INTEGRATED CIRCUIT HAVING PAIRS OF PARALLEL COMPLEMENTARY FINFETS
    3.
    发明公开
    INTEGRATED CIRCUIT HAVING PAIRS OF PARALLEL COMPLEMENTARY FINFETS 有权
    集成电路对平行互补FinFET的

    公开(公告)号:EP1639648A4

    公开(公告)日:2007-05-30

    申请号:EP04777432

    申请日:2004-06-30

    申请人: IBM

    摘要: A method and structure for an integrated circuit structure that utilizes complementary fin-type field effect transistors (FinFETs) is disclosed. The invention has a first-type of FinFET which includes a first fin (100), and a second-type of FinFET which includes a second fin (102) running parallel to the first fin (100). The invention also has an insulator fin positioned between the source/drain regions (130) of the first first-type of FinFET and the second-type of FinFET. The insulator fin has approximately the same width dimensions as the first fin (100) and the second fin (102), such that the spacing between the first-type of FinFET and the second-type of FinFET is approximately equal to the width of one fin. The invention also has a common gate (106) formed over channel regions of the first-type of FinFET and the second-type of FinFET. The gate (106) includes a first impurity doping region adjacent the first-type of FinFET and a second impurity doping region adjacent the second-type of FinFET. The differences between the first impurity doping region and the second impurity doping region provide the gate with different work functions related to differences between the first-type of FinFET and the second-type of FinFET. The first fin (100) and the second fin (102) have approximately the same width.

    SEMICONDUCTOR MEMORY DEVICE WITH INCREASED NODE CAPACITANCE
    5.
    发明公开
    SEMICONDUCTOR MEMORY DEVICE WITH INCREASED NODE CAPACITANCE 有权
    具有增强的节点容量半导体存储模块

    公开(公告)号:EP1692724A4

    公开(公告)日:2007-11-21

    申请号:EP03796818

    申请日:2003-12-08

    申请人: IBM

    摘要: An integrated circuit semiconductor memory device (100) has a first dielectric layer (116) characterized as the BOX layer absent from a portion (130) of the substrate (112) under the gate of a storage transistor to increase the gate-to-substrate capacitance and thereby reduce the soft error rate. A second dielectric layer (132) having a property different from the first dielectric layer at least partly covers that portion (130) of the substrate. The device may be a FinFET device including a fin (122) and a gate dielectric layer (124, 126) between the gate and the fin, with the second dielectric layer having less leakage than the gate dielectric layer.