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    THICK FILM PASTE AND USE THEREOF
    2.
    发明授权
    THICK FILM PASTE AND USE THEREOF 有权
    厚膜糊及其用途

    公开(公告)号：EP2727121B1

    公开(公告)日：2017-06-21

    申请号：EP12735704.4

    申请日：2012-06-27

    申请人： E. I. du Pont de Nemours and Company

    发明人： GLICKSMAN, Howard David ,  PLISCOTT, Adele Amelia

    IPC分类号： H01B1/22 ,  H05K1/09 ,  C22C32/00 ,  H05K1/03 ,  H05K3/12 ,  C22C1/04

    CPC分类号： C22C32/0021 ,  B22F2998/00 ,  H01B1/22 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1291 ,  C22C1/0466

    摘要： A thick film paste comprising at least one particulate platinum (alloy), at least one metal compound, and an organic vehicle, wherein the at least one metal compound is selected from the group consisting of in each case particulate NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2, and metal compounds capable of forming a metal oxide on firing, the metal oxide being selected from the group consisting of NiO, SiO2, RuO2, Rh2O3, IrO2, Cu2O, CuO, TiO2, ZrO2, PbO, SnO2, CeO2, Al2O3, MgO, MnO2 and MoO2.

    摘要翻译： 包含至少一种颗粒状铂（合金），至少一种金属化合物和有机载体的厚膜浆料，其中所述至少一种金属化合物选自各自包含颗粒状NiO，SiO 2，RuO 2，Rh 2 O 3 ，IrO 2，Cu 2 O，CuO，TiO 2，ZrO 2，PbO，SnO 2，CeO 2，Al 2 O 3，MgO，MnO 2和MoO 2以及能够在焙烧时形成金属氧化物的金属化合物，所述金属氧化物选自NiO， ，RuO2，Rh2O3，IrO2，Cu2O，CuO，TiO2，ZrO2，PbO，SnO2，CeO2，Al2O3，MgO，MnO2和MoO2。

    METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE SUBSTRATE, AND TRANSPARENT CONDUCTIVE SUBSTRATE
    7.
    发明公开
    METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE SUBSTRATE, AND TRANSPARENT CONDUCTIVE SUBSTRATE 审中-公开
    用于生产透明导电基底和透明导电基

    公开(公告)号：EP2980681A1

    公开(公告)日：2016-02-03

    申请号：EP14774417.1

    申请日：2014-03-25

    申请人： Showa Denko K.K.

    发明人： UCHIDA Hiroshi

    IPC分类号： G06F3/041 ,  G06F3/044 ,  H01B5/14 ,  H01B13/00

    CPC分类号： G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K1/0296 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/1291

    摘要： Provided are a transparent conductive substrate production method and a transparent conductive substrate, which can be produced by simple steps, has superior pattern recognition performance, and is suitable for an electrostatic capacitance touch panel. Using a transparent conductive ink, first electrode regions 12 and second electrode regions 14 are printed on different positions on the same plane, a first electrode connecting region 16 which electrically connects the first electrode regions 12 is printed, and then, subjected to pulsed light irradiation, to form a sintered conductive body. Thereafter, the surface of the first electrode connecting region 16 is covered with a transparent insulation layer 18. Using the transparent conductive ink, a second electrode connecting region 20 which passes on the surface of the transparent insulation layer 18 and electrically connects the second electrode regions 14 in a direction different from the connecting direction of the first electrode connecting region 16 is printed, and then, subjected to pulsed light irradiation, to form a sintered conductive body.

    摘要翻译： 本发明提供一种透明导电性基材的制造方法和透明导电基板，其可以通过简单的步骤来制备，具有优异的图案识别性能，并且适合于静电电容触摸屏上。 使用透明导电油墨，第一电极区域12和第二电极区14被印刷在不同的位置在同一平面上，连接区16的第一电极电连接的第一电极区域12被印刷，然后，进行脉冲光照射 ，以形成烧结导电体。 有后，连接区域16中的第一电极的表面覆盖有透明绝缘层18采用透明导电性油墨，连接哪些通过透明绝缘层18的表面上，并且电区域20的第二电极连接的第二电极的区域 在从连接区域16中的第一电极的连接方向不同的方向14被印刷，然后，进行脉冲光的照射，以形成烧结导电体。

    LEITERPLATTE AUS AIN MIT KUPFERSTRUKTUREN
    9.
    发明公开
    LEITERPLATTE AUS AIN MIT KUPFERSTRUKTUREN 审中-公开

    公开(公告)号：EP2774461A1

    公开(公告)日：2014-09-10

    申请号：EP12787675.3

    申请日：2012-10-31

    申请人： CeramTec GmbH

    发明人： DOHN, Alexander ,  LENEIS, Roland ,  HERRMANN, Klaus ,  JÄHNIG, Dietmar

    IPC分类号： H05K3/24 ,  H05K3/40 ,  H01L27/01 ,  H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02

    CPC分类号： H05K3/1216 ,  H05K1/0263 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/245 ,  H05K3/246 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/10106 ,  H05K2203/086 ,  H05K2203/1476 ,  Y10T29/49165

    摘要： The invention relates to a process for producing a ceramic circuit board with electrical conductor traces and contacting points on at least one of the two sides, and with at least one through-hole contact (via). According to the invention, the following successive process steps are performed: a) Production of a ceramic substrate made of aluminium nitride and drilling of holes at the intended locations for the vias, b) Filling the holes with a first adhesive paste made of copper, tungsten, molybdenum or alloys thereof, or mixtures thereof, and c) Single-pass overprinting with a second adhesive paste using a first screen-printing operation on at least one side of the ceramic substrate with the desired layout of the conductor traces and contact points, d) Optionally, a full or partial repeat of overprinting with the second adhesive paste, e) Stoving the printed ceramic substrate in an oven with N
    2 (nitrogen), wherein the oxygen content is kept controlled to 0-50 ppm O
    2 , f) Overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste until the desired thickness of the conductor traces and contact points is achieved, g) Stoving the printed ceramic substrate in an oven with N
    2 (nitrogen), wherein the oxygen content is kept controlled to 0-50 ppm O
    2 .

    摘要翻译： 用于制造具有电导体迹线和侧面上的接触点并具有通孔接触的陶瓷电路板的方法，其顺序为a）在用于通孔的位置处产生AlN衬底和钻孔，b）用粘合剂填充孔 含有铜，钨和/或钼的合金或其合金，以及c）利用导电迹线和接触点的布局在陶瓷基板的侧面上使用第一丝网印刷操作的第二粘合剂糊剂进行单遍套印， d）任选地，用第二粘合剂浆料完全或部分重复套印，e）在氮气烘箱中用氮气烘烤印刷的陶瓷衬底，同时控制0-50ppm O2的氧气，f）使用第二丝网印刷方法 在第二粘合剂糊剂上覆盖玻璃膏，并且g）用氮气保持印刷的陶瓷基板，同时保持氧含量在0-50ppm O2。