公开(公告)号：EP3161512A4

公开(公告)日：2018-03-07

申请号：EP15812713

申请日：2015-06-26

Applicant: INTEL CORP

Inventor： HECK JOHN ,  DOYLEND JONATHAN ,  HUTCHISON DAVID ,  RONG HAISHENG ,  SENDOWSKI JACOB

IPC: G01S7/481 ,  G01S17/89

CPC classification number: G02F1/1326 ,  G01S7/4817 ,  G01S17/10 ,  G01S17/325 ,  G01S17/42 ,  G01S17/89 ,  G02B6/12004 ,  G02B2006/12061 ,  G02B2006/12147

Abstract: A solid state photonics circuit having a liquid crystal (LC) layer for beam steering. The LC layer can provide tuning of an array of waveguides by controlling the application of voltage to the liquid crystal. The application of voltage to the liquid crystal can be controlled to perform beam steering with the light signal based on different tuning in each of the waveguides of the array. The waveguides are disposed in a substrate having an oxide or other insulating layer with an opening. The opening in the oxide layer exposes a portion of a path of the array of waveguides. The waveguides are exposed to the liquid crystal through the oxide opening, which allows the voltage changes to the liquid crystal to tune the optical signals in the waveguides.

公开(公告)号：EP3080618A4

公开(公告)日：2017-11-01

申请号：EP14869807

申请日：2014-11-19

Applicant: INTEL CORP

Inventor： HUTCHISON DAVID N ,  HECK JOHN

IPC: G01P15/14 ,  B81B7/02 ,  G01B9/02 ,  G01C19/5656 ,  G01C19/5712 ,  G01C19/5733 ,  G01C19/5776 ,  G01P15/02 ,  G01P15/08 ,  G01P15/093

CPC classification number: G01P15/093 ,  G01B9/02023 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5733 ,  G01C19/5776 ,  G01P2015/0848

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for MEMS sensing device configured to determine inertial change applied to the device. In one instance, the device may comprise a laser arrangement configured to generate a light beam, and a waveguide configured to split the light beam into two portions. The waveguide may include two arms through which the respective portions of the light beam may respectively pass, and disposed substantially parallel with each other and joined together around their respective ends to recombine the portions into a light beam. One of the arms may be deformable. A deformation of the arm may result in a change of an optical path length of a portion of the light beam traveling through the arm, causing a detectable change in light intensity of the recombined light beam outputted by the waveguide. Other embodiments may be described and/or claimed.

公开(公告)号：EP3080617A4

公开(公告)日：2017-10-25

申请号：EP14870402

申请日：2014-11-19

Applicant: INTEL CORP

Inventor： HUTCHISON DAVID N ,  HECK JOHN

IPC: G01P3/68 ,  B81B7/02 ,  G01P15/093 ,  H01S3/10

CPC classification number: G01P15/093 ,  G01C19/56 ,  G01D5/268 ,  G01P15/14 ,  G02B26/0858 ,  G02F1/025

Abstract: Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing device, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output a first portion of the light beam, and a second waveguide having a section that is evanescently coupled to the first waveguide and configured to receive and output a second portion of the light beam. The section of the second waveguide is configured to be movable substantially parallel to the first waveguide, wherein a movement of the section of the second waveguide may be caused by an inertial change applied to the sensing device. The movement of the section may cause a detectable change in light intensity between the first and second portions of the light beam. Based on the detected change, the inertial change may be determined. Other embodiments may be described and/or claimed.

公开(公告)号：EP2795675A4

公开(公告)日：2015-11-25

申请号：EP11878060

申请日：2011-12-20

Applicant: INTEL CORP

Inventor： HECK JOHN ,  BAR HANAN ,  FESHALI AVI ,  FELDESH RAN

IPC: H01L27/14 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B6/13 ,  G02B2006/12061 ,  H01L21/28575 ,  H01L21/8252 ,  H01L21/8258 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/205

公开(公告)号：EP2585864A4

公开(公告)日：2015-10-14

申请号：EP11807266

申请日：2011-06-27

Applicant: INTEL CORP

Inventor： HECK JOHN ,  LIU ANSHENG ,  PANICCIA MARIO J

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/422

公开(公告)号：EP3161435A4

公开(公告)日：2018-03-28

申请号：EP15812427

申请日：2015-05-26

Applicant: INTEL CORP

Inventor： HUTCHISON DAVID N ,  KIM KYU HYUN ,  RONG HAISHENG ,  HECK JOHN ,  XU SHENGBO

IPC: G01J3/18 ,  G01J3/02 ,  G01J3/20 ,  G01N21/27 ,  G02B6/12 ,  G02B6/122

CPC classification number: G02B6/4295 ,  G01J3/0218 ,  G01J3/0237 ,  G01J3/0259 ,  G01J3/0297 ,  G01J3/1809 ,  G01J3/1895 ,  G01J3/20 ,  G01J3/32 ,  G02B6/12033

Abstract: Techniques and mechanisms for a monolithic photonic integrated circuit (PIC) to provide spectrometry functionality. In an embodiment, the PIC comprises a photonic device, a first waveguide and a second waveguide, wherein one of the first waveguide and the second waveguide includes a released portion which is free to move relative to a substrate of the PIC. During a metering cycle to evaluate a material under test, control logic operates an actuator to successively configure a plurality of positions of the released portion relative to the photonic device. In another embodiment, light from the first waveguide is variously diffracted by a grating of the photonic device during the metering cycle, where portions of the light are directed into the second waveguide. Different wavelengths of light diffracted into the second waveguide may be successively detected, for different positions of the released portion, to determine spectrometric measurements over a range of wavelength.

公开(公告)号：EP3077860A4

公开(公告)日：2017-08-02

申请号：EP13898555

申请日：2013-12-03

Applicant: INTEL CORP

Inventor： HUTCHISON DAVID N ,  RONG HAISHENG ,  HECK JOHN

IPC: G02B6/12

CPC classification number: G02B6/422 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/12016 ,  G02B6/1203 ,  G02B6/12033 ,  G02B6/122 ,  G02B6/14 ,  G02B6/4208 ,  G02B6/4266

Abstract: A portion of an optical waveguide extending laterally within a photonic integrated circuit (PIC) chip is at least partially freed from the substrate to allow physical displacement of a released waveguide end relative to the substrate and relative to an adjacent photonic device also fabricated in the substrate. The released waveguide end may be displaced to modulate interaction between the photonic device and an optical mode propagated by the waveguide. In embodiments where the photonic device is an optical coupler, employing for example an Echelle grating or arrayed waveguide grating (AWG), mode propagation through the coupler may be modulated via physical displacement of the released waveguide end. In one such embodiment, thermal sensitivity of an integrated optical wavelength division multiplexer (WDM) is reduced by displacing the released waveguide end relative to the coupler in a manner that counters a temperature dependence of the optical coupler.

Abstract translation: 在光子集成电路（PIC）芯片内侧向延伸的光波导的一部分至少部分地从衬底释放，以允许释放的波导端相对于衬底和相对于同样制造在衬底中的相邻光子器件的物理位移 。 释放的波导端可以被移位以调制光子器件与由波导传播的光学模式之间的相互作用。 在其中光子器件是光学耦合器的实施例中，例如采用阶梯光栅或阵列波导光栅（AWG），通过耦合器的模式传播可以通过释放的波导端的物理位移来调制。 在一个这样的实施例中，通过以抵消光耦合器的温度依赖性的方式相对于耦合器移位释放的波导端来减小集成光学波分多路复用器（WDM）的热灵敏度。