B32B2307/206 , B32B2311/08 , B32B2311/12 , B32B2457/00 , Y10T428/31678
摘要： A method of soldering to a polymer thick film material, comprising the steps of providing a substrate having a polymer thick film layer on at least one surface of the substrate, incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed, curing the polymer thick film layer to secure the metal preform thereto, and soldering to the exposed surface of the metal preform using a solder material.
摘要翻译： 一种焊接到聚合物厚膜材料的方法，包括以下步骤：在基材的至少一个表面上提供具有聚合物厚膜层的基材，将金属预成型体结合到聚合物厚膜层中，使得金属的表面 预成型件暴露，固化聚合物厚膜层以固定金属预制件，并使用焊料材料焊接到金属预制件的暴露表面。
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公开(公告)号：EP2706538A3
公开(公告)日：2014-04-23
申请号：EP13004325.0
申请日：2013-09-04
IPC分类号： H01B1/22
摘要： An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m 2 /g, second copper particles having a specific surface area of about 0.5 ∼ 2.5 m 2 /g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zincbarium oxide glass frit, and an organic vehicle.
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